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TPS54426EVM-608

Texas Instruments

TPS54426EVM-608 by Texas Instruments

TPS54426EVM-608 by Texas Instruments is a SWIFT™, D-CAP2™ series DC/DC evaluation board with 1.05V output voltage and 4A output current. It operates on 4.5V to 18V input voltage, uses Buck topology at 700kHz switching frequency, and is ideal for DC/DC step-down applications.

Median Price

$53.900

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 15 parts In-Stock

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$49.000

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DigiKey

USA . 2 parts In-Stock

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$58.800

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$58.800

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Digiode

USA . 2,453 parts In-Stock

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$46.550

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2,453

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Vyrian

USA . 7,692 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 9 parts In-Stock

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$41.650

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9

$41.650

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Semicontronic

India . 9 parts In-Stock

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$41.650

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$40.609

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$40.400

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9

$41.650

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$40.400

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Corphita

USA . 2,222 parts In-Stock

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$44.100

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Corohmni

South Africa . 425 parts In-Stock

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$49.000

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425

$49.000

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Component Stockers USA

USA . 1 parts In-Stock

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$57.900

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1

$57.900

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ChromeModa Solutions

Germany . 5,758 parts In-Stock

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Parana Technologies

USA . 889 parts In-Stock

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$0.968

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889

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$0.968

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DigiPath Technology Company

USA . 694 parts In-Stock

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IDEA Electronic Components Group

UK . 303 parts In-Stock

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Perfect Parts

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Overview

Unleash the power of the TPS54426EVM-608 from Texas Instruments and experience unparalleled quality and reliability. Designed for DC/DC step-down applications, this evaluation board is a game-changer in the industry. With advanced features and cutting-edge technology, it offers customers unmatched value and benefits. Perfect for development projects, this SWIFT™ series board delivers a voltage output of 1.05V and a current output of 4A. Trust Texas Instruments to provide you with top-of-the-line solutions for all your power management needs. Elevate your projects with the TPS54426EVM-608 today!

Feature Benefit Bullets

Other Names: TPS54426EVM608, 296-31201, TPS54426EVM-608-ND

Having multiple names makes it easier to search and identify the product.

Category: Development Boards, Kits, Programmers, Evaluation Boards

Being in these categories means the product is designed for testing and evaluation, which is important for product development.

Main Purpose: DC/DC, Step Down

This board is specifically designed for DC/DC step-down applications, ensuring optimal performance.

Voltage - Output: 1.05V

Provides a stable output voltage of 1.05V, suitable for many electronic applications.

Current - Output: 4A

Capable of providing a high output current of 4A, making it suitable for power-hungry devices.

Voltage - Input: 4.5V ~ 18V

Accepts a wide input voltage range of 4.5V to 18V, allowing flexibility in power source selection.

Regulator Topology: Buck

Utilizes a buck regulator topology, which is efficient for step-down voltage conversion.

Frequency - Switching: 700kHz

Operating at a high switching frequency of 700kHz, ensures fast response and minimized ripple in the output.

Technical Specifications

Additional Parts TPS54426EVM-608 attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Main Purpose:

DC/DC, Step Down

Other Names:

TPS54426EVM608
296-31201
TPS54426EVM-608-ND

Category:

Development Boards, Kits, Programmers
Evaluation Boards DC/DC & AC/DC (Off-Line) SMPS Evaluation Boards

Current - Output:

4A

Standard Package:

1

Series:

SWIFT™, D-CAP2™

Regulator Topology:

Buck

Frequency - Switching:

700kHz

Supplied Contents:

Board(s)

Voltage - Output:

1.05V

Board Type:

Fully Populated

Outputs and Type:

1, Non-Isolated

Utilized IC / Part:

TPS54426

Package:

Box

Voltage - Input:

4.5V ~ 18V

Base Product Number:

TPS54426

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TPS54426EVM-608 Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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