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TRS3223CPWRG4

Texas Instruments

TRS3223CPWRG4 by Texas Instruments

TRS3223CPWRG4 by Texas Instruments is a Line Driver & Receiver with 2 functions. It operates at 3.6V max supply voltage and supports EIA-232-F, TIA-232-F, V.28 interface standards. Ideal for commercial applications requiring high-speed data transmission in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,184 parts In-Stock

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4,184

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Digiode

USA . 56 parts In-Stock

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56

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,243 parts In-Stock

1+ parts

$11.531

100+ parts

-

1k+ parts

$11.943

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1,243

$11.531

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$11.943

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DigiPath Technology Company

USA . 1,369 parts In-Stock

1+ parts

$12.697

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1,369

$12.697

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ChromeModa Solutions

Germany . 1,203 parts In-Stock

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$12.956

100+ parts

$10.624

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1,203

$12.956

$10.624

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IDEA Electronic Components Group

UK . 906 parts In-Stock

1+ parts

$12.956

100+ parts

$12.308

1k+ parts

$11.660

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906

$12.956

$12.308

$11.660

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Advanced Electronics

New Zealand . 10 parts In-Stock

1+ parts

$13.631

100+ parts

$12.404

1k+ parts

$11.177

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10

$13.631

$12.404

$11.177

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One Stop Electronics

USA . 702 parts In-Stock

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$17.500

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702

$17.500

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AZTECH Wire

Italy . 379 parts In-Stock

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$18.250

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$18.250

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Component Stockers USA

USA . 562 parts In-Stock

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$99.990

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$99.990

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Corphita

USA . 414 parts In-Stock

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Microchip USA

USA . 219 parts In-Stock

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Overview

Upgrade your communication systems with the TRS3223CPWRG4 by Texas Instruments, a leading manufacturer known for quality and reliability. This line driver and receiver is versatile and efficient, suitable for a range of applications. With a compact design and low power consumption, this product offers exceptional value and benefits to customers seeking high-performance components. Trust Texas Instruments to deliver cutting-edge technology that enhances your projects and ensures seamless connectivity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the components inside the package.

Surface Mount: YES

Allows for easy and convenient mounting on circuit boards.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages for flexibility in different applications.

No. of Functions: 2

Offers multiple functions in a single package for cost efficiency.

Maximum Operating Temperature: 70 °C

Can operate efficiently in a wide range of temperature conditions.

Minimum Operating Temperature: 0 °C

Ensures functionality even in low temperature environments.

Width: 4.4 mm

Compact size allows for space-saving designs in electronic systems.

Receiver No. of Bits: 2

Supports data transmission with a resolution of 2 bits for accurate signal processing.

Temperature Grade: COMMERCIAL

Designed for commercial use with reliable performance in standard operating conditions.

Interface Standard: EIA-232-F; TIA-232-F; V.28

Compliant with industry standards for seamless integration with other equipment.

Driver No. of Bits: 2

Provides 2 bits of data for efficient signal transmission and reception.

Technical Specifications

Line Drivers & Receivers TRS3223CPWRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 5V SUPPLY

Differential Output:

NO

Driver No. of Bits:

2

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-F; TIA-232-F; V.28

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

TRS3223CPWRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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