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TRS3223IDB

Texas Instruments

TRS3223IDB by Texas Instruments

TRS3223IDB by Texas Instruments is a Line Driver & Receiver with 2 functions, operating at 3.3/5V. It features EIA-232-F, TIA-232-F, V.28 interface standard and Schmitt trigger input characteristics. Ideal for industrial applications requiring reliable communication in temperature range -40 to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,147 parts In-Stock

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5,147

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Digiode

USA . 277 parts In-Stock

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277

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,361 parts In-Stock

1+ parts

$6.500

100+ parts

-

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1,361

$6.500

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AZTECH Wire

Italy . 388 parts In-Stock

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$7.234

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388

$7.234

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Parana Technologies

USA . 641 parts In-Stock

1+ parts

$12.438

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$12.878

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641

$12.438

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$12.878

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DigiPath Technology Company

USA . 913 parts In-Stock

1+ parts

$13.696

100+ parts

$12.600

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913

$13.696

$12.600

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ChromeModa Solutions

Germany . 2,908 parts In-Stock

1+ parts

$13.975

100+ parts

$11.460

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2,908

$13.975

$11.460

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IDEA Electronic Components Group

UK . 732 parts In-Stock

1+ parts

$13.975

100+ parts

$13.276

1k+ parts

$12.578

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732

$13.975

$13.276

$12.578

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A-Z Elektronik GmbH

Germany . 3,000 parts In-Stock

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3,000

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Microchip USA

USA . 396 parts In-Stock

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396

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Corphita

USA . 266 parts In-Stock

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Overview

Enhance your electronic projects with the TRS3223IDB by Texas Instruments, a top-tier manufacturer known for its cutting-edge technology and reliability. As a leader in Line Drivers & Receivers, this product offers seamless communication and data transmission in a compact package. Designed for versatility and ease of use, the TRS3223IDB boasts high-quality performance and compatibility with various applications. Elevate your projects with this efficient solution that provides exceptional value, benefits, and advantages to customers seeking reliable connectivity solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy and convenient installation onto circuit boards, saving space and improving overall design flexibility.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, making it versatile and compatible with various systems.

No. of Functions: 2

Offers dual functionality in a single unit, providing cost efficiency and simplifying circuit design.

Package Shape: RECTANGULAR

Facilitates easy integration into existing circuit layouts, optimizing space utilization.

Power Supplies (V): 3.3/5

Supports multiple power supply options, allowing for flexible integration into different systems.

No. of Terminals: 20

Provides ample connection points for interfacing with external devices, enhancing versatility and connectivity.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Reduces the overall size of the component, making it suitable for compact designs and space-constrained applications.

Maximum High Level Input Current: 0.000001 Amp

Ensures efficient power consumption and minimal heat generation, improving overall energy efficiency.

Minimum Supply Voltage: 3 V

Allows for operation at lower voltage levels, enabling compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

Offers reliable performance in high-temperature environments, ensuring stability and durability in various operating conditions.

Minimum Operating Temperature: -40 °C

Maintains functionality even in extreme cold conditions, making it suitable for a diverse range of applications.

Terminal Position: DUAL

Enables flexible connection options, accommodating different types of circuit configurations for enhanced versatility.

Maximum Seated Height: 2 mm

Facilitates compact and low-profile designs, ideal for applications with space constraints.

Width: 5.3 mm

Compact and slim form factor, suitable for tight spacing requirements in modern electronic devices.

Maximum Output Low Current: 1.6 Amp

Delivers sufficient current for driving external loads, ensuring reliable signal transmission.

Receiver No. of Bits: 2

Capable of handling binary data transmission, suitable for digital communication protocols.

Length: 7.2 mm

Optimal size for compact and streamlined designs, ideal for space-sensitive applications.

Minimum Out Swing: 10 V

Maintains signal integrity and robustness, ensuring reliable data transmission over long distances.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring reliable performance under challenging conditions.

Maximum Receive Delay: 0 ns

Offers real-time signal processing, eliminating delays for responsive communication.

Terminal Form: GULL WING

Facilitates easy soldering and secure attachment to PCBs, ensuring robust mechanical connection.

Interface Standard: EIA-232-F; TIA-232-F; V.28

Compliant with industry standards for seamless compatibility with a wide range of communication protocols and devices.

Maximum Supply Current: 1 mA

Low power consumption for energy-efficient operation, extending battery life in portable devices.

Input Characteristics: SCHMITT TRIGGER

Provides noise immunity and signal conditioning for reliable data reception in noisy environments.

Nominal Supply Voltage: 3.3 V

Standard voltage level for compatibility with most electronic systems, ensuring easy integration.

Terminal Pitch: 0.65 mm

Fine pitch spacing for densely populated PCBs, enabling high-density interconnection in space-constrained applications.

Driver No. of Bits: 2

Dual-bit driver configuration for enhanced signal processing and transmission capabilities.

Interface IC Type: LINE TRANSCEIVER

Specialized IC type for efficient signal conversion and communication between different electronic systems.

Technical Specifications

Line Drivers & Receivers TRS3223IDB attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 5V SUPPLY

Differential Output:

NO

Driver No. of Bits:

2

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-F; TIA-232-F; V.28

JESD-30 Code:

R-PDSO-G20

Length:

7.2 mm

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

TRS3223IDB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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