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TPS658643ZGUR

Texas Instruments

TPS658643ZGUR by Texas Instruments

TPS658643ZGUR by Texas Instruments is a Power Management IC with 169 terminals in a low profile, fine pitch grid array package. It operates b/w -40 to 85°C, providing output voltage range of 0.725V to 3.3V at max current of 2A. Ideal for industrial power supply support circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,719 parts In-Stock

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Digiode

USA . 1,539 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 1,365 parts In-Stock

1+ parts

$4.500

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$4.500

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Ampacity Inc.

Singapore . 543 parts In-Stock

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$5.500

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543

$5.500

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Semicontronic

India . 1,290 parts In-Stock

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$6.500

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$6.338

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$6.305

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$6.500

$6.338

$6.305

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Parana Technologies

USA . 50 parts In-Stock

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$7.165

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$7.674

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50

$7.165

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$7.674

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ChromeModa Solutions

Germany . 3,396 parts In-Stock

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$8.051

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$6.602

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$8.051

$6.602

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IDEA Electronic Components Group

UK . 1,970 parts In-Stock

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$8.051

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$7.246

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$8.051

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AZTECH Wire

Italy . 216 parts In-Stock

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$14.064

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Corphita

USA . 802 parts In-Stock

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DigiPath Technology Company

USA . 506 parts In-Stock

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$7.259

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Microchip USA

USA . 451 parts In-Stock

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Corohmni

South Africa . 182 parts In-Stock

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Overview

Unlock the full potential of your power management systems with the TPS658643ZGUR by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge Power Management ICs designed to optimize performance in a wide range of applications. Whether you're looking to enhance efficiency in industrial settings or streamline operations in consumer electronics, this product offers unmatched value, benefits, and advantages. Say goodbye to downtime and hello to seamless power management solutions with the TPS658643ZGUR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in this package body provides durability and protection for the internal components of the power management IC, making it a reliable choice for various applications.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on circuit boards, saving space and enabling efficient PCB design.

No. of Terminals: 169

With a high number of terminals, this power management IC offers versatility in connections and functionality, allowing for more complex power management solutions.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures the power management IC can function reliably in various operating environments without overheating.

Minimum Output Voltage: 0.725 V

The low minimum output voltage of 0.725 V makes this power management IC suitable for applications requiring low power consumption and efficient power delivery.

Maximum Output Current: 2 A

With a maximum output current of 2 A, this power management IC can support high power demand applications, making it versatile for a range of power management requirements.

Maximum Output Voltage: 3.3 V

The maximum output voltage of 3.3 V makes this power management IC suitable for applications requiring higher voltage levels, providing flexibility in power supply options.

Maximum Seated Height: 1.4 mm

The low maximum seated height of 1.4 mm allows for a compact and space-saving design, making this power management IC suitable for applications with limited space constraints.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this power management IC is less susceptible to moisture-induced damage, ensuring long-term reliability in various environmental conditions.

Adjustable Threshold: YES

The ability to adjust the threshold settings of this power management IC allows for customization and fine-tuning of power management parameters, making it adaptable to different system requirements.

Technical Specifications

Power Management ICs TPS658643ZGUR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PBGA-B169

JESD-609 Code:

e1

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

14

No. of Functions:

1

No. of Terminals:

169

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

2 A

Maximum Output Voltage:

3.3 V

Minimum Output Voltage:

.725 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

12 mm

Trade Compliance

TPS658643ZGUR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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