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TPS3850H30DRCR

Texas Instruments

TPS3850H30DRCR by Texas Instruments

TPS3850H30DRCR by Texas Instruments is a Power Management IC with 3.3V supply voltage, -40 to 125°C operating temperature range, and 10 terminals in a small outline package. Ideal for automotive applications requiring low power consumption and precise supply management in compact spaces.

Median Price

$1.450

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 3,000 parts In-Stock

1+ parts

$0.063

100+ parts

$0.060

1k+ parts

$0.058

10k+ parts

$0.057

3,000

$0.063

$0.060

$0.058

$0.057

Texas Instruments

USA . 44,576 parts In-Stock

1+ parts

$1.611

100+ parts

$1.330

1k+ parts

$0.719

10k+ parts

-

44,576

$1.611

$1.330

$0.719

-

Rochester

USA . 24,000 parts In-Stock

1+ parts

-

100+ parts

$1.400

1k+ parts

$1.160

10k+ parts

$1.040

24,000

-

$1.400

$1.160

$1.040

DigiKey

USA . 24,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.750

10k+ parts

-

24,000

-

-

$1.750

-

Verical

USA . 24,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.450

10k+ parts

$1.300

24,000

-

-

$1.450

$1.300

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,326 parts In-Stock

1+ parts

$0.060

100+ parts

-

1k+ parts

-

10k+ parts

-

4,326

$0.060

-

-

-

DigiKey Marketplace

USA . 24,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

24,000

-

-

-

-

Vyrian

USA . 4,051 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,051

-

-

-

-

ComSIT Distribution GmbH

Germany . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,549 parts In-Stock

1+ parts

$0.057

100+ parts

-

1k+ parts

-

10k+ parts

-

2,549

$0.057

-

-

-

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$17.960

100+ parts

$16.344

1k+ parts

$14.727

10k+ parts

-

1,000

$17.960

$16.344

$14.727

-

Parana Technologies

USA . 1,260 parts In-Stock

1+ parts

$20.534

100+ parts

-

1k+ parts

$20.611

10k+ parts

-

1,260

$20.534

-

$20.611

-

ChromeModa Solutions

Germany . 4,936 parts In-Stock

1+ parts

$23.072

100+ parts

$18.919

1k+ parts

-

10k+ parts

-

4,936

$23.072

$18.919

-

-

IDEA Electronic Components Group

UK . 104 parts In-Stock

1+ parts

$23.072

100+ parts

$21.918

1k+ parts

$20.765

10k+ parts

-

104

$23.072

$21.918

$20.765

-

Perfect Parts

USA . 10,080 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,080

-

-

-

-

DigiPath Technology Company

USA . 1,144 parts In-Stock

1+ parts

-

100+ parts

$20.802

1k+ parts

-

10k+ parts

-

1,144

-

$20.802

-

-

Overview

Experience unmatched quality and reliability with the TPS3850H30DRCR by Texas Instruments. As a leading manufacturer in the industry of Power Management ICs, Texas Instruments delivers top-notch products that meet the highest standards. This small outline, heat sink package offers a wide range of applications, making it versatile for various projects. With a nominal supply voltage of 3.3V and a temperature grade suitable for automotive use, this power supply management circuit provides exceptional performance and efficiency. Trust Texas Instruments to deliver the best solutions for your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the Power Management IC, ensuring long-term reliable performance.

Surface Mount: YES

Enables easy and efficient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 3.3 V

Suitable for a wide range of electronic devices and applications that require a stable power supply at 3.3V.

Maximum Operating Temperature: 125 °C

Allows the Power Management IC to withstand high temperatures, making it suitable for demanding environments and applications.

Minimum Operating Temperature: -40 °C

Capable of functioning in low-temperature conditions, ensuring reliable operation even in extreme cold environments.

Maximum Supply Voltage (Vsup): 6.5 V

Provides flexibility in power supply options, accommodating devices that require a higher voltage input.

Technical Specifications

Power Management ICs TPS3850H30DRCR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-N10

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Current (Isup):

.019 mA

Maximum Supply Voltage (Vsup):

6.5 V

Minimum Supply Voltage (Vsup):

1.6 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

TPS3850H30DRCR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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