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TPS659113A2ZRC

Texas Instruments

TPS659113A2ZRC by Texas Instruments

POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 98; Package Code: VFBGA; Package Shape: RECTANGULAR; Surface Mount: YES;

Median Price

$6.420

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 64 parts In-Stock

1+ parts

$0.608

100+ parts

$0.608

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$0.608

10k+ parts

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64

$0.608

$0.608

$0.608

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Rochester

USA . 83 parts In-Stock

1+ parts

$6.420

100+ parts

$6.290

1k+ parts

$6.160

10k+ parts

-

83

$6.420

$6.290

$6.160

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Farnell

UK . 103 parts In-Stock

1+ parts

$8.150

100+ parts

$6.100

1k+ parts

$4.620

10k+ parts

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103

$8.150

$6.100

$4.620

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 128 parts In-Stock

1+ parts

$7.280

100+ parts

$3.154

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-

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128

$7.280

$3.154

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Vyrian

USA . 8,022 parts In-Stock

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8,022

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Chip Stock

USA . 3,905 parts In-Stock

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Digiode

USA . 1,741 parts In-Stock

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1,741

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ACDS - Activité Composants Distribution Service

France . 128 parts In-Stock

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Dan-Mar Components

USA . 128 parts In-Stock

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128

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Prism Electronics

USA . 53 parts In-Stock

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53

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J2 Sourcing AB

Sweden . 26 parts In-Stock

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Connect4Technologies Inc.

Canada . 9 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 287 parts In-Stock

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$3.500

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287

$3.500

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AZTECH Wire

Italy . 401 parts In-Stock

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$5.546

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401

$5.546

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Parana Technologies

USA . 823 parts In-Stock

1+ parts

$9.621

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$10.215

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823

$9.621

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$10.215

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DigiPath Technology Company

USA . 2,012 parts In-Stock

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$10.594

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$10.594

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IDEA Electronic Components Group

UK . 1,449 parts In-Stock

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$10.810

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$10.270

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$9.729

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1,449

$10.810

$10.270

$9.729

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ChromeModa Solutions

Germany . 1,416 parts In-Stock

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$10.810

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$8.864

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1,416

$10.810

$8.864

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S.R.D Solutions

India . 30,000 parts In-Stock

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,248 parts In-Stock

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Corphita

USA . 3,515 parts In-Stock

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Perfect Parts

USA . 2,871 parts In-Stock

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Kepictronics

USA . 720 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 240 parts In-Stock

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240

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Microchip USA

USA . 142 parts In-Stock

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Ashlea Components Ltd (Excess)

UK . 100 parts In-Stock

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100

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Speed Components Ltd (Excess)

Israel . 79 parts In-Stock

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Technical Specifications

Power Management ICs TPS659113A2ZRC attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PBGA-B98

JESD-609 Code:

e1

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

98

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Voltage:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Current (Isup):

.5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Surface Mount:

YES

Maximum Switching Frequency:

3000 kHz

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

6 mm

Trade Compliance

TPS659113A2ZRC Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

5A991.G

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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