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TPS6591102A2ZRC

Texas Instruments

TPS6591102A2ZRC by Texas Instruments

TPS6591102A2ZRC by Texas Instruments is a Power Management IC with 98 terminals, operating at -40 to 85°C. It has a supply voltage range of 2.7V to 5.5V and features adjustable threshold levels for industrial applications requiring precise power supply management in compact spaces.

Median Price

$5.520

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 720 parts In-Stock

1+ parts

-

100+ parts

$4.780

1k+ parts

$4.280

10k+ parts

$4.020

720

-

$4.780

$4.280

$4.020

DigiKey

USA . 720 parts In-Stock

1+ parts

-

100+ parts

$5.520

1k+ parts

-

10k+ parts

-

720

-

$5.520

-

-

Verical

USA . 720 parts In-Stock

1+ parts

-

100+ parts

$5.975

1k+ parts

$5.350

10k+ parts

$5.025

720

-

$5.975

$5.350

$5.025

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,330 parts In-Stock

1+ parts

$5.044

100+ parts

-

1k+ parts

-

10k+ parts

-

1,330

$5.044

-

-

-

Vyrian

USA . 8,142 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,142

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 592 parts In-Stock

1+ parts

$4.510

100+ parts

$4.397

1k+ parts

$4.375

10k+ parts

-

592

$4.510

$4.397

$4.375

-

Ampacity Inc.

Singapore . 481 parts In-Stock

1+ parts

$4.510

100+ parts

-

1k+ parts

-

10k+ parts

-

481

$4.510

-

-

-

Corphita

USA . 4,738 parts In-Stock

1+ parts

$4.779

100+ parts

-

1k+ parts

-

10k+ parts

-

4,738

$4.779

-

-

-

Corohmni

South Africa . 277 parts In-Stock

1+ parts

$5.310

100+ parts

-

1k+ parts

-

10k+ parts

-

277

$5.310

-

-

-

Parana Technologies

USA . 1,381 parts In-Stock

1+ parts

$14.899

100+ parts

-

1k+ parts

$15.324

10k+ parts

-

1,381

$14.899

-

$15.324

-

DigiPath Technology Company

USA . 372 parts In-Stock

1+ parts

$16.405

100+ parts

$15.093

1k+ parts

-

10k+ parts

-

372

$16.405

$15.093

-

-

ChromeModa Solutions

Germany . 4,954 parts In-Stock

1+ parts

$16.740

100+ parts

$13.727

1k+ parts

-

10k+ parts

-

4,954

$16.740

$13.727

-

-

IDEA Electronic Components Group

UK . 1,383 parts In-Stock

1+ parts

$16.740

100+ parts

$15.903

1k+ parts

$15.066

10k+ parts

-

1,383

$16.740

$15.903

$15.066

-

Microchip USA

USA . 334 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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334

-

-

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Kepictronics

USA . 67 parts In-Stock

1+ parts

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67

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Overview

Elevate your power management capabilities with the TPS6591102A2ZRC from Texas Instruments. Designed with precision and quality in mind, this Power Management IC boasts a wide range of applications, offering customers unparalleled value and benefits. With its advanced features and innovative design, this product ensures optimal performance and reliability, making it a must-have for any industrial setting. Trust in Texas Instruments to deliver cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy body material provides good durability and reliability for the Power Management IC.

Surface Mount: YES

Surface mount capability makes it easy to integrate this Power Management IC into various electronic devices.

Nominal Supply Voltage (Vsup): 3.8 V

Suitable nominal supply voltage for powering electronic components efficiently.

No. of Terminals: 98

Having a high number of terminals allows for a more complex and versatile circuit design.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in challenging environments.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures allows for use in various climates and conditions.

Terminal Finish: TIN SILVER COPPER

Tin Silver Copper terminal finish provides good conductivity and reliability for signal transmission.

Maximum Seated Height: 1 mm

Low seated height makes it suitable for compact electronic devices with limited space.

Width (mm): 6 mm

Compact width allows for easy integration into different electronic systems.

Minimum Supply Voltage (Vsup): 2.7 V

Low minimum supply voltage ensures efficient power management for electronic components.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for a sufficient time at peak reflow temperature during assembly for proper soldering.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures robust soldering connections for long-term reliability.

Length: 9 mm

Optimal length for accommodating the necessary circuit components in a compact design.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures stability and performance in demanding industrial environments.

Terminal Form: BALL

Ball terminal form provides good connectivity and soldering capability.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for precise connections and saves space on the PCB.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 ensures protection against humidity and moisture-related issues.

Maximum Supply Voltage (Vsup): 5.5 V

High maximum supply voltage allows for flexibility in powering various electronic components.

Adjustable Threshold: YES

Having an adjustable threshold enables customization and optimization of power management settings.

Technical Specifications

Power Management ICs TPS6591102A2ZRC attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

ALSO OPER FROM SUP VOL 1.7 TO 5.5 V AND 1.4 TO 3.6 V; THRESHOLD VOL ARE 3.5V, 3.45V, 2.55V AND 2.5V

Adjustable Threshold:

YES

JESD-30 Code:

R-PBGA-B98

JESD-609 Code:

e1

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

98

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

6 mm

Trade Compliance

TPS6591102A2ZRC Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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