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TS3USBCA420IRSVT

Texas Instruments

TS3USBCA420IRSVT by Texas Instruments

TS3USBCA420IRSVT by Texas Instruments is a consumer IC with 16 terminals in a chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. With 3 channels and 500 kHz bandwidth, it's ideal for applications requiring low power consumption and compact design.

Median Price

$1.760

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 34,735 parts In-Stock

1+ parts

$1.324

100+ parts

$1.018

1k+ parts

$0.536

10k+ parts

-

34,735

$1.324

$1.018

$0.536

-

DigiKey

USA . 458 parts In-Stock

1+ parts

$1.760

100+ parts

$1.047

1k+ parts

$0.930

10k+ parts

$0.885

458

$1.760

$1.047

$0.930

$0.885

Mouser Electronics

USA . 190 parts In-Stock

1+ parts

$1.760

100+ parts

$1.050

1k+ parts

$0.896

10k+ parts

$0.854

190

$1.760

$1.050

$0.896

$0.854

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,913 parts In-Stock

1+ parts

$1.258

100+ parts

-

1k+ parts

-

10k+ parts

-

1,913

$1.258

-

-

-

Vyrian

USA . 7,104 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,104

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,208 parts In-Stock

1+ parts

$1.192

100+ parts

-

1k+ parts

-

10k+ parts

-

3,208

$1.192

-

-

-

Parana Technologies

USA . 122 parts In-Stock

1+ parts

$2.043

100+ parts

-

1k+ parts

$2.566

10k+ parts

-

122

$2.043

-

$2.566

-

Advanced Electronics

New Zealand . 870 parts In-Stock

1+ parts

$2.126

100+ parts

$1.935

1k+ parts

$1.743

10k+ parts

-

870

$2.126

$1.935

$1.743

-

DigiPath Technology Company

USA . 1,416 parts In-Stock

1+ parts

$2.250

100+ parts

$2.070

1k+ parts

-

10k+ parts

-

1,416

$2.250

$2.070

-

-

ChromeModa Solutions

Germany . 6,951 parts In-Stock

1+ parts

$2.296

100+ parts

$1.883

1k+ parts

-

10k+ parts

-

6,951

$2.296

$1.883

-

-

IDEA Electronic Components Group

UK . 751 parts In-Stock

1+ parts

$2.296

100+ parts

-

1k+ parts

$2.066

10k+ parts

-

751

$2.296

-

$2.066

-

QUARKTWIN TECHNOLOGY LTD

USA . 27,154 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

27,154

-

-

-

-

Overview

Enhance your electronic devices with the TS3USBCA420IRSVT by Texas Instruments, a top-quality consumer IC that delivers reliable performance in a compact chip carrier package. Designed for industrial-grade applications, this versatile IC offers 3 channels and a nominal bandwidth of 500 kHz, providing seamless connectivity and enhanced functionality. Trust in Texas Instruments' reputation for innovation and excellence, and experience the value and benefits of the TS3USBCA420IRSVT in your next project. Elevate your electronics with this cutting-edge solution today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material is lightweight, durable, and cost-effective, making it suitable for consumer applications.

Surface Mount: YES

Being surface mountable provides ease of assembly and saves space on the PCB.

No. of Terminals: 16

Having 16 terminals allows for more connections and functionality in the circuit.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliable performance even in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The various terminal finishes provide good electrical conductivity and corrosion resistance.

Maximum Seated Height: 0.55 mm

The low seated height makes this IC suitable for compact and slim designs.

Minimum Supply Voltage (Vsup): 2.4 V

The low minimum supply voltage allows for operation in low-power applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in industrial environments.

No. of Channels: 3

Having 3 channels enables multi-functionality and versatility in the application.

Nominal Bandwidth: 500 kHz

The high nominal bandwidth allows for fast data transmission and signal processing.

Terminal Form: NO LEAD

The lead-free terminal form is environmentally friendly and compliant with RoHS regulations.

Maximum Supply Current: 0.07 mA

The low maximum supply current helps in reducing power consumption and increasing efficiency.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage allows for flexibility in power supply options.

Technical Specifications

Other Function Consumer ICs TS3USBCA420IRSVT attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

Nominal Bandwidth:

500 kHz

General IC Type:

JESD-30 Code:

R-PQCC-N16

JESD-609 Code:

e4

Length:

2.6 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.55 mm

Maximum Supply Current:

.07 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.4 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.8 mm

Trade Compliance

TS3USBCA420IRSVT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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