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TRSF3232CDRG4

Texas Instruments

TRSF3232CDRG4 by Texas Instruments

TRSF3232CDRG4 by Texas Instruments is a Line Driver & Receiver with 16 terminals, operating at 3.3/5V. It features EIA-232 interface standard, Schmitt trigger input characteristics, and dual functions. Ideal for commercial applications requiring reliable data transmission in temperature range of 0-70°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,940 parts In-Stock

1+ parts

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1,940

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Digiode

USA . 347 parts In-Stock

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347

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 750 parts In-Stock

1+ parts

$5.401

100+ parts

$501.520

1k+ parts

$4.860

10k+ parts

-

750

$5.401

$501.520

$4.860

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DigiPath Technology Company

USA . 2,284 parts In-Stock

1+ parts

$5.947

100+ parts

-

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2,284

$5.947

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ChromeModa Solutions

Germany . 3,709 parts In-Stock

1+ parts

$6.068

100+ parts

$4.976

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-

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3,709

$6.068

$4.976

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IDEA Electronic Components Group

UK . 1,020 parts In-Stock

1+ parts

$6.068

100+ parts

-

1k+ parts

$5.461

10k+ parts

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1,020

$6.068

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$5.461

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One Stop Electronics

USA . 1,311 parts In-Stock

1+ parts

$13.500

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1,311

$13.500

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AZTECH Wire

Italy . 282 parts In-Stock

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$14.195

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282

$14.195

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Ampacity Inc.

Singapore . 582 parts In-Stock

1+ parts

$29.500

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582

$29.500

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QUARKTWIN TECHNOLOGY LTD

USA . 5,361 parts In-Stock

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5,361

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Microchip USA

USA . 4,532 parts In-Stock

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Corphita

USA . 907 parts In-Stock

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907

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Overview

Unlock seamless communication with the TRSF3232CDRG4 by Texas Instruments, a top-of-the-line line driver and receiver designed to elevate your electronic projects. Crafted with precision and expertise by Texas Instruments, this versatile component offers unparalleled reliability and performance. From industrial automation to consumer electronics, this compact yet powerful device is the key to smooth data transmission. Experience the value and benefits of cutting-edge technology with the TRSF3232CDRG4 - where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the components inside, ensuring long-term reliability.

Surface Mount: YES

Being surface mountable enhances the ease of installation and allows for efficient use of PCB space.

Maximum Supply Voltage: 3.6 V

The maximum supply voltage of 3.6 V accommodates a wide range of power supply options.

No. of Functions: 2

Having multiple functions in one device reduces the need for additional components, saving cost and board space.

Power Supplies (V): 3.3/5

Supporting both 3.3V and 5V power supplies ensures compatibility with various system requirements.

No. of Terminals: 16

The ample number of terminals allows for versatile connectivity options.

Maximum High Level Input Current: 0.000001 Amp

The low maximum high level input current helps in reducing power consumption and improving efficiency.

Minimum Operating Temperature: 0 °C

The ability to operate at 0°C ensures functionality in a wide range of environments.

Maximum Output Low Current: 1.6 Amp

With a high maximum output low current, this product can effectively drive various loads.

Receiver No. of Bits: 2

The receiver with 2 bits ensures accurate data reception and transmission.

Temperature Grade: COMMERCIAL

The commercial temperature grade makes this product suitable for standard operating conditions.

Maximum Supply Current: 1 mA

The low maximum supply current requirement helps in keeping power consumption minimal.

Interface IC Type: LINE TRANSCEIVER

The use of a line transceiver interface IC type ensures compatibility with standard communication protocols.

Technical Specifications

Line Drivers & Receivers TRSF3232CDRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATED AT 5V SUPPLY

Differential Output:

NO

Driver No. of Bits:

2

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

TRSF3232CDRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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