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TS5MP646NYFPR

Texas Instruments

TS5MP646NYFPR by Texas Instruments

TS5MP646NYFPR by Texas Instruments is a 36-terminal SQUARE multiplexer with TIN SILVER COPPER finish. It operates b/w -40 to 85 °C, has 0.5 mm seated height, and offers 3000 kHz bandwidth. Ideal for industrial applications requiring a differential multiplexer with low on-state resistance of 9 ohm and high off-state isolation of 20 dB.

Median Price

$9.465

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,730 parts In-Stock

1+ parts

$13.400

100+ parts

$9.061

1k+ parts

$8.280

10k+ parts

$8.052

2,730

$13.400

$9.061

$8.280

$8.052

Mouser Electronics

USA . 2,975 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$5.530

2,975

-

-

-

$5.530

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 15 parts In-Stock

1+ parts

$9.950

100+ parts

-

1k+ parts

-

10k+ parts

-

15

$9.950

-

-

-

Digiode

USA . 1,015 parts In-Stock

1+ parts

$11.884

100+ parts

-

1k+ parts

-

10k+ parts

-

1,015

$11.884

-

-

-

Chip Stock

USA . 39,430 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

39,430

-

-

-

-

Vyrian

USA . 2,786 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,786

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,759 parts In-Stock

1+ parts

$4.700

100+ parts

-

1k+ parts

-

10k+ parts

-

2,759

$4.700

-

-

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$9.950

100+ parts

$9.751

1k+ parts

$9.452

10k+ parts

$9.253

2,000

$9.950

$9.751

$9.452

$9.253

Parana Technologies

USA . 767 parts In-Stock

1+ parts

$10.032

100+ parts

-

1k+ parts

$10.589

10k+ parts

-

767

$10.032

-

$10.589

-

DigiPath Technology Company

USA . 221 parts In-Stock

1+ parts

$11.047

100+ parts

-

1k+ parts

-

10k+ parts

-

221

$11.047

-

-

-

Corphita

USA . 3,012 parts In-Stock

1+ parts

$11.259

100+ parts

-

1k+ parts

-

10k+ parts

-

3,012

$11.259

-

-

-

IDEA Electronic Components Group

UK . 793 parts In-Stock

1+ parts

$11.272

100+ parts

$10.708

1k+ parts

$10.145

10k+ parts

-

793

$11.272

$10.708

$10.145

-

ChromeModa Solutions

Germany . 680 parts In-Stock

1+ parts

$11.272

100+ parts

$9.243

1k+ parts

-

10k+ parts

-

680

$11.272

$9.243

-

-

Microchip USA

USA . 488 parts In-Stock

1+ parts

$14.710

100+ parts

$14.500

1k+ parts

$14.390

10k+ parts

$14.290

488

$14.710

$14.500

$14.390

$14.290

Lixinc

USA . 11,535 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,535

-

-

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-

Overview

Experience seamless and reliable performance with the TS5MP646NYFPR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers high-quality multiplexers and switches that guarantee precision and durability. Whether you're in the industrial or consumer electronics sector, this differential multiplexer offers exceptional value with its wide operating temperature range and efficient power consumption. Upgrade your designs with the Texas Instruments TS5MP646NYFPR and enjoy superior performance and reliability for all your applications.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and reducing manufacturing costs.

No. of Terminals: 36

Having 36 terminals provides ample connectivity options, allowing for versatile use in various circuit configurations.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand demanding environmental conditions and maintain reliable performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures that the product can function effectively in a wide range of temperature environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity, ensuring reliable signal transmission and minimal signal loss.

Nominal Bandwidth: 3000 kHz

With a high nominal bandwidth of 3000 kHz, this product can handle high-frequency signals effectively, making it suitable for applications requiring fast data transmission.

Technical Specifications

Multiplexers & Switches TS5MP646NYFPR attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

Nominal Bandwidth:

3000 kHz

Maximum Input Voltage:

3.6 V

Minimum Input Voltage:

0 V

JESD-30 Code:

S-XBGA-B36

JESD-609 Code:

e1

Length:

2.6 mm

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NO

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

36

Nominal Off-state Isolation:

20 dB

Nominal On-state Resistance Match:

.1 ohm

Maximum On-state Resistance (Ron):

9 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.5 mm

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Surface Mount:

YES

Maximum Switch-off Time:

1000 ns

Maximum Switch-on Time:

300000 ns

Switching (V):

BREAK-BEFORE-MAKE

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2.6 mm

Trade Compliance

TS5MP646NYFPR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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