Loading...

TPS658623ZGUT

Texas Instruments

TPS658623ZGUT by Texas Instruments

TPS658623ZGUT by Texas Instruments is a Power Management IC with 169 terminals in a square package. It operates b/w -40 to 85°C, supporting 14 channels and adjustable threshold voltage from 2.3V to 5.5V. Ideal for industrial applications requiring low profile and fine pitch grid array packages.

Median Price

$10.050

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 607 parts In-Stock

1+ parts

$13.030

100+ parts

$10.110

1k+ parts

-

10k+ parts

-

607

$13.030

$10.110

-

-

Rochester

USA . 2,174 parts In-Stock

1+ parts

-

100+ parts

$8.040

1k+ parts

$7.190

10k+ parts

$6.770

2,174

-

$8.040

$7.190

$6.770

Verical

USA . 1,674 parts In-Stock

1+ parts

-

100+ parts

$10.050

1k+ parts

$8.988

10k+ parts

$8.463

1,674

-

$10.050

$8.988

$8.463

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,558 parts In-Stock

1+ parts

$8.484

100+ parts

-

1k+ parts

-

10k+ parts

-

1,558

$8.484

-

-

-

Bristol Electronics

USA . 250 parts In-Stock

1+ parts

$9.375

100+ parts

$5.625

1k+ parts

$5.391

10k+ parts

-

250

$9.375

$5.625

$5.391

-

Vyrian

USA . 4,300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,300

-

-

-

-

DigiKey Marketplace

USA . 2,174 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,174

-

-

-

-

Dan-Mar Components

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

250

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,668 parts In-Stock

1+ parts

$8.037

100+ parts

-

1k+ parts

-

10k+ parts

-

1,668

$8.037

-

-

-

Parana Technologies

USA . 2,162 parts In-Stock

1+ parts

$9.111

100+ parts

-

1k+ parts

$9.765

10k+ parts

-

2,162

$9.111

-

$9.765

-

DigiPath Technology Company

USA . 631 parts In-Stock

1+ parts

$10.032

100+ parts

$9.230

1k+ parts

-

10k+ parts

-

631

$10.032

$9.230

-

-

ChromeModa Solutions

Germany . 5,473 parts In-Stock

1+ parts

$10.237

100+ parts

$8.394

1k+ parts

-

10k+ parts

-

5,473

$10.237

$8.394

-

-

IDEA Electronic Components Group

UK . 183 parts In-Stock

1+ parts

$10.237

100+ parts

$9.725

1k+ parts

$9.213

10k+ parts

-

183

$10.237

$9.725

$9.213

-

Perfect Parts

USA . 1,382 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,382

-

-

-

-

Microchip USA

USA . 231 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

231

-

-

-

-

Kepictronics

USA . 230 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

230

-

-

-

-

Overview

Discover the powerful TPS658623ZGUT by Texas Instruments, a top-of-the-line Power Management IC that promises reliability and efficiency. With Texas Instruments' renowned reputation for quality, this versatile device is perfect for a wide range of applications. From power supply support circuits to industrial-grade settings, this product offers unmatched value with its adjustable threshold and maximum supply voltage of 5.5V. Experience the benefits of superior technology and performance with the TPS658623ZGUT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material is commonly used in power management ICs as it provides good insulation and protection for the integrated circuits, ensuring reliable performance.

Surface Mount: YES

Surface mount technology allows for easy and convenient mounting of the IC on a PCB, saving space and enabling automated assembly processes.

Package Shape: SQUARE

Square packages are preferred for power management ICs as they offer a good balance between size and ease of manufacturing.

No. of Terminals: 169

High number of terminals allow for more connectivity options and flexibility in designing power supply circuits.

Maximum Operating Temperature: 85 °C

Higher maximum operating temperature ensures that the IC can withstand demanding environmental conditions and operate reliably in industrial settings.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature extends the range of applications for the power management IC, making it suitable for use in extreme cold environments.

Terminal Finish: TIN SILVER COPPER

Multi-layer terminal finish provides good conductivity and corrosion resistance, ensuring stable electrical connections over time.

Terminal Position: BOTTOM

Bottom terminal position enables easy and reliable connection to the PCB, facilitating efficient heat dissipation and signal routing.

Width (mm): 12 mm

Compact width allows for space-efficient PCB layout and integration of multiple components in power supply circuits.

Minimum Supply Voltage (Vsup): 2.3 V

Low minimum supply voltage enables the IC to operate efficiently with a wide range of power sources, making it versatile and adaptable to different applications.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak reflow temperature ensures proper soldering of the IC during manufacturing, enhancing reliability and performance.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for robust solder joints and thorough PCB assembly, ensuring long-term durability of the power management IC.

Temperature Grade: INDUSTRIAL

Industrial temperature grade certifies that the IC can operate reliably in harsh industrial environments with wide temperature fluctuations, making it suitable for rugged applications.

No. of Channels: 14

Multiple channels provide the capability to regulate and control various power supply outputs simultaneously, enhancing the versatility and functionality of the IC.

Terminal Form: BALL

Ball terminal form offers high reliability and robustness in surface mount applications, ensuring secure connections and efficient heat dissipation.

Terminal Pitch: 0.8 mm

Fine terminal pitch allows for high-density mounting of the IC on the PCB, enabling compact and space-efficient design of power management circuits.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the IC can withstand moderate exposure to moisture during handling and storage, ensuring operational integrity and reliability.

Maximum Supply Voltage (Vsup): 5.5 V

High maximum supply voltage capability allows the IC to handle a wide range of input voltages, making it versatile and adaptable to various power source requirements.

Adjustable Threshold: YES

Adjustable threshold feature enables fine-tuning of voltage regulation and protection settings, allowing for customized power management solutions tailored to specific application requirements.

Technical Specifications

Power Management ICs TPS658623ZGUT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PBGA-B169

JESD-609 Code:

e1

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

14

No. of Functions:

1

No. of Terminals:

169

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

12 mm

Trade Compliance

TPS658623ZGUT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20