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UC2544NG4

Texas Instruments

UC2544NG4 by Texas Instruments

The Texas Instruments UC2544NG4 is a Power Management IC with 18 terminals, operating b/w -25 to 85 °C. It supports supply voltages from 4.7V to 40V and has a max supply current of 15mA. Ideal for power supply support circuits in various applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,166 parts In-Stock

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Vyrian

USA . 3,017 parts In-Stock

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3,017

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Distributors (Availability)

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Ampacity Inc.

Singapore . 991 parts In-Stock

1+ parts

$2.500

100+ parts

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991

$2.500

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Semicontronic

India . 727 parts In-Stock

1+ parts

$4.500

100+ parts

$4.388

1k+ parts

$4.365

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727

$4.500

$4.388

$4.365

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One Stop Electronics

USA . 881 parts In-Stock

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$6.500

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881

$6.500

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Parana Technologies

USA . 1,616 parts In-Stock

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$10.691

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$11.180

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1,616

$10.691

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$11.180

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DigiPath Technology Company

USA . 1,038 parts In-Stock

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$11.772

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$10.830

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1,038

$11.772

$10.830

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ChromeModa Solutions

Germany . 4,277 parts In-Stock

1+ parts

$12.012

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$9.850

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4,277

$12.012

$9.850

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IDEA Electronic Components Group

UK . 2,369 parts In-Stock

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$12.012

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$11.411

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$10.811

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2,369

$12.012

$11.411

$10.811

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AZTECH Wire

Italy . 254 parts In-Stock

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$17.297

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Corphita

USA . 2,132 parts In-Stock

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Corohmni

South Africa . 341 parts In-Stock

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Overview

Power up your next project with the UC2544NG4 by Texas Instruments, a cutting-edge Power Management IC designed to provide reliable and efficient power supply support. Manufactured with top-quality materials and advanced technology, this product offers customers unparalleled performance and durability. Whether you're working on consumer electronics, industrial equipment, or automotive applications, the UC2544NG4 is sure to deliver the power you need. Trust Texas Instruments for all your power management needs and experience the difference in quality and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material helps in reducing the overall weight of the product, making it portable and easy to handle.

Nominal Supply Voltage (Vsup): 10 V

The nominal supply voltage of 10V ensures stable and efficient power supply to the device, leading to consistent performance.

Power Supplies (V): 4.5/40

With a wide range of power supplies from 4.5V to 40V, this product can be used in various applications with different voltage requirements.

No. of Terminals: 18

Having 18 terminals allows for multiple connections and interfaces, enabling versatile and complex power management configurations.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliability and stability even in harsh environmental conditions.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature of -25°C makes this product suitable for use in cold environments without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold as terminal finish enhances durability, conductivity, and resistance to corrosion, ensuring long-lasting performance.

Width (mm): 7.62 mm

The compact width of 7.62mm makes the product space-efficient and easy to integrate into various electronic devices.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the product efficient and reliable.

Maximum Supply Voltage (Vsup): 40 V

The high maximum supply voltage of 40V allows for compatibility with a wide range of power sources, enhancing the product's versatility.

Technical Specifications

Power Management ICs UC2544NG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDIP-T18

JESD-609 Code:

e4

Length:

22.48 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

18

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP18,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

4.5/40

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

15 mA

Maximum Supply Voltage (Vsup):

40 V

Minimum Supply Voltage (Vsup):

4.7 V

Nominal Supply Voltage (Vsup):

10 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

UC2544NG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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