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TSC2008IYZGT

Texas Instruments

TSC2008IYZGT by Texas Instruments

TSC2008IYZGT by Texas Instruments is a consumer IC with 12 terminals in a rectangular grid array package. It operates b/w -40 to 85°C, with supply voltage ranging from 1.2V to 3.6V. This CMOS technology IC is ideal for industrial applications requiring precise consumer circuit functionality at a very thin profile and fine pitch design.

Median Price

$4.694

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,200 parts In-Stock

1+ parts

$4.694

100+ parts

$4.113

1k+ parts

$2.324

10k+ parts

-

3,200

$4.694

$4.113

$2.324

-

Mouser Electronics

USA . 250 parts In-Stock

1+ parts

$9.200

100+ parts

$5.330

1k+ parts

$4.020

10k+ parts

-

250

$9.200

$5.330

$4.020

-

Rochester

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$3.710

1k+ parts

$3.320

10k+ parts

$3.120

500

-

$3.710

$3.320

$3.120

DigiKey

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$4.880

1k+ parts

-

10k+ parts

-

500

-

$4.880

-

-

Verical

USA . 250 parts In-Stock

1+ parts

-

100+ parts

$4.638

1k+ parts

$4.150

10k+ parts

$3.900

250

-

$4.638

$4.150

$3.900

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,996 parts In-Stock

1+ parts

$3.068

100+ parts

-

1k+ parts

-

10k+ parts

-

1,996

$3.068

-

-

-

Vyrian

USA . 5,095 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,095

-

-

-

-

DigiKey Marketplace

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 500 parts In-Stock

1+ parts

$2.740

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$2.740

-

-

-

Corphita

USA . 4,751 parts In-Stock

1+ parts

$2.907

100+ parts

-

1k+ parts

-

10k+ parts

-

4,751

$2.907

-

-

-

Parana Technologies

USA . 1,371 parts In-Stock

1+ parts

$3.507

100+ parts

-

1k+ parts

$4.031

10k+ parts

-

1,371

$3.507

-

$4.031

-

DigiPath Technology Company

USA . 2,223 parts In-Stock

1+ parts

$3.861

100+ parts

$3.552

1k+ parts

-

10k+ parts

-

2,223

$3.861

$3.552

-

-

ChromeModa Solutions

Germany . 4,604 parts In-Stock

1+ parts

$3.940

100+ parts

$3.231

1k+ parts

-

10k+ parts

-

4,604

$3.940

$3.231

-

-

IDEA Electronic Components Group

UK . 1,710 parts In-Stock

1+ parts

$3.940

100+ parts

-

1k+ parts

$3.546

10k+ parts

-

1,710

$3.940

-

$3.546

-

Microchip USA

USA . 1,787 parts In-Stock

1+ parts

$28.230

100+ parts

$28.050

1k+ parts

$27.970

10k+ parts

$27.880

1,787

$28.230

$28.050

$27.970

$27.880

A-Z Elektronik GmbH

Germany . 6,233 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,233

-

-

-

-

Assy Fe

Spain . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Kepictronics

USA . 155 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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155

-

-

-

-

Overview

Enhance your consumer electronics with the high-quality TSC2008IYZGT by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers reliable solutions for various applications. This surface-mount IC offers exceptional value, providing precise power supplies and advanced performance. With a compact design and industrial-grade temperature range, the TSC2008IYZGT is the ideal choice for your next project. Upgrade your products with this cutting-edge technology and experience the advantages it brings to your customers.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly on circuit boards, making this product suitable for automated manufacturing processes.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact design, saving space on the circuit board and enabling high-density integration of components.

Power Supplies (V): 1.2/3.6

Wide range of power supply voltages allows for versatile usage in various electronic devices that operate within this voltage range.

No. of Terminals: 12

Sufficient number of terminals for connecting to other components and peripherals, offering flexibility in circuit design.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in demanding industrial environments.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the product energy-efficient and reliable in digital circuits.

Technical Specifications

Other Function Consumer ICs TSC2008IYZGT attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-XBGA-B12

JESD-609 Code:

e1

Length:

2.295 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

BGA12,3X4,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.6

Qualification:

Not Qualified

Maximum Seated Height:

.625 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.795 mm

Trade Compliance

TSC2008IYZGT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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