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TUSB215RGYR

Texas Instruments

TUSB215RGYR by Texas Instruments

TUSB215RGYR by Texas Instruments is a BUS CONTROLLER with 14 terminals, operating at 0-70 °C. It supports data transfer rate up to 60.03 MBps and has a supply voltage range of 4.4-5.5 V. Ideal for I2C bus compatibility in various commercial applications due to its compact square shape and CMOS technology.

Median Price

$0.149

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,926 parts In-Stock

1+ parts

$0.149

100+ parts

$0.142

1k+ parts

$0.136

10k+ parts

-

2,926

$0.149

$0.142

$0.136

-

Texas Instruments

USA . 54,226 parts In-Stock

1+ parts

$3.200

100+ parts

$2.804

1k+ parts

$1.584

10k+ parts

-

54,226

$3.200

$2.804

$1.584

-

Verical

USA . 2,926 parts In-Stock

1+ parts

-

100+ parts

$0.142

1k+ parts

$0.136

10k+ parts

-

2,926

-

$0.142

$0.136

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,016 parts In-Stock

1+ parts

$0.142

100+ parts

-

1k+ parts

-

10k+ parts

-

4,016

$0.142

-

-

-

Vyrian

USA . 4,386 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,386

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,300 parts In-Stock

1+ parts

$0.134

100+ parts

-

1k+ parts

-

10k+ parts

-

4,300

$0.134

-

-

-

Component Stockers USA

USA . 5,337 parts In-Stock

1+ parts

$0.150

100+ parts

$0.140

1k+ parts

$0.130

10k+ parts

-

5,337

$0.150

$0.140

$0.130

-

AZTECH Wire

Italy . 625 parts In-Stock

1+ parts

$13.020

100+ parts

-

1k+ parts

-

10k+ parts

-

625

$13.020

-

-

-

Parana Technologies

USA . 2,166 parts In-Stock

1+ parts

$33.160

100+ parts

-

1k+ parts

$120.035

10k+ parts

-

2,166

$33.160

-

$120.035

-

DigiPath Technology Company

USA . 900 parts In-Stock

1+ parts

$36.513

100+ parts

$33.592

1k+ parts

-

10k+ parts

-

900

$36.513

$33.592

-

-

ChromeModa Solutions

Germany . 3,527 parts In-Stock

1+ parts

$37.258

100+ parts

$30.552

1k+ parts

-

10k+ parts

-

3,527

$37.258

$30.552

-

-

IDEA Electronic Components Group

UK . 309 parts In-Stock

1+ parts

$37.258

100+ parts

$35.395

1k+ parts

$33.532

10k+ parts

-

309

$37.258

$35.395

$33.532

-

Corohmni

South Africa . 650 parts In-Stock

1+ parts

$71.164

100+ parts

-

1k+ parts

-

10k+ parts

-

650

$71.164

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Overview

Upgrade your electronic devices with the TUSB215RGYR by Texas Instruments, a top-of-the-line bus controller designed for seamless data transfer at lightning-fast speeds. Manufactured with precision and quality in mind, this chip carrier boasts a range of applications and compatibility with I2C bus systems. With a maximum data transfer rate of 60.03 MBps and a low supply current, this commercial-grade device offers unparalleled performance and reliability. Experience the benefits of cutting-edge technology and elevate your projects to new heights with the TUSB215RGYR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the bus controller.

Surface Mount: YES

Easily integrates onto PCBs, saving space and simplifying assembly.

Maximum Supply Voltage: 5.5 V

Allows for a wide range of power supply options, ensuring compatibility with various systems.

Package Shape: SQUARE

Optimal shape for efficient layout and design integration on circuit boards.

No. of Terminals: 14

Provides sufficient connections for interfacing with other components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG

Enhances thermal performance, preventing overheating during operation.

Minimum Supply Voltage: 4.4 V

Works reliably even with lower voltage input, ensuring consistent performance.

Maximum Operating Temperature: 70 °C

Can withstand high temperatures, suitable for use in various environments.

Maximum Data Transfer Rate: 60.03 MBps

High data transfer rate enables fast and efficient communication between devices.

Minimum Operating Temperature: 0 °C

Capable of operating in cold conditions without performance issues.

Terminal Finish: MATTE TIN

Provides a reliable and corrosion-resistant finish for terminal connections.

Terminal Position: QUAD

Optimal terminal positioning for secure and stable connections.

Maximum Seated Height: 1 mm

Low profile design for compact and space-saving installations.

Width: 3.5 mm

Narrow width allows for efficient PCB layout and space utilization.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and bonding during assembly process.

Peak Reflow Temperature °C: 260

Supports high-temperature reflow soldering for robust connections.

Length: 3.5 mm

Compact length for fitting into tight spaces within electronic systems.

Temperature Grade: COMMERCIAL

Suitable for standard commercial applications with typical temperature ranges.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

Versatile bus controller for managing communication through USB interface.

Technology: CMOS

Utilizes low power consumption CMOS technology for efficient operation.

Terminal Form: NO LEAD

Lead-free terminal design for compliance with environmental regulations and standards.

Maximum Supply Current: 0.03 mA

Low current consumption for energy-efficient performance.

Nominal Supply Voltage: 5 V

Standard 5V supply voltage for universal compatibility.

Bus Compatibility: I2C

Supports I2C bus interface for seamless communication with compatible devices.

Terminal Pitch: 0.5 mm

Fine pitch spacing for precise connections and compact layout.

Moisture Sensitivity Level (MSL): 2

Moderate moisture sensitivity level for safe storage and handling.

Technical Specifications

Bus Controllers TUSB215RGYR attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Address Bus Width:

0

Bus Compatibility:

I2C

Maximum Data Transfer Rate:

60.03 MBps

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N14

JESD-609 Code:

e3

Length:

3.5 mm

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Current:

.03 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.4 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.5 mm

Trade Compliance

TUSB215RGYR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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