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UC1845J883B

Texas Instruments

UC1845J883B by Texas Instruments

UC1845J883B by Texas Instruments is a MIL-STD-883 Class B switching controller with current-mode control and pulse width modulation. It operates b/w -55 to 125 °C, supporting input voltages from 8.2V to 30V and output currents up to 1A. Ideal for military applications requiring efficient buck-boost switching regulators at frequencies up to 500 kHz.

Median Price

$12.600

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 200 parts In-Stock

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$12.600

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Vyrian

USA . 5,442 parts In-Stock

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Digiode

USA . 3,287 parts In-Stock

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Cyclops Electronics Ltd

UK . 26 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2 parts In-Stock

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Holdelec - ElecDif-Pro

France . 2 parts In-Stock

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Semicontronic

India . 485 parts In-Stock

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$0.500

100+ parts

$0.488

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$0.485

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485

$0.500

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One Stop Electronics

USA . 527 parts In-Stock

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$2.500

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527

$2.500

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Ampacity Inc.

Singapore . 515 parts In-Stock

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$3.500

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$3.500

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Parana Technologies

USA . 266 parts In-Stock

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$7.072

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$656.737

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$6.365

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$7.072

$656.737

$6.365

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DigiPath Technology Company

USA . 1,347 parts In-Stock

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$7.787

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$7.164

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ChromeModa Solutions

Germany . 3,687 parts In-Stock

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$7.946

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$6.516

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IDEA Electronic Components Group

UK . 1,152 parts In-Stock

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$7.946

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Corohmni

South Africa . 889 parts In-Stock

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Continental Prestige Electronics

USA . 6,552 parts In-Stock

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Netroflash

USA . 2,100 parts In-Stock

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AZTECH Wire

Italy . 1,423 parts In-Stock

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Lixinc

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Argo Parts USA

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Corphita

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Authorized Procurement Solutions

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Kepictronics

USA . 1,125 parts In-Stock

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Perfect Parts

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GreenTree Electronics

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Overview

Elevate your power management solutions with the UC1845J883B from Texas Instruments. This high-quality switching regulator & controller offers unparalleled reliability and performance, thanks to its MIL-STD-883 Class B screening level and military-grade temperature grade. Ideal for a wide range of applications, this product provides maximum output current of 1A, nominal input voltage of 15V, and control mode in current-mode. With its compact package style and advanced technology, the UC1845J883B delivers exceptional value and benefits to customers looking for efficient and reliable power control solutions. Trust Texas Instruments for top-of-the-line products that exceed expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The use of ceramic and glass-sealed materials ensures durability and reliability, making it a good choice for long-term use.

Screening Level: MIL-STD-883 Class B

This high screening level ensures consistency and quality in performance, making it a reliable option for critical applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and installation, making it a convenient choice for various projects.

No. of Terminals: 8

With 8 terminals, this product offers flexibility and compatibility with a wide range of circuits, making it versatile for different applications.

Package Style (Meter): IN-LINE

The in-line package style saves space and allows for neat and organized circuit layouts, making it efficient for compact designs.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can handle demanding environments and conditions, ensuring reliable performance in challenging situations.

Control Mode: CURRENT-MODE

The current-mode control mode provides accurate and efficient regulation of current, making it ideal for applications that require precise power management.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows for use in cold environments, making it suitable for a wide range of operating conditions.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish ensures good conductivity and solderability, making it a reliable choice for easy assembly and maintenance.

Terminal Position: DUAL

The dual terminal position offers flexibility in circuit connections, allowing for versatile configurations and setups.

Technical Specifications

Switching Regulators & Controllers UC1845J883B attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

30 V

Minimum Input Voltage:

8.2 V

Nominal Input Voltage:

15 V

JESD-30 Code:

R-GDIP-T8

JESD-609 Code:

e0

Length:

9.58 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Maximum Output Current:

1 A

Nominal Output Voltage:

5 V

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B

Maximum Seated Height:

5.08 mm

Sub-Category:

Switching Regulator or Controllers

Maximum Supply Current (Isup):

25 mA

Maximum Supply Voltage (Vsup):

30 V

Minimum Supply Voltage (Vsup):

12 V

Surface Mount:

NO

Switcher Config:

BUCK-BOOST

Maximum Switching Frequency:

500 kHz

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

7.62 mm

Trade Compliance

UC1845J883B Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-450-2209, 5962014502209

NIIN

014502209

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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