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UC2902DG4

Texas Instruments

UC2902DG4 by Texas Instruments

UC2902DG4 by Texas Instruments is a Power Management IC with 8 terminals, VOLTAGE-MODE control mode, and BUCK-BOOST switcher config. It operates b/w -40 to 85 °C and supports power supply circuits in industrial applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,869 parts In-Stock

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Vyrian

USA . 4,345 parts In-Stock

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4,345

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EPE Components Inc.

USA . 11 parts In-Stock

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Bristol Electronics

USA . 11 parts In-Stock

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Parana Technologies

USA . 1,021 parts In-Stock

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$5.378

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$6.060

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$5.378

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$6.060

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DigiPath Technology Company

USA . 2,255 parts In-Stock

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$5.922

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$5.448

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$5.922

$5.448

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ChromeModa Solutions

Germany . 4,023 parts In-Stock

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$6.043

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$4.955

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4,023

$6.043

$4.955

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IDEA Electronic Components Group

UK . 908 parts In-Stock

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$6.043

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$5.439

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908

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One Stop Electronics

USA . 601 parts In-Stock

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$6.500

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$6.500

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AZTECH Wire

Italy . 648 parts In-Stock

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$6.568

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Corphita

USA . 3,158 parts In-Stock

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Perfect Parts

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Microchip USA

USA . 1,223 parts In-Stock

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Overview

Enhance your power management capabilities with the UC2902DG4 by Texas Instruments. As a leader in the industry, Texas Instruments ensures top-notch quality and reliability in their products. This power management IC is versatile and can be used in various applications, offering customers unmatched value and benefits. With its advanced features and efficiency, the UC2902DG4 is a game-changer in the Power Management IC category, providing users with seamless performance and peace of mind. Elevate your projects with the UC2902DG4 and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a cost-effective yet durable package for the IC, making it suitable for various applications.

Surface Mount: YES

Enables easy and efficient mounting on circuit boards, saving space and simplifying assembly processes.

Nominal Supply Voltage (Vsup): 5 V

Standard voltage level that is commonly used in many electronic devices, ensuring compatibility with a wide range of systems.

Power Supplies (V): 5

Provides multiple power supplies, offering flexibility and support for various power requirements within a single IC.

No. of Terminals: 8

Sufficient number of terminals for connecting to external components, enhancing the versatility and functionality of the IC.

Maximum Operating Temperature: 85 °C

Allows the IC to operate reliably in high-temperature environments, making it suitable for industrial applications.

Control Mode: VOLTAGE-MODE

Voltage-mode control provides precise regulation of output voltage, ensuring stable and efficient power delivery.

Minimum Operating Temperature: -40 °C

Capable of functioning in low-temperature conditions, making it suitable for a wide range of operating environments.

Technical Specifications

Power Management ICs UC2902DG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

Control Mode:

VOLTAGE-MODE

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

6 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

10 mA

Maximum Supply Voltage (Vsup):

20 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Switcher Config:

BUCK-BOOST

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+0.7V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

UC2902DG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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