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TSB81BA3PFP

Texas Instruments

TSB81BA3PFP by Texas Instruments

TSB81BA3PFP by Texas Instruments is a 6-bit line driver with differential output, suitable for IEEE 1394 interface applications. It operates b/w -40 to +70°C, with a supply voltage range of 1.85-3.6V and max output low current of 4A. The package style is flatpack with gull wing terminals, measuring 12x12mm in size.

Median Price

$10.538

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

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Farnell

UK . 9 parts In-Stock

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$10.300

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Rochester

USA . 678 parts In-Stock

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$8.620

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$7.710

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$7.260

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$7.260

DigiKey

USA . 678 parts In-Stock

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$11.340

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Verical

USA . 666 parts In-Stock

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$10.775

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$9.637

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$9.075

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$9.075

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Digiode

USA . 1,509 parts In-Stock

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$9.092

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Bristol Electronics

USA . 108 parts In-Stock

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$11.280

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$6.768

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Vyrian

USA . 7,287 parts In-Stock

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Legend Electronics Inc.

USA . 744 parts In-Stock

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Prism Electronics

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Microfarads

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ComSIT Distribution GmbH

Germany . 182 parts In-Stock

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Dan-Mar Components

USA . 108 parts In-Stock

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Inland Empire Components Inc.

USA . 96 parts In-Stock

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Connector Distribution Corp

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Right Parts Inc.

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Semi Source

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Semtec, LLC

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M&R Communications

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Distributors (Availability)

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Component Stockers USA

USA . 3,636 parts In-Stock

1+ parts

$2.230

100+ parts

$2.120

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$2.050

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3,636

$2.230

$2.120

$2.050

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Corphita

USA . 159 parts In-Stock

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$8.613

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Parana Technologies

USA . 1,601 parts In-Stock

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$11.661

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$12.055

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$11.661

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$12.055

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ChromeModa Solutions

Germany . 6,940 parts In-Stock

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$13.102

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$10.744

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$13.102

$10.744

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IDEA Electronic Components Group

UK . 1,020 parts In-Stock

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$13.102

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$12.447

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$11.792

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$13.102

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$11.792

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Microchip USA

USA . 1,149 parts In-Stock

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$22.230

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$22.090

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$22.020

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$21.950

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Authorized Procurement Solutions

USA . 49,330 parts In-Stock

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Lixinc

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Kepictronics

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A-Z Elektronik GmbH

Germany . 6,908 parts In-Stock

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Assy Fe

Spain . 1,265 parts In-Stock

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DigiPath Technology Company

USA . 708 parts In-Stock

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$11.813

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GreenTree Electronics

Israel . 180 parts In-Stock

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Overview

Discover the power of seamless communication with the TSB81BA3PFP by Texas Instruments. As a leading manufacturer in line drivers & receivers, Texas Instruments delivers unparalleled quality and reliability in their products. This versatile device is perfect for a wide range of applications, providing users with a high-performance solution that guarantees smooth operation. Say goodbye to connectivity issues and hello to superior performance with the TSB81BA3PFP. Upgrade your systems today and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time during assembly.

Maximum Supply Voltage: 2.05 V

Operates within a safe voltage range, preventing damage to the product.

No. of Functions: 6

Offers multiple functions in a single device, reducing the need for multiple components and simplifying circuit design.

Package Shape: SQUARE

Facilitates easy placement on the circuit board and efficient use of space.

Power Supplies (V): 3.3

Operates at a standard power supply voltage, ensuring compatibility with a wide range of systems.

No. of Terminals: 80

Provides multiple connection points for versatile integration into various circuit configurations.

Maximum Seated Height: 1.2 mm

Low profile design allows for space-saving installation in compact electronic devices.

Maximum Output Low Current: 4 Amp

Delivers high output current capability, making it suitable for driving demanding loads.

Receiver No. of Bits: 6

Provides high precision signal reception and processing for accurate data transmission.

Differential Output: YES

Ensures noise immunity and signal integrity in data transmission, especially over long distances.

Input Characteristics: DIFFERENTIAL

Supports differential signaling for improved noise rejection and signal quality.

Technology: CMOS

Utilizes low power consumption and high noise immunity characteristics of CMOS technology for efficient operation.

Maximum Receive Delay: 0 ns

Enables real-time data reception and processing, crucial for time-sensitive applications.

Interface Standard: IEEE 1394

Complies with industry standard interface specifications for seamless integration with compatible devices.

Technical Specifications

Line Drivers & Receivers TSB81BA3PFP attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

6

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

IEEE 1394

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

6

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

.172 V

Maximum Output Low Current:

4 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP80,.55SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

6

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

2.05 V

Minimum Supply Voltage:

1.85 V

Nominal Supply Voltage:

1.95 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Trade Compliance

TSB81BA3PFP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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