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UCC27201ATDA2

Texas Instruments

UCC27201ATDA2 by Texas Instruments

UCC27201ATDA2 by Texas Instruments is a 10-terminal, 2-channel peripheral driver with built-in under voltage protection. It offers a max output current of 3A and uses a half-bridge based interface IC type. Ideal for applications requiring high-current drive capabilities in compact surface-mount designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,337 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,337

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-

-

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Vyrian

USA . 2,307 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

2,307

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,376 parts In-Stock

1+ parts

$4.232

100+ parts

-

1k+ parts

$4.668

10k+ parts

-

2,376

$4.232

-

$4.668

-

DigiPath Technology Company

USA . 1,407 parts In-Stock

1+ parts

$4.660

100+ parts

$4.287

1k+ parts

-

10k+ parts

-

1,407

$4.660

$4.287

-

-

ChromeModa Solutions

Germany . 1,967 parts In-Stock

1+ parts

$4.755

100+ parts

$3.899

1k+ parts

-

10k+ parts

-

1,967

$4.755

$3.899

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-

IDEA Electronic Components Group

UK . 491 parts In-Stock

1+ parts

$4.755

100+ parts

-

1k+ parts

$4.280

10k+ parts

-

491

$4.755

-

$4.280

-

AZTECH Wire

Italy . 243 parts In-Stock

1+ parts

$16.789

100+ parts

-

1k+ parts

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10k+ parts

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243

$16.789

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One Stop Electronics

USA . 1,398 parts In-Stock

1+ parts

$34.500

100+ parts

-

1k+ parts

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10k+ parts

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1,398

$34.500

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-

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Microchip USA

USA . 2,408 parts In-Stock

1+ parts

$53.780

100+ parts

$52.840

1k+ parts

$52.370

10k+ parts

$51.900

2,408

$53.780

$52.840

$52.370

$51.900

Corphita

USA . 2,783 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,783

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Overview

Experience unparalleled quality and reliability with the UCC27201ATDA2 by Texas Instruments, a leading manufacturer in the industry. This peripheral driver boasts built-in protections, making it a must-have for a wide range of applications. From robotics to industrial automation, this product offers unmatched value and benefits with its 3A maximum output current and 2 channels. Trust Texas Instruments to deliver high-performance solutions that exceed expectations. Elevate your projects with the UCC27201ATDA2 today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and secure mounting of the peripheral driver onto a PCB, saving space and simplifying the manufacturing process.

Maximum Output Current: 3 A

The high maximum output current of 3A ensures that the peripheral driver can power demanding peripherals or multiple devices simultaneously without overheating or failing.

Built-in Protections: UNDER VOLTAGE

The built-in under voltage protection feature helps prevent damage to the peripheral driver and connected devices in case of input voltage drops, enhancing reliability and longevity.

No. of Channels: 2

Having 2 channels allows the peripheral driver to control multiple peripherals independently, providing flexibility and versatility in system design.

Interface IC Type: HALF BRIDGE BASED PERIPHERAL DRIVER

The half bridge based interface IC type enables efficient and precise control of connected peripherals, making the product suitable for applications requiring accurate and reliable operation.

Technical Specifications

Peripheral Drivers UCC27201ATDA2 attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Built-in Protections:

UNDER VOLTAGE

Driver No. of Bits:

2

Input Characteristics:

STANDARD

JESD-30 Code:

R-XUUC-N10

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

10

Maximum Output Current:

3 A

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Surface Mount:

YES

Terminal Form:

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

UCC27201ATDA2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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