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TPS7H5002HFT/EM

Texas Instruments

TPS7H5002HFT/EM by Texas Instruments

TPS7H5002HFT/EM by Texas Instruments is a switching controller with a max switching frequency of 2000 kHz. It operates in buck-boost configuration, suitable for applications requiring a min input voltage of 4V and max input voltage of 14V. With a compact package style and current-mode control technique, it is ideal for space-constrained designs needing efficient power management.

Median Price

$664.124

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,142 parts In-Stock

1+ parts

$664.124

100+ parts

$553.437

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3,142

$664.124

$553.437

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,243 parts In-Stock

1+ parts

$630.918

100+ parts

-

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3,243

$630.918

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Vyrian

USA . 1,181 parts In-Stock

1+ parts

$664.124

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1,181

$664.124

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 3,065 parts In-Stock

1+ parts

$564.510

100+ parts

$550.397

1k+ parts

$547.575

10k+ parts

-

3,065

$564.510

$550.397

$547.575

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Ampacity Inc.

Singapore . 2,842 parts In-Stock

1+ parts

$564.510

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2,842

$564.510

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Corphita

USA . 4,156 parts In-Stock

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$597.712

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4,156

$597.712

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Corohmni

South Africa . 271 parts In-Stock

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$664.124

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271

$664.124

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Overview

Experience unparalleled efficiency and reliability with the TPS7H5002HFT/EM by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-of-the-line switching regulators & controllers that are essential for a wide range of applications. This product stands out for its high-quality ceramic, metal-sealed cofired package body material, ensuring durability and long-lasting performance. With a current-mode control mode and pulse width modulation technique, customers can trust in the seamless operation of this buck-boost switcher. Trust in Texas Instruments to provide you with the cutting-edge technology you need to power your projects efficiently and effectively.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material provides excellent thermal conductivity and ruggedness, ensuring reliable performance even in harsh operating conditions.

Surface Mount: YES

Being surface mountable makes installation and assembly easier, saving time and effort during production.

Control Mode: CURRENT-MODE

The current-mode control mode offers better transient response and improved stability, making the regulator more efficient and responsive to load variations.

Maximum Switching Frequency: 2000 kHz

The high switching frequency allows for smaller and more compact designs, reducing overall size and weight of the product.

Control Technique: PULSE WIDTH MODULATION

Pulse width modulation control technique provides precise regulation of output voltage, enhancing overall efficiency and performance of the regulator.

Switcher Config: BUCK-BOOST

The buck-boost switcher configuration enables the regulator to handle a wide range of input voltages, making it versatile and suitable for various applications.

Maximum Input Voltage: 14 V

With a high maximum input voltage, this regulator can be used in systems where the power source may fluctuate or where a higher voltage input is required.

Technical Specifications

Switching Regulators & Controllers TPS7H5002HFT/EM attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

14 V

Minimum Input Voltage:

4 V

JESD-30 Code:

R-CDFP-F22

JESD-609 Code:

e4

Length:

7.696 mm

No. of Functions:

1

No. of Terminals:

22

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

FL22,.25,25

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG

Maximum Seated Height:

2.428 mm

Maximum Supply Current (Isup):

19.5 mA

Surface Mount:

YES

Switcher Config:

BUCK-BOOST

Maximum Switching Frequency:

2000 kHz

Terminal Finish:

Nickel/Gold (Ni/Au)

Terminal Form:

FLAT

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Total Dose (V):

100k Rad(Si)

Width (mm):

6.211 mm

Trade Compliance

TPS7H5002HFT/EM Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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