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TUSB1002IRGER

Texas Instruments

TUSB1002IRGER by Texas Instruments

TUSB1002IRGER by Texas Instruments is a Line Transceiver IC with 2 functions, operating at -40 to 85°C. It features a 3.6V max supply voltage, differential input characteristics, and no-lead terminal form. Ideal for industrial applications requiring reliable communication over short distances in compact systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,937 parts In-Stock

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8,937

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Digiode

USA . 692 parts In-Stock

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692

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 153 parts In-Stock

1+ parts

$5.500

100+ parts

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153

$5.500

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Parana Technologies

USA . 2,277 parts In-Stock

1+ parts

$6.878

100+ parts

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$7.495

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2,277

$6.878

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$7.495

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DigiPath Technology Company

USA . 676 parts In-Stock

1+ parts

$7.573

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676

$7.573

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ChromeModa Solutions

Germany . 3,587 parts In-Stock

1+ parts

$7.728

100+ parts

$6.337

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3,587

$7.728

$6.337

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IDEA Electronic Components Group

UK . 541 parts In-Stock

1+ parts

$7.728

100+ parts

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$6.955

10k+ parts

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541

$7.728

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$6.955

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AZTECH Wire

Italy . 414 parts In-Stock

1+ parts

$19.104

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414

$19.104

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Corphita

USA . 4,196 parts In-Stock

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4,196

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Microchip USA

USA . 383 parts In-Stock

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383

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Overview

Experience seamless data transmission with the TUSB1002IRGER by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in their line drivers & receivers. This versatile product offers a wide range of applications, from industrial settings to consumer electronics. With its compact design and advanced features, customers can enjoy the benefits of efficient data transfer and enhanced performance. Upgrade your system with the TUSB1002IRGER and experience the value it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the components inside, ensuring a long lifespan for the product.

Surface Mount: YES

Being surface mountable makes it easy to integrate this product onto circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage of 3.6V allows for reliable operation in various power supply systems.

No. of Functions: 2

Having multiple functions in one product helps reduce the number of components needed in a circuit, simplifying design and reducing costs.

Package Shape: SQUARE

The square package shape is compact and can easily fit into tight spaces on a circuit board, improving overall board layout efficiency.

No. of Terminals: 24

With 24 terminals, this product offers multiple connection points for interfacing with other components or devices, enhancing versatility in circuit design.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles offer thermal management and space-saving benefits for improved performance.

Minimum Supply Voltage: 3 V

The low minimum supply voltage requirement of 3V ensures compatibility with a wide range of power sources, making it suitable for various applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand elevated temperature environments without compromising performance or reliability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows this product to function reliably in cold temperature conditions, expanding its range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring stable and reliable electrical connections.

Terminal Position: QUAD

The quad terminal position offers a robust and secure connection interface, minimizing the risk of signal loss or interference in data transmission.

Maximum Seated Height: 1 mm

The low maximum seated height of 1mm allows for a slim and compact design, ideal for applications where space is limited.

Width: 4 mm

The narrow width of 4mm enables easy integration into compact electronic devices or circuit layouts, optimizing space utilization.

Receiver No. of Bits: 2

With 2 receiver bits, this product can accurately receive and process digital data signals, ensuring reliable data transmission in communication systems.

Differential Output: YES

The differential output capability enhances noise immunity and signal integrity, making this product suitable for high-speed data transmission applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time allowance of 30 seconds at peak reflow temperature ensures proper soldering and assembly of the product during manufacturing.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C enables robust soldering connections, making the product suitable for harsh operating environments.

Length: 4 mm

The compact length of 4mm contributes to a space-saving design, providing flexibility in circuit board layout and device integration.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product meets stringent performance and reliability standards, making it suitable for demanding operational environments.

Terminal Form: NO LEAD

The no-lead terminal form reduces the risk of lead contamination and environmental hazards, ensuring compliance with industry regulations and standards.

Input Characteristics: DIFFERENTIAL

The differential input characteristics allow for high-speed and noise-immune signal transmission, improving overall system performance and reliability.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage offers compatibility with standard power sources, ensuring ease of integration into existing electronic systems.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm enables high-density mounting on circuit boards, facilitating miniaturization and improving overall system performance.

Driver No. of Bits: 2

Featuring 2 driver bits, this product can efficiently transmit digital data signals, enhancing the speed and accuracy of data communication in electronic systems.

Interface IC Type: LINE TRANSCEIVER

As a line transceiver, this product serves as an interface between different communication lines, enabling seamless data exchange and compatibility between diverse systems.

Technical Specifications

Line Drivers & Receivers TUSB1002IRGER attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

2

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Receiver No. of Bits:

2

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

TUSB1002IRGER Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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