Loading...

TPS3831G18DQNT

Texas Instruments

TPS3831G18DQNT by Texas Instruments

TPS3831G18DQNT by Texas Instruments is a Power Management IC with a voltage range of 1.2V to 6V, ideal for industrial applications. It features a small outline package style, dual terminal position, and operates in temperatures from -40°C to 85°C. With surface mount capability and low supply current of 0.0005mA, it's suitable for power supply support circuits.

Median Price

$0.496

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 214 parts In-Stock

1+ parts

$0.238

100+ parts

$0.227

1k+ parts

-

10k+ parts

-

214

$0.238

$0.227

-

-

Chip1Stop

Japan . 250 parts In-Stock

1+ parts

$0.365

100+ parts

-

1k+ parts

-

10k+ parts

-

250

$0.365

-

-

-

Texas Instruments

USA . 221,165 parts In-Stock

1+ parts

$0.946

100+ parts

$0.728

1k+ parts

$0.383

10k+ parts

-

221,165

$0.946

$0.728

$0.383

-

Mouser Electronics

USA . 200 parts In-Stock

1+ parts

$1.180

100+ parts

$0.677

1k+ parts

$0.584

10k+ parts

$0.533

200

$1.180

$0.677

$0.584

$0.533

Verical

USA . 214 parts In-Stock

1+ parts

-

100+ parts

$0.496

1k+ parts

-

10k+ parts

-

214

-

$0.496

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,551 parts In-Stock

1+ parts

$0.410

100+ parts

-

1k+ parts

-

10k+ parts

-

3,551

$0.410

-

-

-

Vyrian

USA . 1,172 parts In-Stock

1+ parts

$0.432

100+ parts

-

1k+ parts

-

10k+ parts

-

1,172

$0.432

-

-

-

TME

Poland . 250 parts In-Stock

1+ parts

$1.050

100+ parts

-

1k+ parts

-

10k+ parts

-

250

$1.050

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,290 parts In-Stock

1+ parts

$0.389

100+ parts

-

1k+ parts

-

10k+ parts

-

3,290

$0.389

-

-

-

Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$13.288

100+ parts

$12.092

1k+ parts

$10.896

10k+ parts

-

600

$13.288

$12.092

$10.896

-

Parana Technologies

USA . 1,010 parts In-Stock

1+ parts

$16.951

100+ parts

-

1k+ parts

$17.182

10k+ parts

-

1,010

$16.951

-

$17.182

-

DigiPath Technology Company

USA . 571 parts In-Stock

1+ parts

$18.665

100+ parts

$17.172

1k+ parts

-

10k+ parts

-

571

$18.665

$17.172

-

-

ChromeModa Solutions

Germany . 5,887 parts In-Stock

1+ parts

$19.046

100+ parts

$15.618

1k+ parts

-

10k+ parts

-

5,887

$19.046

$15.618

-

-

IDEA Electronic Components Group

UK . 1,851 parts In-Stock

1+ parts

$19.046

100+ parts

$18.094

1k+ parts

$17.141

10k+ parts

-

1,851

$19.046

$18.094

$17.141

-

Perfect Parts

USA . 3,920 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,920

-

-

-

-

Overview

Unlock the power of efficient and reliable power management with the TPS3831G18DQNT by Texas Instruments. Crafted with precision and expertise, this Power Management IC offers unparalleled quality and performance. Ideal for a wide range of applications, this product provides customers with the value and benefits they need to optimize their systems. Trust in Texas Instruments to deliver cutting-edge solutions that exceed expectations. Experience the difference with the TPS3831G18DQNT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and cost-effective.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards.

Package Shape: SQUARE

The square shape of the package provides a compact design, saving space on the circuit board.

Power Supplies (V): 1.2/6

The power supply range of 1.2V to 6V makes the product versatile and compatible with a wide range of applications.

No. of Terminals: 4

Having 4 terminals allows for sufficient connections and functionality in the power management IC.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile package style enhance the thermal management and overall performance of the IC.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for the IC to function effectively in cold environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel/palladium/gold finish on the terminals enhances conductivity and durability, ensuring a longer lifespan of the product.

Terminal Position: DUAL

Having a dual terminal position allows for flexibility in connection options, making it easier to integrate the IC into different circuit designs.

Maximum Seated Height: 0.4 mm

The maximum seated height of 0.4 mm ensures a low profile design, suitable for compact electronic devices.

Width (mm): 1 mm

The narrow width of 1 mm saves space on the circuit board and allows for compact device design.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit, this IC provides efficient power management and support for various electronic devices.

Minimum Supply Voltage (Vsup): 0.9 V

The low minimum supply voltage of 0.9V allows for efficient power management in low voltage applications.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures proper soldering and reliability during manufacturing processes.

Length: 1 mm

The short length of 1 mm contributes to the compact design of the IC, ideal for space-constrained applications.

Nominal Threshold Voltage (V): +1.67V

The nominal threshold voltage of +1.67V ensures stable operation and accurate voltage regulation in the power management IC.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the IC can withstand and operate efficiently in demanding industrial environments.

Maximum Supply Current (Isup): 0.0005 mA

The low maximum supply current of 0.0005 mA helps in reducing power consumption and enhancing energy efficiency.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the soldering process and provides a more environmentally friendly design.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm allows for closer spacing of terminals, increasing connectivity options in a limited space.

Maximum Supply Voltage (Vsup): 6.5 V

The high maximum supply voltage of 6.5V provides compatibility with a wide range of power sources, making the IC versatile in different applications.

Technical Specifications

Power Management ICs TPS3831G18DQNT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 1.67V

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-N4

JESD-609 Code:

e4

Length:

1 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC4,.04,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/6

Qualification:

Not Qualified

Maximum Seated Height:

.4 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0005 mA

Maximum Supply Voltage (Vsup):

6.5 V

Minimum Supply Voltage (Vsup):

.9 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+1.67V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1 mm

Trade Compliance

TPS3831G18DQNT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20