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TPS659162RGZR

Texas Instruments

TPS659162RGZR by Texas Instruments

TPS659162RGZR by Texas Instruments is a Power Management IC with 10 channels, 7A max output current, and 3.3V max output voltage. It is used in industrial applications for power supply management circuits due to its wide operating temperature range (-40 to 105°C) and high switching frequency (2700 kHz).

Median Price

$7.124

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,637 parts In-Stock

1+ parts

$7.124

100+ parts

$5.808

1k+ parts

$3.872

10k+ parts

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8,637

$7.124

$5.808

$3.872

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,430 parts In-Stock

1+ parts

$6.768

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-

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4,430

$6.768

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Vyrian

USA . 2,894 parts In-Stock

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2,894

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Distributors (Availability)

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Parana Technologies

USA . 582 parts In-Stock

1+ parts

$4.513

100+ parts

-

1k+ parts

$4.959

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582

$4.513

-

$4.959

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IDEA Electronic Components Group

UK . 2,219 parts In-Stock

1+ parts

$5.071

100+ parts

-

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$4.564

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2,219

$5.071

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$4.564

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ChromeModa Solutions

Germany . 750 parts In-Stock

1+ parts

$5.071

100+ parts

$4.158

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750

$5.071

$4.158

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Ampacity Inc.

Singapore . 8,398 parts In-Stock

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$6.060

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$6.060

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Semicontronic

India . 8,276 parts In-Stock

1+ parts

$6.060

100+ parts

$5.908

1k+ parts

$5.878

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8,276

$6.060

$5.908

$5.878

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Corphita

USA . 2,283 parts In-Stock

1+ parts

$6.412

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2,283

$6.412

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Corohmni

South Africa . 63 parts In-Stock

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$7.124

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63

$7.124

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AZTECH Wire

Italy . 88 parts In-Stock

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$10.660

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Component Stockers USA

USA . 1,314 parts In-Stock

1+ parts

$94.820

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1,314

$94.820

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Futuretech Components

Singapore . 2,500 parts In-Stock

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2,500

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A-Z Elektronik GmbH

Germany . 2,500 parts In-Stock

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Lixinc

USA . 978 parts In-Stock

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978

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DigiPath Technology Company

USA . 98 parts In-Stock

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$4.572

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98

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$4.572

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Overview

Unlock the power of efficient energy management with the TPS659162RGZR by Texas Instruments. This top-quality Power Management IC offers unparalleled reliability and performance, making it the ideal choice for a wide range of applications. With its innovative design and advanced features, this product delivers outstanding value and benefits to customers looking for superior power supply management solutions. Trust Texas Instruments to provide cutting-edge technology that meets your needs and exceeds your expectations. Choose the TPS659162RGZR for unmatched quality and performance in power management ICs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for the package, ensuring long-term reliability and ease of handling.

Nominal Supply Voltage (Vsup): 3.8 V

Optimal supply voltage for efficient power management and operation of the IC.

Maximum Operating Temperature: 105 °C

Wide operating temperature range allows for use in various industrial settings without risk of overheating.

Maximum Output Voltage: 3.3 V

Provides stable and regulated output voltage for connected devices or components.

Maximum Output Current: 7 A

High output current capacity ensures compatibility with a wide range of devices and applications.

Maximum Switching Frequency: 2700 kHz

High switching frequency enables fast and efficient power management operations.

Technical Specifications

Power Management ICs TPS659162RGZR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

10

No. of Functions:

1

No. of Outputs:

10

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

7 A

Maximum Output Voltage:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

3.135 V

Nominal Supply Voltage (Vsup):

3.8 V

Surface Mount:

YES

Maximum Switching Frequency:

2700 kHz

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7 mm

Trade Compliance

TPS659162RGZR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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