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TPS7H5002Y/EM

Texas Instruments

TPS7H5002Y/EM by Texas Instruments

TPS7H5002Y/EM by Texas Instruments is a 28-terminal switching controller with a current-mode control mode and pulse width modulation technique. It operates in buck-boost configuration with a max switching frequency of 2000 kHz, suitable for applications requiring a compact rectangular package style and surface mount compatibility.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,115 parts In-Stock

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Digiode

USA . 2,792 parts In-Stock

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2,792

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,031 parts In-Stock

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$4.500

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$4.500

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Semicontronic

India . 1,044 parts In-Stock

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$5.500

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$5.362

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$5.335

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1,044

$5.500

$5.362

$5.335

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One Stop Electronics

USA . 234 parts In-Stock

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$5.500

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234

$5.500

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AZTECH Wire

Italy . 799 parts In-Stock

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$13.852

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799

$13.852

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Corphita

USA . 4,710 parts In-Stock

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Corohmni

South Africa . 303 parts In-Stock

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Overview

Discover the unparalleled quality and reliability of Texas Instruments with the TPS7H5002Y/EM switching regulator. This cutting-edge technology offers countless benefits for a variety of applications, providing customers with exceptional value and performance. Whether you're looking for superior efficiency, precise control, or unmatched versatility, this product is sure to exceed your expectations. Trust Texas Instruments to deliver innovative solutions that set the standard in the industry. Experience the difference with the TPS7H5002Y/EM today.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient installation on a circuit board, saving space and reducing assembly time.

Package Style: UNCASSED CHIP

Provides a compact and lightweight design, suitable for applications where space is limited.

Control Mode: CURRENT-MODE

Offers efficient and stable current control, ensuring reliable performance in various operating conditions.

Max Switching Frequency: 2000 kHz

High switching frequency allows for fast response times and precise regulation of output voltage, improving overall efficiency.

Total Dose: 100k Rad(Si)

Withstands high radiation exposure, making it suitable for use in aerospace or high-energy environments.

Maximum Supply Current: 19.5 mA

Low supply current consumption helps in reducing power consumption and heat dissipation, enhancing energy efficiency.

Control Technique: PULSE WIDTH MODULATION

Offers precise control over the output voltage waveform, allowing for adjustable voltage levels based on application requirements.

Switcher Config: BUCK-BOOST

Versatile configuration supports both step-up and step-down voltage regulation, providing flexibility for various power supply designs.

Minimum Input Voltage: 4 V

Supports a wide input voltage range, making it compatible with different power sources and applications.

Maximum Input Voltage: 14 V

Capable of handling higher input voltages, ensuring compatibility with a range of power sources and operating conditions.

Technical Specifications

Switching Regulators & Controllers TPS7H5002Y/EM attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

14 V

Minimum Input Voltage:

4 V

JESD-30 Code:

R-XUUC-N28

Length:

4.382 mm

No. of Functions:

1

No. of Terminals:

28

Package Body Material:

UNSPECIFIED

Package Code:

UUC

Package Equivalence Code:

DIE OR CHIP

Package Shape:

Package Style (Meter):

UNCASED CHIP

Maximum Supply Current (Isup):

19.5 mA

Surface Mount:

YES

Switcher Config:

BUCK-BOOST

Maximum Switching Frequency:

2000 kHz

Terminal Form:

NO LEAD

Terminal Position:

UNSPECIFIED

Total Dose (V):

100k Rad(Si)

Width (mm):

2.5 mm

Trade Compliance

TPS7H5002Y/EM Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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