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UC3874N-2G4

Texas Instruments

UC3874N-2G4 by Texas Instruments

UC3874N-2G4 by Texas Instruments is a switching controller with 1A output current, 300 kHz max switching frequency, and 12-36V input voltage range. It utilizes pulse width modulation control technique for applications requiring efficient power regulation in commercial-grade electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,106 parts In-Stock

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Digiode

USA . 4,407 parts In-Stock

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4,407

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Distributors (Availability)

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One Stop Electronics

USA . 318 parts In-Stock

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$2.500

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318

$2.500

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Semicontronic

India . 1,359 parts In-Stock

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$4.500

100+ parts

$4.388

1k+ parts

$4.365

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1,359

$4.500

$4.388

$4.365

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Ampacity Inc.

Singapore . 461 parts In-Stock

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$6.500

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461

$6.500

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Parana Technologies

USA . 1,584 parts In-Stock

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$7.655

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$8.177

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1,584

$7.655

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$8.177

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DigiPath Technology Company

USA . 175 parts In-Stock

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$8.429

100+ parts

$7.755

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175

$8.429

$7.755

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ChromeModa Solutions

Germany . 6,771 parts In-Stock

1+ parts

$8.601

100+ parts

$7.053

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6,771

$8.601

$7.053

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IDEA Electronic Components Group

UK . 996 parts In-Stock

1+ parts

$8.601

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$8.171

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$7.741

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996

$8.601

$8.171

$7.741

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AZTECH Wire

Italy . 887 parts In-Stock

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$19.139

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887

$19.139

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Microchip USA

USA . 4,594 parts In-Stock

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Corphita

USA . 4,560 parts In-Stock

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Perfect Parts

USA . 504 parts In-Stock

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Corohmni

South Africa . 339 parts In-Stock

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Overview

Enhance your electronic designs with the high-quality UC3874N-2G4 switching regulator and controller by Texas Instruments. This versatile component, known for its reliability and efficiency, offers a wide range of applications in various industries. With Texas Instruments' reputation for innovation and excellence in semiconductor manufacturing, you can trust that the UC3874N-2G4 will deliver exceptional performance and durability. Experience the value and benefits of this top-of-the-line product, providing customers with superior power management solutions for their projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Package Shape: RECTANGULAR

Rectangular shape allows for easy mounting and placement in various applications.

No. of Terminals: 18

Having 18 terminals allows for flexibility in connections and functionality.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can reliably operate in various environments.

Control Mode: CURRENT-MODE

Current-mode control provides better loop stability and noise immunity, enhancing performance.

Maximum Output Current: 1 A

With a maximum output current of 1 A, the product can handle a decent load for various applications.

Nominal Input Voltage: 12 V

Operating at a nominal input voltage of 12 V makes it compatible with standard power sources.

Maximum Input Voltage: 36 V

Being able to handle a maximum input voltage of 36 V provides versatility in power supply options.

Technical Specifications

Switching Regulators & Controllers UC3874N-2G4 attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

36 V

Minimum Input Voltage:

12 V

Nominal Input Voltage:

12 V

JESD-30 Code:

R-PDIP-T18

JESD-609 Code:

e4

Length:

22.48 mm

No. of Functions:

1

No. of Terminals:

18

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Current:

1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP18,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

NO

Switcher Config:

PUSH-PULL

Maximum Switching Frequency:

300 kHz

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

UC3874N-2G4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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