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TRC1300DR

Texas Instruments

TRC1300DR by Texas Instruments

TRC1300DR by Texas Instruments is a Remote Control IC with RF transmission media. It features 14 terminals, operates b/w -40 to 85°C, and supports circuits in industrial applications. The small outline package measures 8.65mm x 3.9mm x 1.75mm, making it suitable for compact designs requiring a supply voltage of 2.7V to 6V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,840 parts In-Stock

1+ parts

-

100+ parts

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8,840

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Digiode

USA . 1,563 parts In-Stock

1+ parts

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1,563

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 380 parts In-Stock

1+ parts

$1.034

100+ parts

-

1k+ parts

$1.902

10k+ parts

-

380

$1.034

-

$1.902

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DigiPath Technology Company

USA . 630 parts In-Stock

1+ parts

$1.139

100+ parts

-

1k+ parts

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10k+ parts

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630

$1.139

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ChromeModa Solutions

Germany . 3,102 parts In-Stock

1+ parts

$1.162

100+ parts

$0.953

1k+ parts

-

10k+ parts

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3,102

$1.162

$0.953

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IDEA Electronic Components Group

UK . 775 parts In-Stock

1+ parts

$1.162

100+ parts

-

1k+ parts

$1.046

10k+ parts

-

775

$1.162

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$1.046

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AZTECH Wire

Italy . 317 parts In-Stock

1+ parts

$15.597

100+ parts

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317

$15.597

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One Stop Electronics

USA . 1,388 parts In-Stock

1+ parts

$15.800

100+ parts

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1,388

$15.800

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Corphita

USA . 2,119 parts In-Stock

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2,119

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Overview

Elevate your remote control experience with the TRC1300DR by Texas Instruments. Known for their superior quality and innovative technology, Texas Instruments has designed this remote control IC to deliver seamless performance in a variety of applications. Whether you're controlling household devices or navigating through entertainment systems, the TRC1300DR offers unmatched reliability and functionality. With its compact design and industrial-grade temperature tolerance, this small outline package is the perfect solution for your remote control needs. Trust Texas Instruments to enhance your user experience with the TRC1300DR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the remote control IC, ensuring longevity and reliability.

Surface Mount: YES

Surface mount capability allows for easy integration into electronic devices, saving space and enabling efficient assembly processes.

Transmission Media: RF

Utilizing RF transmission media enables wireless communication, offering flexibility and convenience in controlling devices remotely.

General IC Type: SUPPORT CIRCUIT

Designed as a support circuit IC, this product enhances the performance and functionality of the overall electronic system it is used in.

No. of Terminals: 14

With 14 terminals, this remote control IC provides sufficient connectivity options for various input and output requirements.

Minimum Supply Voltage (Vsup): 2.7 V

Operating at a low minimum supply voltage of 2.7V, this IC is energy-efficient and suitable for battery-powered applications.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this remote control IC can withstand harsh operating conditions and temperature variations.

Technology: CMOS

Utilizing CMOS technology, this IC offers low power consumption and high noise immunity, making it ideal for remote control applications.

Technical Specifications

Remote Control ICs TRC1300DR attributes and parameters. Explore more Remote Control ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G14

Length:

8.65 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Transmission Media:

RF

Width:

3.9 mm

Trade Compliance

TRC1300DR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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