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TPS3851G50EQDRBRQ1

Texas Instruments

TPS3851G50EQDRBRQ1 by Texas Instruments

TPS3851G50EQDRBRQ1 by Texas Instruments is a Power Management IC with 5V Nominal Voltage, -40 to 125 °C Operating Temperature Range. It has 8 Terminals, Matte Tin Finish, and is suitable for Automotive applications due to its small size and low supply current of 0.019 mA.

Median Price

$1.581

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 56,195 parts In-Stock

1+ parts

$1.662

100+ parts

$1.373

1k+ parts

$0.742

10k+ parts

-

56,195

$1.662

$1.373

$0.742

-

Rochester

USA . 32,995 parts In-Stock

1+ parts

-

100+ parts

$1.450

1k+ parts

$1.200

10k+ parts

$1.070

32,995

-

$1.450

$1.200

$1.070

DigiKey

USA . 32,995 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.810

10k+ parts

-

32,995

-

-

$1.810

-

Verical

USA . 32,995 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.500

10k+ parts

$1.337

32,995

-

-

$1.500

$1.337

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,770 parts In-Stock

1+ parts

$0.978

100+ parts

-

1k+ parts

-

10k+ parts

-

4,770

$0.978

-

-

-

DigiKey Marketplace

USA . 32,995 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

32,995

-

-

-

-

Vyrian

USA . 5,035 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,035

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,574 parts In-Stock

1+ parts

$0.927

100+ parts

-

1k+ parts

-

10k+ parts

-

2,574

$0.927

-

-

-

Parana Technologies

USA . 1,148 parts In-Stock

1+ parts

$19.649

100+ parts

-

1k+ parts

$19.641

10k+ parts

-

1,148

$19.649

-

$19.641

-

DigiPath Technology Company

USA . 666 parts In-Stock

1+ parts

$21.636

100+ parts

-

1k+ parts

-

10k+ parts

-

666

$21.636

-

-

-

ChromeModa Solutions

Germany . 585 parts In-Stock

1+ parts

$22.078

100+ parts

$18.104

1k+ parts

-

10k+ parts

-

585

$22.078

$18.104

-

-

IDEA Electronic Components Group

UK . 192 parts In-Stock

1+ parts

$22.078

100+ parts

$20.974

1k+ parts

$19.870

10k+ parts

-

192

$22.078

$20.974

$19.870

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QUARKTWIN TECHNOLOGY LTD

USA . 19,655 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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19,655

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-

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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5,000

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Overview

Elevate your power management game with the TPS3851G50EQDRBRQ1 by Texas Instruments. This high-quality Power Management IC offers unmatched reliability and efficiency, perfect for a wide range of automotive applications. With its small outline package and dual terminal position, this IC delivers exceptional performance in a compact design. Trust Texas Instruments for cutting-edge technology that meets your power supply management needs effortlessly. Experience the difference with the TPS3851G50EQDRBRQ1 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and compact integration on PCBs, saving space and assembly time.

Nominal Supply Voltage (Vsup): 5 V

Compatible with common power sources, ensuring wide applicability.

Maximum Operating Temperature: 125 °C

Suitable for use in industrial and automotive environments where high temperatures may be encountered.

Minimum Operating Temperature: -40 °C

Can operate in cold environments without any issues, increasing versatility.

Terminal Finish: MATTE TIN

Matte tin finish helps with solderability and prevents oxidation, ensuring reliable connections.

Maximum Seated Height: 1 mm

Low profile design allows for compact and space-efficient PCB layout.

Minimum Supply Voltage (Vsup): 1.6 V

Allows the product to function even with lower input voltages, increasing flexibility.

Peak Reflow Temperature °C: 260

The product can withstand high reflow temperatures during manufacturing processes, ensuring robustness.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for temperature range and reliability, suitable for automotive applications.

Maximum Supply Current (Isup): 0.019 mA

Low power consumption helps in energy efficiency and prolonging battery life in portable devices.

Moisture Sensitivity Level (MSL): 2

MSL 2 indicates the product can withstand multiple reflows without damage, ensuring reliability in manufacturing processes.

Technical Specifications

Power Management ICs TPS3851G50EQDRBRQ1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

THRESHOLD VOLTAGE IS 5.0V

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Current (Isup):

.019 mA

Maximum Supply Voltage (Vsup):

6.5 V

Minimum Supply Voltage (Vsup):

1.6 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+5V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

TPS3851G50EQDRBRQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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