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TRSF3243CDBG4

Texas Instruments

TRSF3243CDBG4 by Texas Instruments

TRSF3243CDBG4 by Texas Instruments is a Line Driver & Receiver with 5 functions, operating at 3.3/5V. It features EIA-232 interface standard, Schmitt trigger input characteristics, and Gull Wing terminal form. Ideal for commercial applications requiring reliable communication over short distances.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,943 parts In-Stock

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4,943

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Vyrian

USA . 3,934 parts In-Stock

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3,934

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 629 parts In-Stock

1+ parts

$10.814

100+ parts

$1,004.198

1k+ parts

$9.732

10k+ parts

-

629

$10.814

$1,004.198

$9.732

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DigiPath Technology Company

USA . 262 parts In-Stock

1+ parts

$11.907

100+ parts

$10.954

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-

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262

$11.907

$10.954

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ChromeModa Solutions

Germany . 4,188 parts In-Stock

1+ parts

$12.150

100+ parts

$9.963

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4,188

$12.150

$9.963

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IDEA Electronic Components Group

UK . 1,387 parts In-Stock

1+ parts

$12.150

100+ parts

$11.542

1k+ parts

$10.935

10k+ parts

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1,387

$12.150

$11.542

$10.935

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AZTECH Wire

Italy . 258 parts In-Stock

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$15.769

100+ parts

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258

$15.769

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One Stop Electronics

USA . 136 parts In-Stock

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$24.500

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136

$24.500

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QUARKTWIN TECHNOLOGY LTD

USA . 9,733 parts In-Stock

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Corphita

USA . 4,075 parts In-Stock

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4,075

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Microchip USA

USA . 428 parts In-Stock

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428

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Overview

Experience the superior quality and reliability of Texas Instruments with the TRSF3243CDBG4 line driver & receiver. This versatile component offers unparalleled performance in a wide range of applications, from industrial automation to communication systems. With its innovative design and advanced features, this product provides customers with exceptional value, efficiency, and peace of mind. Trust Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and reliable for long-term use.

Surface Mount: YES

Surface mount design allows for easy installation and saves space on the circuit board.

Maximum Supply Voltage: 3.6 V

Can handle high supply voltages, providing flexibility in various circuit designs.

No. of Functions: 5

Having multiple functions in one component reduces the need for additional components, simplifying the design and reducing costs.

Package Shape: RECTANGULAR

Rectangular shape is commonly used and easy to work with in circuit designs.

Power Supplies (V): 3.3/5

Supporting multiple power supply voltages offers compatibility with different systems.

No. of Terminals: 28

Having a high number of terminals allows for more connections and flexibility in the circuit design.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Compact package style saves space on the circuit board and allows for higher packing density.

Maximum High Level Input Current: 0.000001 Amp

Low input current helps in reducing power consumption and heat generation.

Minimum Supply Voltage: 3 V

Supporting low supply voltages ensures compatibility with a wide range of systems.

Maximum Operating Temperature: 70 °C

High operating temperature range indicates reliability in different environmental conditions.

Minimum Operating Temperature: 0 °C

Support for low operating temperature ensures the product can function in various temperature conditions.

Terminal Position: DUAL

Dual terminal position provides additional connection options for the circuit design.

Maximum Seated Height: 2 mm

Low seated height allows for a compact design, saving space in the overall circuit layout.

Width: 5.3 mm

Narrow width enables a compact and space-saving design.

Maximum Output Low Current: 1.6 Amp

High output current capability allows for driving different loads in the circuit.

Receiver No. of Bits: 5

Support for multiple bits helps in data transmission accuracy and speed.

Length: 10.2 mm

Compact length facilitates a smaller footprint on the circuit board.

Minimum Out Swing: 10 V

Support for high output swing ensures compatibility with various input/output levels.

Temperature Grade: COMMERCIAL

Commercial-grade temperature range makes it suitable for standard operating environments.

Maximum Receive Delay: 0 ns

Zero receive delay ensures real-time data transmission.

Terminal Form: GULL WING

Gull-wing terminal form provides easy soldering and reliable connections.

Interface Standard: EIA-232

Adherence to industry-standard interface ensures compatibility with a wide range of systems.

Maximum Supply Current: 1 mA

Low supply current consumption helps in minimizing power usage and heat dissipation.

Input Characteristics: SCHMITT TRIGGER

Schmitt trigger input characteristics provide noise immunity and reliable signal processing.

Nominal Supply Voltage: 3.3 V

Support for a nominal supply voltage ensures stable operation within the specified range.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density mounting on the circuit board.

Driver No. of Bits: 3

Three bits in the driver provide sufficient control over the output signals.

Interface IC Type: LINE TRANSCEIVER

Line transceiver interface IC type enables bidirectional data transfer and signal conversion.

Technical Specifications

Line Drivers & Receivers TRSF3243CDBG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 5V

Differential Output:

NO

Driver No. of Bits:

3

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232

JESD-30 Code:

R-PDSO-G28

Length:

10.2 mm

No. of Functions:

5

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

5

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

TRSF3243CDBG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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