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TPS3837J25DBVR

Texas Instruments

TPS3837J25DBVR by Texas Instruments

TPS3837J25DBVR by Texas Instruments is a Power Management IC with a nominal voltage of 1.8V, suitable for industrial applications. It features a small outline package style, dual terminal position, and operates in temperatures ranging from -40 to 85°C. This CMOS technology IC supports power supply circuits efficiently.

Median Price

$2.153

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 12,147 parts In-Stock

1+ parts

$1.826

100+ parts

$1.508

1k+ parts

$0.815

10k+ parts

-

12,147

$1.826

$1.508

$0.815

-

DigiKey

USA . 3,000 parts In-Stock

1+ parts

$2.480

100+ parts

$1.511

1k+ parts

$1.336

10k+ parts

$1.260

3,000

$2.480

$1.511

$1.336

$1.260

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 30 parts In-Stock

1+ parts

$1.033

100+ parts

-

1k+ parts

-

10k+ parts

-

30

$1.033

-

-

-

Digiode

USA . 1,923 parts In-Stock

1+ parts

$1.735

100+ parts

-

1k+ parts

-

10k+ parts

-

1,923

$1.735

-

-

-

Vyrian

USA . 12,096 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,096

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 2,299 parts In-Stock

1+ parts

$1.033

100+ parts

-

1k+ parts

-

10k+ parts

-

2,299

$1.033

-

-

-

Continental Prestige Electronics

USA . 1,179 parts In-Stock

1+ parts

$1.033

100+ parts

-

1k+ parts

-

10k+ parts

$1.012

1,179

$1.033

-

-

$1.012

Netroflash

USA . 50 parts In-Stock

1+ parts

$1.033

100+ parts

-

1k+ parts

$0.981

10k+ parts

$0.960

50

$1.033

-

$0.981

$0.960

Ampacity Inc.

Singapore . 12,015 parts In-Stock

1+ parts

$1.550

100+ parts

-

1k+ parts

-

10k+ parts

-

12,015

$1.550

-

-

-

Corphita

USA . 4,359 parts In-Stock

1+ parts

$1.643

100+ parts

-

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-

10k+ parts

-

4,359

$1.643

-

-

-

AZTECH Wire

Italy . 1,045 parts In-Stock

1+ parts

$20.230

100+ parts

-

1k+ parts

-

10k+ parts

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1,045

$20.230

-

-

-

Parana Technologies

USA . 425 parts In-Stock

1+ parts

$20.819

100+ parts

-

1k+ parts

$20.983

10k+ parts

-

425

$20.819

-

$20.983

-

DigiPath Technology Company

USA . 1,640 parts In-Stock

1+ parts

$22.924

100+ parts

$21.090

1k+ parts

-

10k+ parts

-

1,640

$22.924

$21.090

-

-

ChromeModa Solutions

Germany . 3,407 parts In-Stock

1+ parts

$23.392

100+ parts

$19.181

1k+ parts

-

10k+ parts

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3,407

$23.392

$19.181

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-

IDEA Electronic Components Group

UK . 2,036 parts In-Stock

1+ parts

$23.392

100+ parts

$22.222

1k+ parts

$21.053

10k+ parts

-

2,036

$23.392

$22.222

$21.053

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Perfect Parts

USA . 13,440 parts In-Stock

1+ parts

-

100+ parts

-

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13,440

-

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Assy Fe

Spain . 1,000 parts In-Stock

1+ parts

-

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1,000

-

-

-

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Kepictronics

USA . 200 parts In-Stock

1+ parts

-

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200

-

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-

-

Overview

Elevate your power management capabilities with the TPS3837J25DBVR by Texas Instruments. Crafted with precision and expertise, this Power Management IC offers unmatched reliability and performance. Ideal for a wide range of applications, this product ensures seamless power supply support circuitry. Experience the quality and innovation that only Texas Instruments can deliver, and enhance your systems with the TPS3837J25DBVR. Unlock efficiency and convenience with this top-tier solution that surpasses expectations.

Feature Benefit Bullets

Package Body Material PLASTIC/EPOXY

Plastic/Epoxy material provides durability and cost-effectiveness for the product.

Surface Mount YES

Surface mount capability allows for easy integration and installation on circuit boards.

Nominal Supply Voltage (Vsup) 1.8 V

Efficient power management at a low nominal supply voltage of 1.8V.

No. of Terminals 5

Simplified connectivity with just 5 terminals for easy circuit design and implementation.

Maximum Operating Temperature 85 °C

High maximum operating temperature of 85°C ensures reliability in various environmental conditions.

Minimum Operating Temperature -40 °C

Wide operating temperature range from -40°C to 85°C for versatility in usage.

Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish for superior electrical conductivity and corrosion resistance.

Maximum Seated Height 1.45 mm

Compact design with low maximum seated height for space-saving installation.

Width (mm) 1.6 mm

Small width of 1.6mm for efficient PCB layout and space utilization.

Other IC type POWER SUPPLY SUPPORT CIRCUIT

Specifically designed for power supply support, ensuring optimal performance in power management applications.

Peak Reflow Temperature °C 260

High peak reflow temperature of 260°C for reliable soldering during manufacturing process.

Temperature Grade INDUSTRIAL

Industrial-grade temperature range and performance for rugged and demanding operating environments.

Technology CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form GULL WING

Gull-wing terminal form for easy handling and reliable solder joints during installation.

Terminal Pitch 0.95 mm

Fine terminal pitch of 0.95mm for precise and compact connections on the PCB.

Maximum Supply Voltage (Vsup) 6 V

Supports a maximum supply voltage of 6V, providing flexibility in power input options.

Technical Specifications

Power Management ICs TPS3837J25DBVR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.25V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

1.6 V

Nominal Supply Voltage (Vsup):

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.6 mm

Trade Compliance

TPS3837J25DBVR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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