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TS3USBCA420RSVR

Texas Instruments

TS3USBCA420RSVR by Texas Instruments

TS3USBCA420RSVR by Texas Instruments is a consumer IC with 16 terminals in a chip carrier package. It operates b/w 0-70°C, has 3 channels with 500 kHz bandwidth, and supports supply voltage from 2.4V to 5.5V. Ideal for applications requiring low power consumption and compact design in commercial-grade electronics.

Median Price

$0.640

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,875 parts In-Stock

1+ parts

$0.640

100+ parts

$0.611

1k+ parts

$0.581

10k+ parts

-

2,875

$0.640

$0.611

$0.581

-

Texas Instruments

USA . 77,335 parts In-Stock

1+ parts

$0.981

100+ parts

$0.754

1k+ parts

$0.397

10k+ parts

-

77,335

$0.981

$0.754

$0.397

-

Mouser Electronics

USA . 2,975 parts In-Stock

1+ parts

$2.270

100+ parts

$1.070

1k+ parts

$0.737

10k+ parts

$0.622

2,975

$2.270

$1.070

$0.737

$0.622

Verical

USA . 2,875 parts In-Stock

1+ parts

-

100+ parts

$0.611

1k+ parts

$0.581

10k+ parts

-

2,875

-

$0.611

$0.581

-

Chip1Stop

Japan . 2,875 parts In-Stock

1+ parts

-

100+ parts

$0.257

1k+ parts

$0.245

10k+ parts

-

2,875

-

$0.257

$0.245

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,029 parts In-Stock

1+ parts

$0.256

100+ parts

-

1k+ parts

-

10k+ parts

-

3,029

$0.256

-

-

-

Vyrian

USA . 2,090 parts In-Stock

1+ parts

$0.257

100+ parts

-

1k+ parts

-

10k+ parts

-

2,090

$0.257

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,121 parts In-Stock

1+ parts

$0.243

100+ parts

-

1k+ parts

-

10k+ parts

-

1,121

$0.243

-

-

-

Component Stockers USA

USA . 7,257 parts In-Stock

1+ parts

$0.260

100+ parts

$0.250

1k+ parts

$0.240

10k+ parts

-

7,257

$0.260

$0.250

$0.240

-

Parana Technologies

USA . 674 parts In-Stock

1+ parts

$1.983

100+ parts

-

1k+ parts

$2.512

10k+ parts

-

674

$1.983

-

$2.512

-

ChromeModa Solutions

Germany . 6,668 parts In-Stock

1+ parts

$2.228

100+ parts

$1.827

1k+ parts

-

10k+ parts

-

6,668

$2.228

$1.827

-

-

IDEA Electronic Components Group

UK . 1,398 parts In-Stock

1+ parts

$2.228

100+ parts

-

1k+ parts

$2.005

10k+ parts

-

1,398

$2.228

-

$2.005

-

Lixinc

USA . 19,627 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

19,627

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

DigiPath Technology Company

USA . 274 parts In-Stock

1+ parts

-

100+ parts

$2.009

1k+ parts

-

10k+ parts

-

274

-

$2.009

-

-

Overview

Unlock the potential of your consumer electronics with the TS3USBCA420RSVR by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge technology in the form of this versatile consumer IC. With a wide range of applications in various electronic devices, this chip carrier offers exceptional performance and efficiency. Experience seamless connectivity and enhanced functionality with the TS3USBCA420RSVR, providing customers with unparalleled value and benefits. Upgrade your devices today and discover a new level of convenience and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and reliability to the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly.

Package Shape: RECTANGULAR

Rectangular package shape ensures compatibility with standard PCB layouts.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the product can withstand typical operating conditions.

Minimum Operating Temperature: 0 °C

The product can operate in a wide range of temperatures, ranging from 0 to 70°C.

Width: 1.8 mm

With a small width of 1.8 mm, this product is suitable for space-constrained applications.

Minimum Supply Voltage (Vsup): 2.4 V

The low minimum supply voltage requirement of 2.4 V makes the product energy-efficient.

Maximum Time At Peak Reflow Temperature (s): 30

The product can handle peak reflow temperatures for up to 30 seconds, ensuring proper soldering during assembly.

No. of Channels: 3

Having three channels allows for multiple functions or signals to be processed simultaneously.

Nominal Bandwidth: 500 kHz

The high nominal bandwidth of 500 kHz enables the product to handle fast signal processing.

Maximum Supply Current: 0.07 mA

With a low maximum supply current of 0.07 mA, the product is power-efficient.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5 V provides flexibility in power supply options for the product.

Technical Specifications

Other Function Consumer ICs TS3USBCA420RSVR attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

Nominal Bandwidth:

500 kHz

General IC Type:

JESD-30 Code:

R-PQCC-N16

JESD-609 Code:

e4

Length:

2.6 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.55 mm

Maximum Supply Current:

.07 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.4 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.8 mm

Trade Compliance

TS3USBCA420RSVR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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