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UC2543J

Texas Instruments

UC2543J by Texas Instruments

UC2543J by Texas Instruments is a Power Management IC with 16 terminals, operating voltage range of 4.5-40V, and CMOS technology. It has a rectangular package style, ceramic body material, and glass-sealed construction. Ideal for power supply support circuits in applications requiring voltages up to 40V.

Median Price

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Lifecycle Status

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6

In-Stock Inventory

1k+

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Vyrian

USA . 2,469 parts In-Stock

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Digiode

USA . 969 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 250 parts In-Stock

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Holdelec - ElecDif-Pro

France . 250 parts In-Stock

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ECAB

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Odintec Ltd.

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One Stop Electronics

USA . 1,003 parts In-Stock

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$5.500

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AZTECH Wire

Italy . 316 parts In-Stock

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Parana Technologies

USA . 2,306 parts In-Stock

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DigiPath Technology Company

USA . 71 parts In-Stock

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$20.936

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$19.261

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ChromeModa Solutions

Germany . 5,411 parts In-Stock

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IDEA Electronic Components Group

UK . 640 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Authorized Procurement Solutions

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Corphita

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Microchip USA

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Kepictronics

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Giza Technologies, Inc.

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Overview

Looking for a reliable and high-quality Power Management IC? Look no further than the UC2543J by Texas Instruments. With its ceramic, glass-sealed package and CMOS technology, this IC offers exceptional performance in a compact design. Whether you're working on power supply support circuits or other applications, the UC2543J provides a wide supply voltage range and dual terminals for flexibility. Trust Texas Instruments for top-notch products that deliver value and efficiency to your projects. Upgrade to the UC2543J today and experience the difference!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Ceramic and glass-sealed package provides durability and protection for the components inside, ensuring long-term reliability.

Nominal Supply Voltage (Vsup): 10 V

Suitable for a wide range of applications that require a 10V supply voltage.

Power Supplies (V): 4.5/40

Support for a wide range of power supplies from 4.5V to 40V, making it versatile for different setups.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures without performance degradation, suitable for demanding environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing efficiency and reliability.

Maximum Supply Current (Isup): 15 mA

Low supply current allows for efficient power management and reduced energy consumption.

Technical Specifications

Power Management ICs UC2543J attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.56 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

4.5/40

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

15 mA

Maximum Supply Voltage (Vsup):

40 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

10 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

2.5

Width (mm):

7.62 mm

Trade Compliance

UC2543J Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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