Loading...

TSB82AA2ZGW

Texas Instruments

TSB82AA2ZGW by Texas Instruments

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 176; Package Code: LFBGA; Package Shape: SQUARE;

Median Price

$10.880

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 7,955 parts In-Stock

1+ parts

-

100+ parts

$9.410

1k+ parts

$8.420

10k+ parts

$7.930

7,955

-

$9.410

$8.420

$7.930

DigiKey

USA . 7,955 parts In-Stock

1+ parts

-

100+ parts

$10.880

1k+ parts

-

10k+ parts

-

7,955

-

$10.880

-

-

Verical

USA . 6,547 parts In-Stock

1+ parts

-

100+ parts

$11.762

1k+ parts

$10.525

10k+ parts

$9.912

6,547

-

$11.762

$10.525

$9.912

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,445 parts In-Stock

1+ parts

$9.937

100+ parts

-

1k+ parts

-

10k+ parts

-

1,445

$9.937

-

-

-

Vyrian

USA . 2,455 parts In-Stock

1+ parts

$10.460

100+ parts

-

1k+ parts

-

10k+ parts

-

2,455

$10.460

-

-

-

Prism Electronics

USA . 23 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

23

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 968 parts In-Stock

1+ parts

$9.414

100+ parts

-

1k+ parts

-

10k+ parts

-

968

$9.414

-

-

-

Vigor

Singapore . 8,293 parts In-Stock

1+ parts

$10.040

100+ parts

-

1k+ parts

-

10k+ parts

-

8,293

$10.040

-

-

-

Parana Technologies

USA . 2,241 parts In-Stock

1+ parts

$72.156

100+ parts

-

1k+ parts

-

10k+ parts

-

2,241

$72.156

-

-

-

DigiPath Technology Company

USA . 57 parts In-Stock

1+ parts

$79.453

100+ parts

-

1k+ parts

-

10k+ parts

-

57

$79.453

-

-

-

ChromeModa Solutions

Germany . 2,224 parts In-Stock

1+ parts

$81.074

100+ parts

$66.481

1k+ parts

-

10k+ parts

-

2,224

$81.074

$66.481

-

-

IDEA Electronic Components Group

UK . 386 parts In-Stock

1+ parts

$81.074

100+ parts

$77.020

1k+ parts

$72.967

10k+ parts

-

386

$81.074

$77.020

$72.967

-

Microchip USA

USA . 361 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

361

-

-

-

-

Perfect Parts

USA . 167 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

167

-

-

-

-

GreenTree Electronics

Israel . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Technical Specifications

Serial Communication Controllers TSB82AA2ZGW attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 5V SUPPLY

Address Bus Width:

64

Boundary Scan:

NO

Bus Compatibility:

PCI

Maximum Clock Frequency:

33 MHz

Communication Protocol:

IEEE1394B

Maximum Data Transfer Rate:

100 MBps

External Data Bus Width:

64

JESD-30 Code:

S-PBGA-B176

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

2

No. of Serial I/Os:

1

No. of Terminals:

176

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA176,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Trade Compliance

TSB82AA2ZGW Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 11