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TPS3838L30QDBVRQ1

Texas Instruments

TPS3838L30QDBVRQ1 by Texas Instruments

TPS3838L30QDBVRQ1 by Texas Instruments is a power management IC with a nominal voltage of 1.8V and max operating temperature of 125°C. It is commonly used as a power supply support circuit in automotive applications.

Median Price

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4

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1k+

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Vyrian

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Nova Conductors

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Ampacity Inc.

Singapore . 746 parts In-Stock

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$5.500

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One Stop Electronics

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$6.500

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Parana Technologies

USA . 2,134 parts In-Stock

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DigiPath Technology Company

USA . 442 parts In-Stock

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$15.149

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$13.937

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IDEA Electronic Components Group

UK . 2,310 parts In-Stock

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$14.685

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$13.912

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ChromeModa Solutions

Germany . 2,222 parts In-Stock

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$15.458

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$12.676

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AZTECH Wire

Italy . 836 parts In-Stock

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Perfect Parts

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Argo Parts USA

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Corphita

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Continental Prestige Electronics

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Microchip USA

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Overview

Experience the superior quality and reliability of Texas Instruments with the TPS3838L30QDBVRQ1 power management IC. Designed to meet stringent automotive standards, this small outline, low profile package offers impressive performance and versatility. With a nominal supply voltage of 1.8V and maximum supply voltage of 6V, this power supply support circuit is perfect for a range of applications. Whether you need to monitor voltage levels in automotive systems or ensure proper power sequencing in industrial equipment, the TPS3838L30QDBVRQ1 provides the value, benefits, and advantages you're looking for. Trust in Texas Instruments for your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides excellent durability and protection for the power management IC, making it suitable for various applications.

Surface Mount: YES

With surface mount capability, this power management IC can be easily mounted onto circuit boards, enabling efficient and space-saving integration into electronic devices.

No. of Functions: 1

This power management IC offers a single integrated function, allowing for simplified circuit designs and reducing the overall complexity of the system.

Screening Level: AEC-Q100

Meeting the AEC-Q100 screening level ensures that this power management IC is suitable for automotive applications, guaranteeing high reliability and performance even in harsh operating conditions.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easy placement and alignment during manufacturing processes, enhancing production efficiency and reducing assembly errors.

Nominal Supply Voltage (Vsup): 1.8 V

With a nominal supply voltage of 1.8V, this power management IC is designed to operate within a specific voltage range, ensuring compatibility with corresponding electronic components and systems.

Power Supplies (V): 3

This power management IC can handle up to 3 power supplies, enabling efficient power distribution and management within the electronic device, enhancing overall system performance.

No. of Terminals: 5

With 5 terminals, this power management IC provides sufficient connectivity options for various components, enabling effective interface and communication within the system.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The small outline, low profile, and shrink pitch package style of this power management IC allows for compact and space-saving designs, ideal for applications with limited board real estate.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this power management IC offers excellent thermal performance and reliability, making it suitable for demanding environments and high-temperature applications.

Minimum Operating Temperature: -40 °C

This power management IC can operate reliably even in extremely low temperatures, providing versatility and reliability in various operating conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish enhances the durability and reliability of the IC's terminal connections, ensuring robust electrical performance and resistance to corrosion.

Terminal Position: DUAL

With dual terminal positions, this power management IC provides flexibility and compatibility in different circuit layouts, accommodating various system design requirements.

Maximum Seated Height: 1.45 mm

The low maximum seated height of 1.45 mm allows for a compact design and facilitates efficient heat dissipation, contributing to improved system miniaturization and reliability.

Width (mm): 1.6 mm

With a width of 1.6 mm, this power management IC offers a compact form factor, enabling efficient use of space on the circuit board and facilitating system integration.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This power management IC serves as a dedicated power supply support circuit, offering reliable and stable power distribution, voltage regulation, and protection, ensuring proper functioning of the overall system.

Minimum Supply Voltage (Vsup): 1.6 V

The minimum supply voltage requirement of 1.6V ensures compatibility with low-voltage power sources, widening the range of potential applications for this power management IC.

Maximum Time At Peak Reflow Temperature (s): 30

This power management IC can withstand peak reflow temperatures for up to 30 seconds, providing robust solder joint integrity during manufacturing processes.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature of 260°C, this power management IC can endure high-temperature soldering processes, ensuring reliable and stable connections during assembly.

Length: 2.9 mm

Measuring only 2.9 mm in length, this power management IC offers a compact footprint, facilitating space-efficient integration into miniaturized electronic devices without compromising functionality.

Nominal Threshold Voltage (V): +2.64V

The nominal threshold voltage of +2.64V ensures precise and accurate detection of voltage levels, enabling appropriate actions and control within the system.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this power management IC meets the stringent requirements of the automotive industry, ensuring high performance, reliability, and durability in automotive environments.

Maximum Supply Current (Isup): 0.025 mA

With a low maximum supply current of 0.025 mA, this power management IC operates with low power consumption, contributing to energy efficiency and extended battery life in portable devices.

No. of Channels: 1

Offering a single channel, this power management IC provides efficient power delivery and management for a specific component or subsystem, simplifying design and optimizing system performance.

Terminal Form: GULL WING

The gull wing terminal form enhances the ease of soldering and PCB assembly processes, ensuring reliable electrical connections and reducing the risk of solder joint failures.

Terminal Pitch: 0.95 mm

With a terminal pitch of 0.95 mm, this power management IC fits standard PCB layouts and facilitates proper alignment during assembly, contributing to efficient manufacturing processes.

Moisture Sensitivity Level (MSL): 1

Featuring a moisture sensitivity level of 1, this power management IC demonstrates excellent resistance to moisture-related issues, ensuring long-term reliability and performance even in humid conditions.

Maximum Supply Voltage (Vsup): 6 V

With a maximum supply voltage of 6V, this power management IC can handle higher voltage inputs, making it suitable for applications that require a wide range of power sources.

Technical Specifications

Power Management ICs TPS3838L30QDBVRQ1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.64V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.45 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.025 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

1.6 V

Nominal Supply Voltage (Vsup):

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.64V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.6 mm

Trade Compliance

TPS3838L30QDBVRQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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