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TRS3386EIDW

Texas Instruments

TRS3386EIDW by Texas Instruments

TRS3386EIDW by Texas Instruments is a Line Driver & Receiver with 3 functions, operating at 3-5V. It features EIA-232/TIA-232 interface standard, Schmitt trigger input characteristics, and industrial temperature grade. Ideal for applications requiring reliable data transmission in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,962 parts In-Stock

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1,962

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Digiode

USA . 870 parts In-Stock

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870

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Distributors (Availability)

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AZTECH Wire

Italy . 508 parts In-Stock

1+ parts

$12.536

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508

$12.536

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Parana Technologies

USA . 1,208 parts In-Stock

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$13.112

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$13.614

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$13.112

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$13.614

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DigiPath Technology Company

USA . 1,389 parts In-Stock

1+ parts

$14.438

100+ parts

$13.283

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1,389

$14.438

$13.283

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ChromeModa Solutions

Germany . 6,985 parts In-Stock

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$14.733

100+ parts

$12.081

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6,985

$14.733

$12.081

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IDEA Electronic Components Group

UK . 1,778 parts In-Stock

1+ parts

$14.733

100+ parts

$13.996

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$13.260

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1,778

$14.733

$13.996

$13.260

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One Stop Electronics

USA . 1,639 parts In-Stock

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$20.500

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1,639

$20.500

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Corphita

USA . 3,826 parts In-Stock

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Microchip USA

USA . 298 parts In-Stock

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298

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Overview

Discover the TRS3386EIDW by Texas Instruments, a top-of-the-line Line Driver & Receiver designed with superior quality and precision. With 3 functions packed into a small outline package, this industrial-grade IC offers seamless communication with a wide supply voltage range. Perfect for EIA-232 and TIA-232 interfaces, this versatile component ensures reliable data transmission in various applications. Trust Texas Instruments to deliver innovative solutions that bring value and efficiency to your projects. Upgrade to the TRS3386EIDW today and experience unparalleled performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection, making the product suitable for a variety of environments.

Surface Mount: YES

Simplifies installation and allows for compact design.

Maximum Supply Voltage: 5.5 V

Supports a wide range of power supply options for versatility.

No. of Functions: 3

Offers multiple functions in a single package for added functionality.

Minimum Supply Voltage: 3 V

Operates efficiently with a low minimum supply voltage.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Ensures high-quality connections and long-term reliability.

No. of Terminals: 20

Provides ample connection options for various applications.

Receiver No. of Bits: 2

Allows for efficient data reception and processing.

Terminal Form: GULL WING

Facilitates easy and secure connection of terminal pins.

Interface Standard: EIA-232; TIA-232

Complies with industry standards for compatibility with a wide range of systems.

Driver No. of Bits: 3

Enables precise control and transmission of data.

Technical Specifications

Line Drivers & Receivers TRS3386EIDW attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Driver No. of Bits:

3

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232; TIA-232

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

3

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

10 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

TRS3386EIDW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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