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TSB82AA2BPGEG4

Texas Instruments

TSB82AA2BPGEG4 by Texas Instruments

TSB82AA2BPGEG4 by Texas Instruments is a Serial Communication Controller with 144 terminals, operating at 3.3V, supporting data transfer rates up to 100 MBps. It is ideal for PCI bus compatibility and low power mode applications in commercial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,738 parts In-Stock

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3,738

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Vyrian

USA . 3,220 parts In-Stock

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3,220

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 509 parts In-Stock

1+ parts

$8.000

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-

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509

$8.000

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AZTECH Wire

Italy . 198 parts In-Stock

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$10.181

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198

$10.181

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Parana Technologies

USA . 594 parts In-Stock

1+ parts

$67.368

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594

$67.368

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ChromeModa Solutions

Germany . 2,751 parts In-Stock

1+ parts

$75.694

100+ parts

$62.069

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2,751

$75.694

$62.069

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IDEA Electronic Components Group

UK . 525 parts In-Stock

1+ parts

$75.694

100+ parts

$71.909

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$68.125

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525

$75.694

$71.909

$68.125

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DigiPath Technology Company

USA . 934 parts In-Stock

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$68.246

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934

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$68.246

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Corphita

USA . 612 parts In-Stock

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Overview

Looking for a reliable Serial Communication Controller? Look no further than the TSB82AA2BPGEG4 by Texas Instruments. With a reputation for superior quality and cutting-edge technology, Texas Instruments delivers top-notch products that meet the highest standards. The TSB82AA2BPGEG4 is perfect for a wide range of applications, offering lightning-fast data transfer rates and low power consumption. Trust Texas Instruments to provide you with the best solutions for all your communication needs. Elevate your projects with the TSB82AA2BPGEG4 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the controller, ensuring long-term reliability.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for flexibility in power source options without risk of damaging the controller.

Maximum Data Transfer Rate: 100 MBps

High data transfer rate enables quick and efficient communication between devices, making it suitable for high-speed applications.

Maximum Clock Frequency: 33 MHz

The high clock frequency allows for fast data processing and response times, ideal for time-sensitive operations.

Bus Compatibility: PCI

Compatibility with the PCI bus standard ensures easy integration with a wide range of devices and systems, enhancing connectivity options.

Low Power Mode: YES

The presence of a low power mode helps in reducing energy consumption and extending battery life, making it an efficient and eco-friendly choice.

Technical Specifications

Serial Communication Controllers TSB82AA2BPGEG4 attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

NETWORK PROTOCOL= IEEE1394B

Address Bus Width:

0

Boundary Scan:

NO

Bus Compatibility:

PCI

Maximum Clock Frequency:

33 MHz

Communication Protocol:

ASYNC, BIT

Maximum Data Transfer Rate:

100 MBps

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of Serial I/Os:

1

No. of Terminals:

144

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Trade Compliance

TSB82AA2BPGEG4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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