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TPS3707-33DGNG4

Texas Instruments

TPS3707-33DGNG4 by Texas Instruments

TPS3707-33DGNG4 by Texas Instruments is a Power Management IC with 3.3V nominal voltage, 8 terminals, and 85°C max operating temp. Ideal for industrial applications requiring power supply support circuits in compact spaces due to its small outline package style and dual terminal position.

Median Price

$2.850

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 6 parts In-Stock

1+ parts

$2.850

100+ parts

$2.090

1k+ parts

$1.780

10k+ parts

$1.330

6

$2.850

$2.090

$1.780

$1.330

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$1.470

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$1.470

-

-

-

Digiode

USA . 2,695 parts In-Stock

1+ parts

$2.708

100+ parts

-

1k+ parts

-

10k+ parts

-

2,695

$2.708

-

-

-

Vyrian

USA . 4,581 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,581

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 3,690 parts In-Stock

1+ parts

$1.470

100+ parts

-

1k+ parts

-

10k+ parts

-

3,690

$1.470

-

-

-

Continental Prestige Electronics

USA . 3,375 parts In-Stock

1+ parts

$1.470

100+ parts

-

1k+ parts

-

10k+ parts

$1.441

3,375

$1.470

-

-

$1.441

Netroflash

USA . 500 parts In-Stock

1+ parts

$1.470

100+ parts

$1.441

1k+ parts

-

10k+ parts

-

500

$1.470

$1.441

-

-

Ampacity Inc.

Singapore . 6 parts In-Stock

1+ parts

$2.420

100+ parts

-

1k+ parts

-

10k+ parts

-

6

$2.420

-

-

-

Corphita

USA . 265 parts In-Stock

1+ parts

$2.565

100+ parts

-

1k+ parts

-

10k+ parts

-

265

$2.565

-

-

-

Parana Technologies

USA . 1,001 parts In-Stock

1+ parts

$3.873

100+ parts

-

1k+ parts

$4.355

10k+ parts

-

1,001

$3.873

-

$4.355

-

ChromeModa Solutions

Germany . 6,303 parts In-Stock

1+ parts

$4.352

100+ parts

$3.569

1k+ parts

-

10k+ parts

-

6,303

$4.352

$3.569

-

-

IDEA Electronic Components Group

UK . 1,841 parts In-Stock

1+ parts

$4.352

100+ parts

-

1k+ parts

$3.917

10k+ parts

-

1,841

$4.352

-

$3.917

-

AZTECH Wire

Italy . 735 parts In-Stock

1+ parts

$11.321

100+ parts

-

1k+ parts

-

10k+ parts

-

735

$11.321

-

-

-

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$17.144

100+ parts

$15.601

1k+ parts

$14.058

10k+ parts

-

500

$17.144

$15.601

$14.058

-

Microchip USA

USA . 2,649 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,649

-

-

-

-

DigiPath Technology Company

USA . 1,708 parts In-Stock

1+ parts

-

100+ parts

$3.924

1k+ parts

-

10k+ parts

-

1,708

-

$3.924

-

-

Perfect Parts

USA . 515 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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515

-

-

-

-

Overview

Enhance your power management solutions with the TPS3707-33DGNG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Power Management ICs that guarantee reliability and efficiency. This small outline, thin profile IC offers a nominal supply voltage of 3.3V, making it ideal for a wide range of applications. From industrial settings to consumer electronics, this versatile component ensures optimal performance and power efficiency. Trust Texas Instruments to provide innovative solutions that meet your power management needs effortlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in power management ICs for its durability and resistance to heat and moisture, making it a reliable choice for various applications.

Nominal Supply Voltage (Vsup): 3.3 V

The nominal supply voltage of 3.3V is a common standard in many electronic devices, ensuring compatibility and efficient power management.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this power management IC can withstand harsh environmental conditions and maintain stable performance.

Technology: CMOS

Using CMOS technology ensures low power consumption and high efficiency, which is essential in power management applications for prolonging battery life and minimizing heat dissipation.

Technical Specifications

Power Management ICs TPS3707-33DGNG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.93V; POWER ON RESET GENERATOR; MANUAL RESET INPUT

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

1.07 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.05 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.93V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3 mm

Trade Compliance

TPS3707-33DGNG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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