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TRSF3222EIDB

Texas Instruments

TRSF3222EIDB by Texas Instruments

TRSF3222EIDB by Texas Instruments is a dual-function line transceiver with 20 terminals, operating at 3.3V/5V. It features Schmitt trigger input characteristics and supports EIA-232-F, TIA-232-F, V.28 interface standards. Ideal for industrial applications requiring reliable communication over short distances.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,110 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

5,110

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-

-

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Digiode

USA . 4,944 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,944

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 980 parts In-Stock

1+ parts

$5.500

100+ parts

-

1k+ parts

-

10k+ parts

-

980

$5.500

-

-

-

AZTECH Wire

Italy . 334 parts In-Stock

1+ parts

$7.538

100+ parts

-

1k+ parts

-

10k+ parts

-

334

$7.538

-

-

-

Parana Technologies

USA . 2,231 parts In-Stock

1+ parts

$12.413

100+ parts

-

1k+ parts

$12.850

10k+ parts

-

2,231

$12.413

-

$12.850

-

DigiPath Technology Company

USA . 1,941 parts In-Stock

1+ parts

$13.668

100+ parts

$12.575

1k+ parts

-

10k+ parts

-

1,941

$13.668

$12.575

-

-

ChromeModa Solutions

Germany . 2,017 parts In-Stock

1+ parts

$13.947

100+ parts

$11.437

1k+ parts

-

10k+ parts

-

2,017

$13.947

$11.437

-

-

IDEA Electronic Components Group

UK . 1,030 parts In-Stock

1+ parts

$13.947

100+ parts

$13.250

1k+ parts

$12.552

10k+ parts

-

1,030

$13.947

$13.250

$12.552

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Microchip USA

USA . 4,843 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,843

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Corphita

USA . 4,238 parts In-Stock

1+ parts

-

100+ parts

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4,238

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Overview

Experience seamless and reliable communication with the TRSF3222EIDB by Texas Instruments. Crafted with precision and expertise, this line driver & receiver offers unparalleled quality and performance. Perfect for a wide range of applications, this product boasts a small outline and shrink pitch package style, making it versatile and easy to integrate. With a nominal supply voltage of 3.3V and industrial temperature grade, you can trust in its durability and efficiency. Trust Texas Instruments to deliver exceptional value and innovation with the TRSF3222EIDB, providing you with the competitive edge you need.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product durable and resistant to external elements, ensuring a longer lifespan.

Surface Mount: YES

Being surface mountable allows for easy installation and integration into various electronic systems.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6 V allows for compatibility with a wide range of power sources.

No. of Functions: 2

Having multiple functions in one device increases efficiency and saves space in circuit design.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in harsh environments.

Technical Specifications

Line Drivers & Receivers TRSF3222EIDB attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Driver No. of Bits:

2

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-F; TIA-232-F; V.28

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

7.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

TRSF3222EIDB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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