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TPS3839K33DQNR

Texas Instruments

TPS3839K33DQNR by Texas Instruments

TPS3839K33DQNR by Texas Instruments is a Power Management IC with a voltage range of 1.2V to 6V, suitable for industrial applications. It features a small outline package style, dual terminal position, and operates in temperatures from -40°C to 85°C. This IC supports power supply circuits with a min supply voltage of 0.9V and max supply current of 0.0005mA.

Median Price

$0.399

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 202,930 parts In-Stock

1+ parts

$0.543

100+ parts

$0.418

1k+ parts

$0.220

10k+ parts

-

202,930

$0.543

$0.418

$0.220

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Arrow

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

$0.255

6,000

-

-

-

$0.255

Distributors (In-Stock)

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Digiode

USA . 2,151 parts In-Stock

1+ parts

$0.516

100+ parts

-

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2,151

$0.516

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Vyrian

USA . 6,477 parts In-Stock

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6,477

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TME

Poland . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

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$0.330

6,000

-

-

-

$0.330

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 104,424 parts In-Stock

1+ parts

$0.217

100+ parts

-

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-

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104,424

$0.217

-

-

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Semicontronic

India . 104,416 parts In-Stock

1+ parts

$0.217

100+ parts

$0.212

1k+ parts

$0.210

10k+ parts

-

104,416

$0.217

$0.212

$0.210

-

Corohmni

South Africa . 107 parts In-Stock

1+ parts

$0.255

100+ parts

-

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107

$0.255

-

-

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Corphita

USA . 1,940 parts In-Stock

1+ parts

$0.489

100+ parts

-

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1,940

$0.489

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-

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Parana Technologies

USA . 419 parts In-Stock

1+ parts

$4.282

100+ parts

-

1k+ parts

$4.711

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419

$4.282

-

$4.711

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DigiPath Technology Company

USA . 2,127 parts In-Stock

1+ parts

$4.715

100+ parts

-

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2,127

$4.715

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ChromeModa Solutions

Germany . 5,603 parts In-Stock

1+ parts

$4.811

100+ parts

$3.945

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-

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5,603

$4.811

$3.945

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IDEA Electronic Components Group

UK . 217 parts In-Stock

1+ parts

$4.811

100+ parts

-

1k+ parts

$4.330

10k+ parts

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217

$4.811

-

$4.330

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AZTECH Wire

Italy . 233 parts In-Stock

1+ parts

$17.400

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233

$17.400

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QUARKTWIN TECHNOLOGY LTD

USA . 21,793 parts In-Stock

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21,793

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Perfect Parts

USA . 10,080 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,500 parts In-Stock

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6,500

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Lixinc

USA . 5,848 parts In-Stock

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5,848

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Component Stockers USA

USA . 5,692 parts In-Stock

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5,692

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Futuretech Components

Singapore . 5,000 parts In-Stock

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Microchip USA

USA . 3,661 parts In-Stock

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3,661

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Metaverse IC Inc.

Canada . 3,000 parts In-Stock

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3,000

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Kepictronics

USA . 2,057 parts In-Stock

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2,057

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Authorized Procurement Solutions

USA . 959 parts In-Stock

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959

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Overview

Experience unparalleled power management with the TPS3839K33DQNR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability in their Power Management ICs. This compact and versatile product is perfect for a wide range of applications, offering customers exceptional value and benefits. Trust in Texas Instruments to provide you with the best solutions for your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Enables easy and efficient installation on circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

Allows for a compact design that is space-efficient and can be easily integrated into various electronic devices.

Power Supplies (V): 1.2/6

Supports a wide range of power supply voltages, making it versatile and compatible with different applications.

No. of Terminals: 4

Simplifies the connection process and reduces the risk of errors during installation.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Enhances thermal management and overall performance of the product, ensuring efficient power distribution.

Maximum Operating Temperature: 85 °C

Allows the product to operate effectively in high-temperature environments, ensuring reliability under various conditions.

Minimum Operating Temperature: -40 °C

Ensures functionality even in low-temperature conditions, making it suitable for a wide range of applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides excellent conductivity and corrosion resistance, maintaining optimal performance over time.

Terminal Position: DUAL

Facilitates easy connection and compatibility with different circuit configurations, enhancing flexibility in usage.

Maximum Seated Height: 0.4 mm

Contributes to the compact design of the product, allowing for installation in tight spaces.

Width (mm): 1 mm

Contributes to the slim profile of the product, making it suitable for compact electronic devices.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Provides additional support for power supply functions, enhancing the overall efficiency and reliability of the product.

Minimum Supply Voltage (Vsup): 0.9 V

Allows for operation at low voltage levels, suitable for energy-efficient applications.

Peak Reflow Temperature °C: 260

Ensures the product can withstand high-temperature reflow soldering processes, facilitating manufacturing.

Length: 1 mm

Contributes to the compact design of the product, enabling easy integration into electronic devices with limited space.

Nominal Threshold Voltage (V): +2.93V

Provides a stable reference voltage for consistent performance and accurate power management.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring reliability and longevity in tough conditions.

Maximum Supply Current (Isup): 0.0005 mA

Maintains low power consumption, making the product energy-efficient and cost-effective.

Terminal Form: NO LEAD

Reduces environmental impact and complies with lead-free regulations, promoting sustainability.

Terminal Pitch: 0.65 mm

Optimizes space efficiency and facilitates easy connection with other components on the circuit board.

Maximum Supply Voltage (Vsup): 6.5 V

Supports a high supply voltage range, making it suitable for a wide range of electronic devices and applications.

Technical Specifications

Power Management ICs TPS3839K33DQNR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.93V

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-N4

JESD-609 Code:

e4

Length:

1 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC4,.04,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/6

Qualification:

Not Qualified

Maximum Seated Height:

.4 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0005 mA

Maximum Supply Voltage (Vsup):

6.5 V

Minimum Supply Voltage (Vsup):

.9 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.93V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1 mm

Trade Compliance

TPS3839K33DQNR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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