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TPS3825-50DBVT

Texas Instruments

TPS3825-50DBVT by Texas Instruments

TPS3825-50DBVT by Texas Instruments is a Power Management IC with 3.3V Nominal Voltage, 1.1/5.5V Power Supplies, and -40 to 85°C Operating Temperature Range. It is used in industrial applications for power supply support circuits due to its small outline package and low profile design.

Median Price

$0.742

Lifecycle Status

Suppliers In-Stock

26

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 1 parts In-Stock

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$0.646

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Arrow

USA . 8 parts In-Stock

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$0.674

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$0.674

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Rochester

USA . 296 parts In-Stock

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$0.810

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$0.790

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$0.780

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296

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DigiKey

USA . 126 parts In-Stock

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$1.600

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$0.948

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Mouser Electronics

USA . 715 parts In-Stock

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$0.856

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$0.723

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$0.723

Verical

USA . 128 parts In-Stock

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$0.674

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Distributors (In-Stock)

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Digiode

USA . 1,921 parts In-Stock

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$0.614

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$0.614

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Component Electronics Inc.

Canada . 53 parts In-Stock

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$1.150

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$0.870

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$0.750

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DF Sales Co.

USA . 25 parts In-Stock

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$2.312

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DF Sales Co.

USA . 25 parts In-Stock

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Chip Stock

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Vyrian

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Sensible Micro Corp

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Prism Electronics

USA . 261 parts In-Stock

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ComSIT Distribution GmbH

Germany . 250 parts In-Stock

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Goldney Electronics S.L.

Spain . 200 parts In-Stock

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LWI Electronics Inc

India . 150 parts In-Stock

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Zilex Electronics Inc.

Canada . 140 parts In-Stock

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Sea View Technologies

USA . 115 parts In-Stock

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Bristol Electronics

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Nova Conductors

Japan . 29 parts In-Stock

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Speed Components Ltd

Israel . 8 parts In-Stock

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EMSNET

USA . 6 parts In-Stock

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Semtec, LLC

USA . 1 parts In-Stock

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PC Components Company LLC

USA . 1 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 79 parts In-Stock

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$0.550

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$0.550

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Semicontronic

India . 71 parts In-Stock

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$0.550

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$0.536

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$0.534

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Corphita

USA . 4,504 parts In-Stock

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$0.581

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Advanced Electronics

New Zealand . 20 parts In-Stock

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$12.430

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$11.809

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Parana Technologies

USA . 1,441 parts In-Stock

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$20.945

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$21.151

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Corohmni

South Africa . 6 parts In-Stock

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$21.503

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DigiPath Technology Company

USA . 3 parts In-Stock

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$23.063

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$21.218

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ChromeModa Solutions

Germany . 1,138 parts In-Stock

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$23.534

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$19.298

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IDEA Electronic Components Group

UK . 419 parts In-Stock

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$23.534

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$22.357

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$21.181

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419

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Microchip USA

USA . 1,796 parts In-Stock

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$52.670

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$51.920

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$51.540

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$51.160

1,796

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$51.160

Perfect Parts

USA . 13,723 parts In-Stock

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Lixinc

USA . 11,187 parts In-Stock

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Continental Prestige Electronics

USA . 4,750 parts In-Stock

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Argo Parts USA

USA . 811 parts In-Stock

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Authorized Procurement Solutions

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Bastille Electronics

Australia . 69 parts In-Stock

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Overview

Unlock the power of efficient power management with the TPS3825-50DBVT by Texas Instruments. Designed with high-quality materials and advanced technology, this Power Management IC offers reliability and performance like no other. Ideal for a wide range of applications, this product provides customers with the value, benefits, and advantages they need to stay ahead in today's competitive market. Trust Texas Instruments to deliver cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is known for its durability and reliability, making the product suitable for long-term use in various applications.

Surface Mount: YES

Being surface mountable enables easy and efficient integration onto circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage (Vsup): 3.3 V

Operating at a common supply voltage ensures compatibility with a wide range of systems and devices.

Maximum Operating Temperature: 85 °C

With a high operating temperature range, the product can withstand harsh environmental conditions and extended use without performance degradation.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This combination of finish materials provides excellent conductivity, corrosion resistance, and solderability for reliable connections.

Minimum Supply Voltage (Vsup): 1.1 V

With a low minimum supply voltage, the product is efficient in power consumption and suitable for low-power applications.

Temperature Grade: INDUSTRIAL

Designed for industrial environments, the product meets high standards of temperature resistance, reliability, and performance under demanding conditions.

Maximum Supply Current (Isup): 0.025 mA

With a low maximum supply current, the product is energy-efficient and helps reduce power consumption in overall system operation.

Technical Specifications

Power Management ICs TPS3825-50DBVT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 4.55V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1/5.5

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.025 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.1 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.55V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.6 mm

Trade Compliance

TPS3825-50DBVT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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