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TUSB1002AIRGER

Texas Instruments

TUSB1002AIRGER by Texas Instruments

TUSB1002AIRGER by Texas Instruments is a Line Transceiver IC with 2 functions, operating at 3.3V nominal voltage. It features differential input characteristics and offers differential output with a max transmit delay of 0.15ns. Ideal for applications requiring high-speed data transmission in commercial temperature grades.

Median Price

$6.200

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,135 parts In-Stock

1+ parts

$4.563

100+ parts

$3.998

1k+ parts

$2.259

10k+ parts

-

3,135

$4.563

$3.998

$2.259

-

DigiKey

USA . 2,804 parts In-Stock

1+ parts

$6.200

100+ parts

$4.000

1k+ parts

$3.604

10k+ parts

$3.489

2,804

$6.200

$4.000

$3.604

$3.489

Mouser Electronics

USA . 2,262 parts In-Stock

1+ parts

$7.440

100+ parts

$4.680

1k+ parts

$3.680

10k+ parts

$3.480

2,262

$7.440

$4.680

$3.680

$3.480

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,213 parts In-Stock

1+ parts

$4.335

100+ parts

-

1k+ parts

-

10k+ parts

-

4,213

$4.335

-

-

-

Chip Stock

USA . 38,000 parts In-Stock

1+ parts

-

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38,000

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Vyrian

USA . 6,657 parts In-Stock

1+ parts

-

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6,657

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-

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ComSIT Distribution GmbH

Germany . 3 parts In-Stock

1+ parts

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3

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 2,488 parts In-Stock

1+ parts

$2.930

100+ parts

$2.780

1k+ parts

$2.690

10k+ parts

-

2,488

$2.930

$2.780

$2.690

-

Corphita

USA . 1,394 parts In-Stock

1+ parts

$4.107

100+ parts

-

1k+ parts

-

10k+ parts

-

1,394

$4.107

-

-

-

Parana Technologies

USA . 2,350 parts In-Stock

1+ parts

$8.244

100+ parts

-

1k+ parts

$8.858

10k+ parts

-

2,350

$8.244

-

$8.858

-

DigiPath Technology Company

USA . 832 parts In-Stock

1+ parts

$9.078

100+ parts

-

1k+ parts

-

10k+ parts

-

832

$9.078

-

-

-

ChromeModa Solutions

Germany . 3,350 parts In-Stock

1+ parts

$9.263

100+ parts

$7.596

1k+ parts

-

10k+ parts

-

3,350

$9.263

$7.596

-

-

IDEA Electronic Components Group

UK . 730 parts In-Stock

1+ parts

$9.263

100+ parts

$8.800

1k+ parts

$8.337

10k+ parts

-

730

$9.263

$8.800

$8.337

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Futuretech Components

Singapore . 9,000 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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9,000

-

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Technoshack Inc. (Excess)

Canada . 5,400 parts In-Stock

1+ parts

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5,400

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

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5,000

-

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A-Z Elektronik GmbH

Germany . 5,000 parts In-Stock

1+ parts

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5,000

-

-

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iodParts Technologies Inc.

India . 100 parts In-Stock

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100

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Lixinc

USA . 1 parts In-Stock

1+ parts

-

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1

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Overview

Experience unparalleled quality and reliability with the TUSB1002AIRGER by Texas Instruments, a leading manufacturer in the industry. This line driver and receiver offers exceptional performance in various applications, making it the perfect choice for your needs. With its innovative design and top-notch features, this product provides unmatched value and benefits to customers. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, increasing flexibility in usage.

No. of Functions: 2

Having multiple functions in one device simplifies circuit design and reduces the number of components needed.

Package Shape: SQUARE

The square package shape allows for efficient use of board space, especially in tight layouts.

Maximum Transmit Delay: 0.15 ns

The low maximum transmit delay ensures fast signal transmission, making the product suitable for high-speed applications.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature range allows for reliable performance in various environmental conditions.

Technical Specifications

Line Drivers & Receivers TUSB1002AIRGER attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

2

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

2

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Receive Delay:

.15 ns

Receiver No. of Bits:

2

Maximum Seated Height:

1 mm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

.15 ns

Width:

4 mm

Trade Compliance

TUSB1002AIRGER Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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