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TPS3828-50DBVRG4

Texas Instruments

TPS3828-50DBVRG4 by Texas Instruments

TPS3828-50DBVRG4 by Texas Instruments is a Power Management IC with 5V nominal voltage, 1.45mm max seated height, and -40 to 85°C operating temperature range. Ideal for industrial applications requiring power supply management circuits in compact spaces due to its small outline package style and low profile design.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 25,090 parts In-Stock

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Vyrian

USA . 6,586 parts In-Stock

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6,586

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Euro-Tech

UK . 5,000 parts In-Stock

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5,000

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Digiode

USA . 4,932 parts In-Stock

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Nova Conductors

Japan . 870 parts In-Stock

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870

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One Stop Electronics

USA . 834 parts In-Stock

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$0.500

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834

$0.500

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Semicontronic

India . 696 parts In-Stock

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$0.500

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$0.488

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$0.485

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696

$0.500

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$0.485

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Ampacity Inc.

Singapore . 625 parts In-Stock

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$0.500

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625

$0.500

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AZTECH Wire

Italy . 247 parts In-Stock

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$7.887

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$7.887

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Parana Technologies

USA . 1,014 parts In-Stock

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$10.037

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$10.595

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$10.037

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Corohmni

South Africa . 453 parts In-Stock

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$10.448

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DigiPath Technology Company

USA . 1,373 parts In-Stock

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$11.051

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$10.167

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ChromeModa Solutions

Germany . 5,061 parts In-Stock

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$11.277

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$9.247

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IDEA Electronic Components Group

UK . 1,432 parts In-Stock

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$11.277

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$10.713

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$10.149

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Corphita

USA . 4,036 parts In-Stock

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Argo Parts USA

USA . 3,743 parts In-Stock

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Microchip USA

USA . 1,288 parts In-Stock

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Continental Prestige Electronics

USA . 1,172 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Overview

Discover the power of the TPS3828-50DBVRG4 by Texas Instruments, a top-notch Power Management IC that offers unparalleled quality and reliability. Manufactured by industry leader Texas Instruments, this product is perfect for a wide range of applications in power supply management circuits. With a compact design and high-tech features, the TPS3828-50DBVRG4 ensures efficient performance and precise voltage regulation, making it a valuable asset for customers looking for superior power management solutions. Upgrade your devices with the TPS3828-50DBVRG4 and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the Power Management IC, ensuring longevity and reliability.

Surface Mount: YES

Facilitates easy and efficient assembly onto circuit boards, saving time and labor during manufacturing.

Nominal Supply Voltage (Vsup): 5 V

Compatible with common power supply systems, making integration and operation straightforward.

No. of Terminals: 5

Simplifies connection to other components in the system, reducing complexity and potential points of failure.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high-temperature environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Offers a wide operating temperature range, making the Power Management IC versatile in various environmental conditions.

Technology: CMOS

Utilizes Complementary Metal-Oxide-Semiconductor technology for low power consumption and high efficiency, ideal for power management applications.

Technical Specifications

Power Management ICs TPS3828-50DBVRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 4.55V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.025 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.1 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.55V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.6 mm

Trade Compliance

TPS3828-50DBVRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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