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TPS3851G50SQDRBRQ1

Texas Instruments

TPS3851G50SQDRBRQ1 by Texas Instruments

TPS3851G50SQDRBRQ1 by Texas Instruments is a Power Management IC with 5V Nominal Voltage, -40 to 125 °C Operating Temperature Range, and Automotive Grade. It features a Small Outline Square Package with 8 Terminals for power supply management circuits in automotive applications.

Median Price

$1.581

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 22,030 parts In-Stock

1+ parts

$1.662

100+ parts

$1.373

1k+ parts

$0.742

10k+ parts

-

22,030

$1.662

$1.373

$0.742

-

Rochester

USA . 27,000 parts In-Stock

1+ parts

-

100+ parts

$1.450

1k+ parts

$1.200

10k+ parts

$1.070

27,000

-

$1.450

$1.200

$1.070

DigiKey

USA . 27,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.810

10k+ parts

-

27,000

-

-

$1.810

-

Verical

USA . 27,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.500

10k+ parts

$1.337

27,000

-

-

$1.500

$1.337

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,011 parts In-Stock

1+ parts

$0.978

100+ parts

-

1k+ parts

-

10k+ parts

-

4,011

$0.978

-

-

-

DigiKey Marketplace

USA . 27,000 parts In-Stock

1+ parts

-

100+ parts

$1.070

1k+ parts

-

10k+ parts

-

27,000

-

$1.070

-

-

Bristol Electronics

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,000

-

-

-

-

Vyrian

USA . 3,225 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,225

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,170 parts In-Stock

1+ parts

$0.927

100+ parts

-

1k+ parts

-

10k+ parts

-

1,170

$0.927

-

-

-

Parana Technologies

USA . 848 parts In-Stock

1+ parts

$7.830

100+ parts

-

1k+ parts

$8.383

10k+ parts

-

848

$7.830

-

$8.383

-

DigiPath Technology Company

USA . 866 parts In-Stock

1+ parts

$8.622

100+ parts

$7.932

1k+ parts

-

10k+ parts

-

866

$8.622

$7.932

-

-

ChromeModa Solutions

Germany . 4,231 parts In-Stock

1+ parts

$8.798

100+ parts

$7.214

1k+ parts

-

10k+ parts

-

4,231

$8.798

$7.214

-

-

IDEA Electronic Components Group

UK . 73 parts In-Stock

1+ parts

$8.798

100+ parts

$8.358

1k+ parts

$7.918

10k+ parts

-

73

$8.798

$8.358

$7.918

-

Advanced Electronics

New Zealand . 20 parts In-Stock

1+ parts

$9.571

100+ parts

$8.710

1k+ parts

$7.848

10k+ parts

-

20

$9.571

$8.710

$7.848

-

QUARKTWIN TECHNOLOGY LTD

USA . 21,961 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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21,961

-

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Overview

Enhance your automotive power management system with the reliable TPS3851G50SQDRBRQ1 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Power Management ICs that offer exceptional performance and durability. This small outline, heat sink package is perfect for a wide range of applications, providing a nominal supply voltage of 5V and a minimum supply voltage of 1.6V. With a maximum operating temperature of 125°C and automotive-grade reliability, this product ensures optimal functionality in any environment. Trust Texas Instruments for cutting-edge technology that brings value and efficiency to your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for the Power Management IC, ensuring a long lifespan.

Surface Mount: YES

Surface mount capability enables easy and convenient installation of the IC on a circuit board, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 5 V

The 5V nominal supply voltage is a commonly used standard in many electronic devices, making this IC versatile and compatible with a wide range of applications.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this IC can withstand high temperatures, ensuring reliable performance even in demanding environments.

Minimum Operating Temperature: -40 °C

The -40°C minimum operating temperature allows the IC to function effectively in cold conditions, providing versatility for various applications.

Terminal Finish: MATTE TIN

Matte Tin terminal finish provides good solderability and corrosion resistance, ensuring a strong and reliable connection on the circuit board.

Maximum Seated Height: 1 mm

With a low maximum seated height of 1mm, this IC is suitable for compact electronic devices where space is limited.

Minimum Supply Voltage (Vsup): 1.6 V

The 1.6V minimum supply voltage allows for efficient power management and low power consumption, making this IC energy efficient.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures reliable soldering during assembly, leading to a strong bond between the IC and the circuit board.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this IC meets high standards of reliability and durability required for use in vehicles, making it a suitable choice for automotive power management systems.

Technical Specifications

Power Management ICs TPS3851G50SQDRBRQ1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

THRESHOLD VOLTAGE IS 5.0V

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Current (Isup):

.019 mA

Maximum Supply Voltage (Vsup):

6.5 V

Minimum Supply Voltage (Vsup):

1.6 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+5V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

TPS3851G50SQDRBRQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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