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TSB81BA3EIPFP

Texas Instruments

TSB81BA3EIPFP by Texas Instruments

TSB81BA3EIPFP by Texas Instruments is a Line Driver & Receiver with 80 terminals, operating at -40 to 85°C. It features differential output, complementary polarity, and 6-bit driver/receiver. Ideal for industrial applications requiring high-speed data transmission in tight spaces with minimal power consumption.

Median Price

$5.960

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 21 parts In-Stock

1+ parts

-

100+ parts

$5.960

1k+ parts

$5.372

10k+ parts

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21

-

$5.960

$5.372

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Distributors (In-Stock)

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Bristol Electronics

USA . 11 parts In-Stock

1+ parts

$24.000

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11

$24.000

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Digiode

USA . 4,088 parts In-Stock

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4,088

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Vyrian

USA . 4,024 parts In-Stock

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4,024

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Chip Stock

USA . 278 parts In-Stock

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278

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 13 parts In-Stock

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13

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,463 parts In-Stock

1+ parts

$4.067

100+ parts

-

1k+ parts

$4.531

10k+ parts

-

1,463

$4.067

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$4.531

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DigiPath Technology Company

USA . 741 parts In-Stock

1+ parts

$4.479

100+ parts

$4.120

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-

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741

$4.479

$4.120

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ChromeModa Solutions

Germany . 1,538 parts In-Stock

1+ parts

$4.570

100+ parts

$3.747

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-

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1,538

$4.570

$3.747

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IDEA Electronic Components Group

UK . 1,107 parts In-Stock

1+ parts

$4.570

100+ parts

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$4.113

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1,107

$4.570

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$4.113

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AZTECH Wire

Italy . 727 parts In-Stock

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$9.585

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727

$9.585

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Microchip USA

USA . 1,502 parts In-Stock

1+ parts

$11.520

100+ parts

$11.450

1k+ parts

$11.410

10k+ parts

$11.380

1,502

$11.520

$11.450

$11.410

$11.380

One Stop Electronics

USA . 169 parts In-Stock

1+ parts

$41.500

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169

$41.500

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Lixinc

USA . 5,776 parts In-Stock

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5,776

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A-Z Elektronik GmbH

Germany . 5,621 parts In-Stock

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5,621

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Corphita

USA . 2,748 parts In-Stock

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2,748

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Kepictronics

USA . 803 parts In-Stock

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803

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Overview

Enhance your electronic designs with the TSB81BA3EIPFP by Texas Instruments, a top-tier manufacturer known for delivering high-quality products. This line driver & receiver offers unparalleled performance and reliability in various applications. With its advanced features and innovative design, this product provides value, benefits, and advantages to customers looking for superior connectivity solutions. Trust Texas Instruments to elevate your projects to new heights with the TSB81BA3EIPFP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and reliability to the product, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Allows for easy installation and integration into circuit boards, saving time and effort during manufacturing.

No. of Functions: 3

Offers multiple functions in a single device, maximizing functionality and efficiency in electronic systems.

Maximum Supply Voltage-1: 3.6 V

Supports a wide range of supply voltages, making it versatile for different power requirements in applications.

Output Characteristics: DIFFERENTIAL

Provides differential output signals for improved noise immunity and signal integrity, essential in high-speed communication systems.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in harsh industrial environments with temperature fluctuations, ensuring consistent performance in demanding conditions.

Interface IC Type: LINE TRANSCEIVER

Specifically designed for interfacing between different communication lines, enabling seamless data transmission and reception in various systems.

Technical Specifications

Line Drivers & Receivers TSB81BA3EIPFP attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

6

Interface IC Type:

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

3

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

.172 V

Output Characteristics:

DIFFERENTIAL

Maximum Output Low Current:

4 Amp

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP80,.55SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

6

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

150 mA

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Trade Compliance

TSB81BA3EIPFP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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