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UC1843L883B

Texas Instruments

UC1843L883B by Texas Instruments

UC1843L883B by Texas Instruments is a MIL-STD-883 Class B switching controller with current-mode control technique. It operates b/w -55 to 125 °C and supports a max output current of 1A at a switching frequency of up to 500 kHz. Ideal for military applications requiring efficient buck-boost regulation in compact spaces.

Median Price

$19.528

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Nova Conductors

Japan . 300 parts In-Stock

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$19.528

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Vyrian

USA . 5,250 parts In-Stock

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Digiode

USA . 3,367 parts In-Stock

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MISTER SPROCKETS

USA . 42 parts In-Stock

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Electronics Depot

USA . 3 parts In-Stock

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Sunrise Surplus Inc.

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Ampacity Inc.

Singapore . 285 parts In-Stock

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$2.500

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One Stop Electronics

USA . 133 parts In-Stock

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$6.500

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AZTECH Wire

Italy . 345 parts In-Stock

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$13.847

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Continental Prestige Electronics

USA . 546 parts In-Stock

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$19.137

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Parana Technologies

USA . 2,124 parts In-Stock

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$20.060

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$19.991

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DigiPath Technology Company

USA . 174 parts In-Stock

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$22.088

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$20.321

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ChromeModa Solutions

Germany . 3,472 parts In-Stock

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$22.539

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$18.482

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IDEA Electronic Components Group

UK . 1,936 parts In-Stock

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$22.539

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$21.412

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$20.285

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Lixinc

USA . 3,092 parts In-Stock

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Perfect Parts

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Authorized Procurement Solutions

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Corphita

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Argo Parts USA

USA . 864 parts In-Stock

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Overview

Experience unparalleled quality and reliability with the UC1843L883B by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch switching regulators & controllers like this one, perfect for a wide range of applications. This versatile chip carrier offers military-grade performance with a maximum output current of 1A and a control technique of pulse width modulation. With a wide operating temperature range and superior technology, the UC1843L883B provides customers with exceptional value and efficiency for their projects. Choose Texas Instruments for unmatched performance and innovation.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired package body material ensures durability and reliability in harsh operating environments.

Screening Level: MIL-STD-883 Class B

The MIL-STD-883 Class B screening level indicates high quality and reliability standards for military applications, making this product a suitable choice for critical operations.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C allows this product to function effectively in hot environments without compromising performance.

Control Mode: CURRENT-MODE

The current-mode control mode offers efficient and stable performance, making it ideal for applications where precise current regulation is required.

Maximum Output Current: 1 A

The high maximum output current of 1 ampere allows this product to support power-hungry devices or circuits, making it suitable for a wide range of applications.

Technical Specifications

Switching Regulators & Controllers UC1843L883B attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

30 V

Minimum Input Voltage:

8.2 V

Nominal Input Voltage:

15 V

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Maximum Output Current:

1 A

Nominal Output Voltage:

5 V

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B

Maximum Seated Height:

2.03 mm

Sub-Category:

Switching Regulator or Controllers

Maximum Supply Current (Isup):

25 mA

Maximum Supply Voltage (Vsup):

30 V

Minimum Supply Voltage (Vsup):

8.5 V

Surface Mount:

YES

Switcher Config:

BUCK-BOOST

Maximum Switching Frequency:

500 kHz

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width (mm):

8.89 mm

Trade Compliance

UC1843L883B Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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