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TRSF3223IPW

Texas Instruments

TRSF3223IPW by Texas Instruments

TRSF3223IPW by Texas Instruments is a Line Driver & Receiver with 2 functions, operating at 3.3/5V. It has EIA-232 interface standard, Schmitt trigger input characteristics, and Gull Wing terminal form. Ideal for industrial applications requiring high-speed data transmission in compact spaces due to its small outline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,592 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,592

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Digiode

USA . 4,138 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,138

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,120 parts In-Stock

1+ parts

$11.462

100+ parts

$1,064.449

1k+ parts

$10.316

10k+ parts

-

2,120

$11.462

$1,064.449

$10.316

-

DigiPath Technology Company

USA . 1,085 parts In-Stock

1+ parts

$12.621

100+ parts

-

1k+ parts

-

10k+ parts

-

1,085

$12.621

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ChromeModa Solutions

Germany . 4,672 parts In-Stock

1+ parts

$12.879

100+ parts

$10.561

1k+ parts

-

10k+ parts

-

4,672

$12.879

$10.561

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-

IDEA Electronic Components Group

UK . 453 parts In-Stock

1+ parts

$12.879

100+ parts

$12.235

1k+ parts

$11.591

10k+ parts

-

453

$12.879

$12.235

$11.591

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AZTECH Wire

Italy . 353 parts In-Stock

1+ parts

$17.998

100+ parts

-

1k+ parts

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10k+ parts

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353

$17.998

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One Stop Electronics

USA . 254 parts In-Stock

1+ parts

$47.500

100+ parts

-

1k+ parts

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10k+ parts

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254

$47.500

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Corphita

USA . 3,268 parts In-Stock

1+ parts

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100+ parts

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3,268

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Microchip USA

USA . 213 parts In-Stock

1+ parts

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213

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Overview

Discover the TRSF3223IPW by Texas Instruments, a high-quality line driver & receiver that offers exceptional performance and reliability. With Texas Instruments' reputation for excellence in manufacturing, this product is designed to meet the demands of industrial applications with its innovative design and durable construction. Whether you need to transmit data over long distances or ensure stable communication in harsh environments, the TRSF3223IPW delivers unmatched value and benefits. Trust Texas Instruments to provide cutting-edge solutions for your connectivity needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package durable and resistant to damage, ensuring the product has a long lifespan.

Surface Mount: YES

Being surface mountable allows for easy installation and integration into various electronic devices or systems.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage range provides flexibility in usage and compatibility with different power sources.

No. of Functions: 2

Having multiple functions in one device saves space and simplifies circuit design, making it a cost-effective solution.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient PCB layout and component placement, optimizing space usage.

Power Supplies (V): 3.3/5

Support for multiple power supply voltages offers versatility in application and compatibility with different systems.

No. of Terminals: 20

Having a high number of terminals allows for more connectivity options and functionality in the device.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and slim package style saves space and enables the product to be used in space-constrained applications.

Maximum High Level Input Current: 0.000001 Amp

The low input current ensures minimal power consumption and efficient operation of the device.

Minimum Supply Voltage: 3 V

The low minimum supply voltage requirement ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range allows for reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the device can function in cold environments without issues.

Terminal Position: DUAL

Dual terminal positioning provides redundancy and enhances reliability in connectivity and signal transmission.

Maximum Seated Height: 1.2 mm

The low seated height profile makes the device suitable for compact designs and space-saving applications.

Width: 4.4 mm

The narrow width allows for efficient PCB layout and space optimization in electronic assemblies.

Maximum Output Low Current: 1.6 Amp

The high output current capability ensures the device can drive loads effectively without performance degradation.

Receiver No. of Bits: 2

Having multiple bits in the receiver enhances signal processing capabilities and communication efficiency.

Length: 6.5 mm

The compact length makes the device suitable for use in small electronic devices or systems where space is a premium.

Minimum Out Swing: 10 V

The high minimum output swing ensures compatibility with a wide range of systems and signal levels.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature tolerance ensures reliable performance in challenging temperature conditions typically found in industrial settings.

Maximum Receive Delay: 0 ns

The zero receive delay ensures instantaneous signal reception and fast data transmission without delays.

Terminal Form: GULL WING

The gull-wing terminal form factor enables easy soldering and secure attachment to the PCB for reliable connectivity.

Interface Standard: EIA-232

Compliance with the EIA-232 interface standard ensures compatibility with a wide range of communication protocols and systems.

Maximum Supply Current: 1 mA

The low maximum supply current requirement ensures energy-efficient operation and minimal power consumption.

Input Characteristics: SCHMITT TRIGGER

The Schmitt trigger input characteristics provide noise immunity and signal stability, ensuring reliable data transmission.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage specification ensures stable and consistent power supply for the device's operation.

Terminal Pitch: 0.65 mm

The small terminal pitch enables compact design and efficient connectivity in tight spaces or high-density PCB layouts.

Driver No. of Bits: 2

Having multiple bits in the driver enhances signal processing capabilities and allows for more complex data transmission.

Interface IC Type: LINE TRANSCEIVER

Being a line transceiver interface IC type, this product can efficiently transmit and receive data signals between different systems or devices.

Technical Specifications

Line Drivers & Receivers TRSF3223IPW attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 5V SUPPLY

Differential Output:

NO

Driver No. of Bits:

2

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

TRSF3223IPW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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