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TPS65910AA1RSL

Texas Instruments

TPS65910AA1RSL by Texas Instruments

TPS65910AA1RSL by Texas Instruments is a Power Management IC with a nominal voltage of 3.6V and max output current of 1.5A. It is used as a power supply support circuit in industrial applications.

Median Price

$4.894

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 46,705 parts In-Stock

1+ parts

$4.438

100+ parts

$3.889

1k+ parts

$2.197

10k+ parts

-

46,705

$4.438

$3.889

$2.197

-

DigiKey

USA . 111 parts In-Stock

1+ parts

$5.350

100+ parts

$3.536

1k+ parts

$3.148

10k+ parts

$2.988

111

$5.350

$3.536

$3.148

$2.988

Mouser Electronics

USA . 73 parts In-Stock

1+ parts

$5.350

100+ parts

$3.540

1k+ parts

$3.140

10k+ parts

$3.040

73

$5.350

$3.540

$3.140

$3.040

Chip1Stop

Japan . 360 parts In-Stock

1+ parts

-

100+ parts

$2.626

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-

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360

-

$2.626

-

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Distributors (In-Stock)

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$3.296

100+ parts

-

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300

$3.296

-

-

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Digiode

USA . 2,290 parts In-Stock

1+ parts

$4.216

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-

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2,290

$4.216

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Chip Stock

USA . 3,500 parts In-Stock

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3,500

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Vyrian

USA . 3,216 parts In-Stock

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3,216

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TME

Poland . 420 parts In-Stock

1+ parts

-

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$4.590

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$4.590

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420

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$4.590

$4.590

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J2 Sourcing AB

Sweden . 373 parts In-Stock

1+ parts

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373

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Distributors (Availability)

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Ampacity Inc.

Singapore . 11,778 parts In-Stock

1+ parts

$2.230

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-

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11,778

$2.230

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Semicontronic

India . 11,489 parts In-Stock

1+ parts

$2.230

100+ parts

$2.174

1k+ parts

$2.163

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11,489

$2.230

$2.174

$2.163

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Continental Prestige Electronics

USA . 5,233 parts In-Stock

1+ parts

$3.296

100+ parts

-

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$3.230

5,233

$3.296

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-

$3.230

Argo Parts USA

USA . 4,082 parts In-Stock

1+ parts

$3.296

100+ parts

-

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4,082

$3.296

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Netroflash

USA . 2,000 parts In-Stock

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$3.296

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2,000

$3.296

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Corohmni

South Africa . 297 parts In-Stock

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$3.515

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297

$3.515

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Advanced Electronics

New Zealand . 70 parts In-Stock

1+ parts

$3.620

100+ parts

$3.439

1k+ parts

$3.439

10k+ parts

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70

$3.620

$3.439

$3.439

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Corphita

USA . 3,577 parts In-Stock

1+ parts

$3.994

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3,577

$3.994

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Parana Technologies

USA . 2,004 parts In-Stock

1+ parts

$7.690

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-

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$8.217

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2,004

$7.690

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$8.217

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DigiPath Technology Company

USA . 315 parts In-Stock

1+ parts

$8.467

100+ parts

$7.790

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315

$8.467

$7.790

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ChromeModa Solutions

Germany . 6,866 parts In-Stock

1+ parts

$8.640

100+ parts

$7.085

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6,866

$8.640

$7.085

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IDEA Electronic Components Group

UK . 728 parts In-Stock

1+ parts

$8.640

100+ parts

$8.208

1k+ parts

$7.776

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728

$8.640

$8.208

$7.776

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Robosynatics

Brazil . 5,713 parts In-Stock

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5,713

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Lucentia Tech

USA . 5,713 parts In-Stock

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$3.445

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$3.374

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$3.374

5,713

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$3.445

$3.374

$3.374

Perfect Parts

USA . 3,920 parts In-Stock

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Lixinc

USA . 2,520 parts In-Stock

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Kepictronics

USA . 516 parts In-Stock

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516

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Overview

Experience power efficiency like never before with the TPS65910AA1RSL by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in all their products. The TPS65910AA1RSL falls under the category of Power Management ICs, offering a wide range of applications for various electronic devices. With its compact square shape and surface mount capability, this product provides convenience and flexibility in design. Its impressive features include a nominal supply voltage of 3.6V, maximum output voltage of 3.3V, and a maximum output current of 1.5A. Whether you're working on industrial or consumer electronics, the TPS65910AA1RSL delivers exceptional performance and efficiency. Trust Texas Instruments to provide you with the best solutions for your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body material provides durability and resistance to external factors, making this product suitable for various applications.

Surface Mount: YES

With surface mount capability, this power management IC can be easily mounted onto circuit boards, enabling efficient and compact designs.

Package Shape: SQUARE

The square shape allows for space-saving integration and efficient utilization of board space in electronic applications.

Nominal Supply Voltage (Vsup): 3.6 V

The 3.6V supply voltage ensures compatibility with a wide range of electronic devices and provides stable power distribution.

Power Supplies (V): 3.6

This product supports power supplies with a voltage rating of 3.6V, making it ideal for use in portable electronic devices.

No. of Terminals: 48

With 48 terminals, this power management IC provides a sufficient number of connection points for efficient power management and control.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier package style along with the heat sink/slug design and very thin profile ensure effective heat dissipation and compact size, enhancing overall performance and reliability.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C guarantees reliable operation even under demanding conditions.

Minimum Output Voltage: 0.6 V

The minimum output voltage of 0.6V ensures efficient power delivery and compatibility with low-power devices.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this power management IC can withstand extreme cold environments without compromising its functionality.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of nickel/palladium/gold provides excellent conductivity, corrosion resistance, and durability, ensuring reliable electrical connections.

Maximum Output Voltage: 3.3 V

The maximum output voltage of 3.3V supports various electronic devices and offers flexibility in power supply configurations.

Terminal Position: QUAD

The quad terminal position facilitates easy and efficient connection of external components, simplifying the overall design and assembly process.

Maximum Seated Height: 1 mm

The maximum seated height of 1mm allows for compact integration and space-constrained applications.

Width (mm): 6 mm

The 6mm width provides a compact form factor, making this power management IC suitable for space-limited electronic designs.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This power management IC not only provides power regulation but also includes additional support circuitry, enhancing overall system performance and stability.

Minimum Supply Voltage (Vsup): 1.7 V

The low minimum supply voltage requirement of 1.7V allows for compatibility with a wide range of power sources and ensures efficient power utilization.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for reliable soldering during the manufacturing process, ensuring robust connections.

Length: 6 mm

With a length of 6mm, this power management IC offers a compact size, enabling versatile integration in various electronic applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance and durability in harsh operating environments.

Maximum Switching Frequency: 3000 kHz

The high maximum switching frequency of 3000 kHz allows for efficient power conversion and control, enabling high-performance applications.

Maximum Output Current: 1.5 A

With a maximum output current of 1.5A, this power management IC can deliver sufficient power to drive various components and devices reliably.

Terminal Form: NO LEAD

The no lead terminal form improves reliability and thermal dissipation, making this product suitable for high-speed and high-temperature applications.

Terminal Pitch: 0.4 mm

The small terminal pitch of 0.4mm enables dense packaging and compact board designs, especially for space-constrained applications.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 ensures that the power management IC can withstand certain levels of moisture during storage and operation, preventing damage and ensuring long-term reliability.

Maximum Supply Voltage (Vsup): 5.5 V

With a wide maximum supply voltage range of 5.5V, this power management IC can be used in diverse applications that require different power input levels.

No. of Outputs: 12

The 12 outputs of this power management IC provide versatile power distribution options, enabling multi-device support and flexible circuit designs.

Adjustable Threshold: YES

The adjustable threshold feature allows for customization and optimization of power management parameters, enhancing adaptability and performance for specific applications.

Technical Specifications

Power Management ICs TPS65910AA1RSL attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Outputs:

12

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1.5 A

Maximum Output Voltage:

3.3 V

Minimum Output Voltage:

.6 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.24SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.6

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Maximum Switching Frequency:

3000 kHz

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

6 mm

Trade Compliance

TPS65910AA1RSL Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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