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TSB81BA3IPFPEP

Texas Instruments

TSB81BA3IPFPEP by Texas Instruments

TSB81BA3IPFPEP by Texas Instruments is a Line Driver & Receiver with 6 functions, operating at -40 to 85°C. It features a max supply voltage of 3.6V, differential output, and interface standard IEEE 1394. Ideal for industrial applications requiring high-speed data transmission in compact spaces.

Median Price

$23.546

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 89 parts In-Stock

1+ parts

$25.720

100+ parts

$20.260

1k+ parts

$17.320

10k+ parts

$16.500

89

$25.720

$20.260

$17.320

$16.500

Avnet

USA . 35 parts In-Stock

1+ parts

-

100+ parts

$21.371

1k+ parts

$19.179

10k+ parts

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35

-

$21.371

$19.179

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,800 parts In-Stock

1+ parts

$24.434

100+ parts

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4,800

$24.434

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Vyrian

USA . 3,860 parts In-Stock

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3,860

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Chip Stock

USA . 299 parts In-Stock

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299

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ComSIT Distribution GmbH

Germany . 96 parts In-Stock

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96

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QIE Inc.

USA . 30 parts In-Stock

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30

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Bristol Electronics

USA . 20 parts In-Stock

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20

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Electronics Depot

USA . 6 parts In-Stock

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6

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 516 parts In-Stock

1+ parts

$11.137

100+ parts

-

1k+ parts

$11.590

10k+ parts

-

516

$11.137

-

$11.590

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ChromeModa Solutions

Germany . 2,520 parts In-Stock

1+ parts

$12.513

100+ parts

$10.261

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-

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2,520

$12.513

$10.261

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IDEA Electronic Components Group

UK . 53 parts In-Stock

1+ parts

$12.513

100+ parts

$11.887

1k+ parts

$11.262

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53

$12.513

$11.887

$11.262

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Corphita

USA . 3,717 parts In-Stock

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$23.148

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3,717

$23.148

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Microchip USA

USA . 2,358 parts In-Stock

1+ parts

$26.380

100+ parts

$26.000

1k+ parts

$25.810

10k+ parts

$25.620

2,358

$26.380

$26.000

$25.810

$25.620

Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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Kepictronics

USA . 1,880 parts In-Stock

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1,880

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DigiPath Technology Company

USA . 1,409 parts In-Stock

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100+ parts

$11.282

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1,409

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$11.282

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Overview

Unlock seamless communication and connectivity with the TSB81BA3IPFPEP by Texas Instruments. Crafted with precision and expertise, this line driver & receiver offers unparalleled quality and reliability. Ideal for a range of applications, this product ensures smooth data transmission and impeccable performance. Experience the value of advanced technology and innovation with this versatile solution. Elevate your projects with the benefits and advantages that the TSB81BA3IPFPEP brings to the table. Trust in Texas Instruments for cutting-edge solutions that deliver results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring long-lasting performance.

Surface Mount: YES

Facilitates easy installation on circuit boards, saving time and effort in the assembly process.

Maximum Supply Voltage: 2.05 V

Supports a wide range of operating voltages, making it versatile for different applications.

No. of Functions: 6

Offers multiple functions in a single package, providing cost-effective solutions for various needs.

Terminal Finish: NICKEL PALLADIUM GOLD

Ensures excellent conductivity and corrosion resistance, enhancing the reliability of the connections.

Maximum Operating Temperature: 85 °C

Allows the product to operate efficiently in high-temperature environments, improving overall performance.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, leading to energy-efficient operation.

Nominal Supply Voltage: 1.95 V

Provides a stable voltage supply for consistent performance and reliable data transmission.

Technical Specifications

Line Drivers & Receivers TSB81BA3IPFPEP attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

6

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

IEEE 1394

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

6

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

.172 V

Maximum Output Low Current:

4 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP80,.55SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

6

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

2.05 V

Minimum Supply Voltage:

1.85 V

Nominal Supply Voltage:

1.95 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Trade Compliance

TSB81BA3IPFPEP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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