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TUSB1104IRNQT

Texas Instruments

TUSB1104IRNQT by Texas Instruments

TUSB1104IRNQT by Texas Instruments is a Line Driver with 2 functions, operating at 3.3V nominal voltage. It features differential output, nickel palladium gold terminal finish, and -40 to 85°C temperature range. Ideal for applications requiring high-speed data transmission in compact designs.

Median Price

$9.340

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 9,995 parts In-Stock

1+ parts

$7.527

100+ parts

$6.137

1k+ parts

$4.091

10k+ parts

-

9,995

$7.527

$6.137

$4.091

-

DigiKey

USA . 250 parts In-Stock

1+ parts

$9.340

100+ parts

$6.185

1k+ parts

$5.669

10k+ parts

$5.525

250

$9.340

$6.185

$5.669

$5.525

Mouser Electronics

USA . 229 parts In-Stock

1+ parts

$9.340

100+ parts

$6.180

1k+ parts

$5.520

10k+ parts

-

229

$9.340

$6.180

$5.520

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,597 parts In-Stock

1+ parts

$7.151

100+ parts

-

1k+ parts

-

10k+ parts

-

2,597

$7.151

-

-

-

Vyrian

USA . 3,828 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,828

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,625 parts In-Stock

1+ parts

$2.434

100+ parts

-

1k+ parts

$2.931

10k+ parts

-

1,625

$2.434

-

$2.931

-

DigiPath Technology Company

USA . 2,006 parts In-Stock

1+ parts

$2.680

100+ parts

$2.466

1k+ parts

-

10k+ parts

-

2,006

$2.680

$2.466

-

-

ChromeModa Solutions

Germany . 1,989 parts In-Stock

1+ parts

$2.735

100+ parts

$2.243

1k+ parts

-

10k+ parts

-

1,989

$2.735

$2.243

-

-

IDEA Electronic Components Group

UK . 346 parts In-Stock

1+ parts

$2.735

100+ parts

-

1k+ parts

$2.462

10k+ parts

-

346

$2.735

-

$2.462

-

Ampacity Inc.

Singapore . 3,372 parts In-Stock

1+ parts

$4.340

100+ parts

-

1k+ parts

-

10k+ parts

-

3,372

$4.340

-

-

-

Semicontronic

India . 3,212 parts In-Stock

1+ parts

$4.340

100+ parts

$4.232

1k+ parts

$4.210

10k+ parts

-

3,212

$4.340

$4.232

$4.210

-

Corohmni

South Africa . 171 parts In-Stock

1+ parts

$5.110

100+ parts

-

1k+ parts

-

10k+ parts

-

171

$5.110

-

-

-

Corphita

USA . 595 parts In-Stock

1+ parts

$6.774

100+ parts

-

1k+ parts

-

10k+ parts

-

595

$6.774

-

-

-

Overview

Enhance your electronic designs with the TUSB1104IRNQT by Texas Instruments, a high-quality line driver and receiver that offers unmatched reliability and performance. With advanced technology and precision engineering, Texas Instruments delivers cutting-edge solutions for various applications in the electronics industry. This versatile product provides customers with exceptional value, benefits, and advantages, making it the ideal choice for all your design needs. Upgrade your projects today with the TUSB1104IRNQT and experience the innovation and excellence that Texas Instruments is known for.

Feature Benefit Bullets

Mating Contact Pitch (inch): 0.1

Close contact pitch allows for efficient and compact connection of multiple components on a circuit board.

Body Length: 0.4 inch

Optimal body length for secure connection and space-saving design.

Insulation Resistance: 1000000000 ohm

High insulation resistance ensures reliable and safe electrical connections.

Termination Contact Finish: Matte Tin (Sn)

Matte tin finish provides good conductivity and corrosion resistance for long-lasting performance.

Connector Type: BOARD CONNECTOR

Specifically designed for board-to-board connections, ensuring compatibility and reliable signal transmission.

UL Flammability Code: 94V-0

UL 94V-0 rated for flame resistance, ensuring safety in case of overheating or short circuits.

Rated Current - Signal: 4 A

High signal current rating allows for efficient power transmission without risk of overheating.

Mounting Type: BOARD

Designed for easy and secure mounting on a circuit board, ensuring stability and reliability.

Contact Material: BRASS

Brass contact material provides excellent conductivity and durability for long-term use.

Contact Style: SQ PIN-SKT

Square pin socket contact style ensures a secure and stable connection with minimal signal loss.

Technical Specifications

Line Drivers & Receivers TUSB1104IRNQT attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

2

Maximum High Level Input Current:

.06 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

2

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

DIFFERENTIAL

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.16X25,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

TUSB1104IRNQT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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