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TPS650243RHBT

Texas Instruments

TPS650243RHBT by Texas Instruments

TPS650243RHBT by Texas Instruments is a Power Management IC with 32 terminals, operating voltage of 3.6V, and max output current of 1.6A. Ideal for industrial applications requiring a compact chip carrier package with adjustable threshold and high switching frequency up to 2550 kHz.

Median Price

$5.984

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 46 parts In-Stock

1+ parts

$2.940

100+ parts

$2.880

1k+ parts

$2.820

10k+ parts

-

46

$2.940

$2.880

$2.820

-

Texas Instruments

USA . 23,573 parts In-Stock

1+ parts

$4.848

100+ parts

$3.953

1k+ parts

$2.635

10k+ parts

-

23,573

$4.848

$3.953

$2.635

-

DigiKey

USA . 18 parts In-Stock

1+ parts

$7.120

100+ parts

-

1k+ parts

$4.230

10k+ parts

$4.117

18

$7.120

-

$4.230

$4.117

Mouser Electronics

USA . 500 parts In-Stock

1+ parts

$9.650

100+ parts

$5.990

1k+ parts

$4.600

10k+ parts

-

500

$9.650

$5.990

$4.600

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,657 parts In-Stock

1+ parts

$3.477

100+ parts

-

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2,657

$3.477

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-

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Vyrian

USA . 6,968 parts In-Stock

1+ parts

-

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-

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6,968

-

-

-

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Speed Components Ltd

Israel . 306 parts In-Stock

1+ parts

-

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306

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-

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LIBRA Elektronik GmbH

Germany . 186 parts In-Stock

1+ parts

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186

-

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ComSIT Distribution GmbH

Germany . 94 parts In-Stock

1+ parts

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94

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ComSIT USA

USA . 94 parts In-Stock

1+ parts

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94

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Sensible Micro Corp

USA . 50 parts In-Stock

1+ parts

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100+ parts

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50

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EMSNET

USA . 50 parts In-Stock

1+ parts

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,943 parts In-Stock

1+ parts

$2.477

100+ parts

-

1k+ parts

$2.969

10k+ parts

-

1,943

$2.477

-

$2.969

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DigiPath Technology Company

USA . 488 parts In-Stock

1+ parts

$2.727

100+ parts

$2.509

1k+ parts

-

10k+ parts

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488

$2.727

$2.509

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-

ChromeModa Solutions

Germany . 1,025 parts In-Stock

1+ parts

$2.783

100+ parts

$2.282

1k+ parts

-

10k+ parts

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1,025

$2.783

$2.282

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IDEA Electronic Components Group

UK . 71 parts In-Stock

1+ parts

$2.783

100+ parts

-

1k+ parts

$2.505

10k+ parts

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71

$2.783

-

$2.505

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Corphita

USA . 4,397 parts In-Stock

1+ parts

$3.294

100+ parts

-

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10k+ parts

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4,397

$3.294

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QUARKTWIN TECHNOLOGY LTD

USA . 20,753 parts In-Stock

1+ parts

-

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20,753

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Metaverse IC Inc.

Canada . 195 parts In-Stock

1+ parts

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195

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Overview

Experience unparalleled power management with the TPS650243RHBT by Texas Instruments, a leader in innovative technology. This Power Management IC boasts top-notch quality and reliability, making it a superior choice for a wide range of applications. With its compact design and advanced features, this product offers unmatched value and efficiency, providing customers with a seamless and optimized solution for all their power management needs. Trust Texas Instruments to deliver excellence in every detail.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making it a practical choice for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly, reducing manufacturing time and cost.

Nominal Supply Voltage (Vsup): 3.6 V

The nominal supply voltage of 3.6V offers compatibility with a variety of electronic devices and systems.

No. of Terminals: 32

Having a higher number of terminals allows for more functionality and connectivity options in the circuit design.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding industrial environments.

Minimum Output Voltage: 0.6 V

The low minimum output voltage capability makes this power management IC suitable for low-power applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Maximum Output Voltage: 6 V

The high maximum output voltage capability makes this IC versatile for a wide range of voltage requirements.

Maximum Supply Current (Isup): 2.5 mA

The low supply current helps in reducing power consumption and improving efficiency.

Maximum Output Current: 1.6 A

The high output current rating allows this IC to power a wide range of loads.

No. of Channels: 2

Having multiple channels allows for more flexibility in power distribution and control.

Maximum Switching Frequency: 2550 kHz

The high switching frequency enables fast response times and efficient power management.

Adjustable Threshold: YES

The ability to adjust the threshold allows for customization and optimization of the power management system.

Technical Specifications

Power Management ICs TPS650243RHBT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

1

No. of Outputs:

6

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1.6 A

Maximum Output Voltage:

6 V

Minimum Output Voltage:

.6 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.6

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

2.5 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Maximum Switching Frequency:

2550 kHz

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

5 mm

Trade Compliance

TPS650243RHBT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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