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TSC2004IYZKT

Texas Instruments

TSC2004IYZKT by Texas Instruments

TSC2004IYZKT by Texas Instruments is a 24-terminal consumer IC with power supplies of 1.2-3.6V, operating temperature range of -40 to 85°C, and CMOS technology. It features a square package shape, grid array style with very thin profile, and ball terminal form. Ideal for industrial applications requiring precise consumer circuit functionality in compact designs.

Median Price

$3.950

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,500 parts In-Stock

1+ parts

$4.969

100+ parts

$4.354

1k+ parts

$2.460

10k+ parts

-

1,500

$4.969

$4.354

$2.460

-

Rochester

USA . 7,750 parts In-Stock

1+ parts

-

100+ parts

$3.080

1k+ parts

$2.750

10k+ parts

$2.590

7,750

-

$3.080

$2.750

$2.590

DigiKey

USA . 7,750 parts In-Stock

1+ parts

-

100+ parts

$4.050

1k+ parts

-

10k+ parts

-

7,750

-

$4.050

-

-

Verical

USA . 7,750 parts In-Stock

1+ parts

-

100+ parts

$3.850

1k+ parts

$3.438

10k+ parts

$3.237

7,750

-

$3.850

$3.438

$3.237

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 375 parts In-Stock

1+ parts

$3.249

100+ parts

-

1k+ parts

-

10k+ parts

-

375

$3.249

-

-

-

Vyrian

USA . 6,534 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,534

-

-

-

-

Bristol Electronics

USA . 4,326 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,326

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,599 parts In-Stock

1+ parts

$0.512

100+ parts

-

1k+ parts

$1.630

10k+ parts

-

1,599

$0.512

-

$1.630

-

DigiPath Technology Company

USA . 511 parts In-Stock

1+ parts

$0.564

100+ parts

$0.518

1k+ parts

-

10k+ parts

-

511

$0.564

$0.518

-

-

ChromeModa Solutions

Germany . 4,616 parts In-Stock

1+ parts

$0.575

100+ parts

$0.472

1k+ parts

-

10k+ parts

-

4,616

$0.575

$0.472

-

-

IDEA Electronic Components Group

UK . 1,422 parts In-Stock

1+ parts

$0.575

100+ parts

-

1k+ parts

$0.518

10k+ parts

-

1,422

$0.575

-

$0.518

-

Corphita

USA . 4,103 parts In-Stock

1+ parts

$3.078

100+ parts

-

1k+ parts

-

10k+ parts

-

4,103

$3.078

-

-

-

Component Stockers USA

USA . 8,998 parts In-Stock

1+ parts

$3.450

100+ parts

$3.240

1k+ parts

$2.930

10k+ parts

-

8,998

$3.450

$3.240

$2.930

-

A-Z Elektronik GmbH

Germany . 6,305 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,305

-

-

-

-

Authorized Procurement Solutions

USA . 4,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,500

-

-

-

-

iodParts Technologies Inc.

India . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Kepictronics

USA . 163 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

163

-

-

-

-

Overview

Experience the superior quality and reliability of Texas Instruments with the TSC2004IYZKT, a cutting-edge consumer IC that offers unparalleled performance in a compact square package. Ideal for a variety of applications, this advanced technology provides customers with unmatched value and benefits. From its high-quality construction to its wide operating temperature range, this innovative product is sure to exceed your expectations. Trust Texas Instruments for all your electronic needs and discover the difference that quality makes.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making this product suitable for automated manufacturing processes.

Package Shape: SQUARE

The square package shape provides a compact footprint, making it ideal for applications where space is limited.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer electronics, this IC is optimized for performance and efficiency in consumer applications.

Power Supplies (V): 1.2/3.6

Support for a wide range of power supplies allows for greater flexibility in designing and implementing circuits.

No. of Terminals: 24

A higher number of terminals provides more connectivity options, enhancing the versatility of the product.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style ensures high density mounting, thin profile saves space, and fine pitch allows for precise connections, making it suitable for compact devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand a wide range of environmental conditions, increasing its reliability.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes this IC suitable for use in a variety of environments, including industrial settings.

Terminal Finish: TIN SILVER COPPER

The triple terminal finish provides enhanced durability and conductivity, ensuring reliable connections over time.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier PCB layout and soldering, improving the overall assembly process.

Maximum Seated Height: 0.625 mm

A low seated height allows for a slimmer profile, making this product suitable for thin and compact devices.

Width: 2.795 mm

The compact width of the IC makes it suitable for applications where space is limited.

Minimum Supply Voltage (Vsup): 1.2 V

Low minimum supply voltage requirements enable energy-efficient operation, making it ideal for portable and battery-powered devices.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature ensures proper soldering and reliability during the assembly process.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this IC can withstand the heat of the soldering process, ensuring a secure connection.

Length: 2.795 mm

The compact length of the IC makes it suitable for applications where space is limited.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this IC can withstand harsh environments and operate reliably in demanding conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this IC efficient and reliable for consumer electronics.

Terminal Form: BALL

Ball terminal form facilitates reliable connections and supports high-speed data transfer, making this IC suitable for advanced consumer devices.

Terminal Pitch: 0.5 mm

A small terminal pitch allows for high-density mounting and precise connections, making this IC suitable for compact devices.

Maximum Supply Voltage (Vsup): 3.6 V

Support for a high maximum supply voltage allows for compatibility with a wide range of power sources, enhancing the versatility of the product.

Technical Specifications

Other Function Consumer ICs TSC2004IYZKT attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-XBGA-B24

JESD-609 Code:

e1

Length:

2.795 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

BGA24,5X5,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.6

Qualification:

Not Qualified

Maximum Seated Height:

.625 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.795 mm

Trade Compliance

TSC2004IYZKT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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