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TPS65013RGZR

Texas Instruments

TPS65013RGZR by Texas Instruments

TPS65013RGZR by Texas Instruments is a Power Management IC with 48 terminals, operating at -40 to 85°C. It offers a max output current of 1A and supports up to 4 outputs. Ideal for industrial applications requiring a supply voltage range of 2.5V to 6.5V and adjustable threshold capabilities.

Median Price

$3.719

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 27,000 parts In-Stock

1+ parts

$3.719

100+ parts

$3.032

1k+ parts

$2.021

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27,000

$3.719

$3.032

$2.021

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Distributors (In-Stock)

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Digiode

USA . 821 parts In-Stock

1+ parts

$3.533

100+ parts

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821

$3.533

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Vyrian

USA . 8,992 parts In-Stock

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8,992

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Bristol Electronics

USA . 2,570 parts In-Stock

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2,570

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Microfarads

USA . 1,139 parts In-Stock

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1,139

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Distributors (Availability)

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Corphita

USA . 3,001 parts In-Stock

1+ parts

$3.347

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3,001

$3.347

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AZTECH Wire

Italy . 1,066 parts In-Stock

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$8.390

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1,066

$8.390

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Parana Technologies

USA . 1,494 parts In-Stock

1+ parts

$15.086

100+ parts

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$15.496

10k+ parts

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1,494

$15.086

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$15.496

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ChromeModa Solutions

Germany . 2,656 parts In-Stock

1+ parts

$16.950

100+ parts

$13.899

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2,656

$16.950

$13.899

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IDEA Electronic Components Group

UK . 924 parts In-Stock

1+ parts

$16.950

100+ parts

$16.102

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$15.255

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924

$16.950

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$15.255

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Kepictronics

USA . 56,950 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,749 parts In-Stock

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6,749

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DigiPath Technology Company

USA . 730 parts In-Stock

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$15.282

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730

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$15.282

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Overview

Unlock the power of efficient and reliable power management with the TPS65013RGZR by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers top-quality Power Management ICs that cater to a variety of applications. This chip carrier, heat sink/slug package offers a very thin profile and adjustable threshold, providing customers with flexibility and precision in their power supply support circuit. With a maximum output current of 1A and a maximum switching frequency of 1500 kHz, this industrial-grade solution ensures optimal performance and durability. Experience the value and benefits of Texas Instruments' TPS65013RGZR for your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring long-term reliability.

Surface Mount: YES

Being surface mountable, this product can be easily integrated into PCBs, saving space and facilitating automated assembly processes.

Nominal Supply Voltage (Vsup): 3.6 V

The 3.6V supply voltage allows compatibility with a wide range of electronic devices, making it a versatile choice for power management.

No. of Terminals: 48

With 48 terminals, this power management IC offers multiple connection options for greater flexibility in circuit design.

Maximum Operating Temperature: 85 °C

The high operating temperature range of 85°C ensures reliable performance in various environmental conditions.

Minimum Output Voltage: 0.85 V

The low minimum output voltage of 0.85V enables efficient power conversion for different applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this power management IC can function effectively even in extreme cold conditions.

Maximum Output Voltage: 6.5 V

The high maximum output voltage of 6.5V allows for powering a wide range of electronic components and devices.

Maximum Output Current: 1 A

The maximum output current of 1A ensures sufficient power delivery for various applications, making it a reliable choice for power management.

Maximum Switching Frequency: 1500 kHz

The high switching frequency of 1500kHz enables efficient power regulation and control, enhancing overall performance.

Technical Specifications

Power Management ICs TPS65013RGZR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

1

No. of Outputs:

4

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1 A

Maximum Output Voltage:

6.5 V

Minimum Output Voltage:

.85 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

6.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Maximum Switching Frequency:

1500 kHz

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7 mm

Trade Compliance

TPS65013RGZR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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